Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system

• US 6,304,424 B1
• Filed: 05/20/1999
• Issued: 10/16/2001
• Est. Priority Date: 04/03/1998
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Mett, Richard, Salimian, Siamak
• Primary Examiner(s): Ballato, Josie
• Assistant Examiner(s): RIOS CUEVAS, ROBERTO JOSE
• Application Number:
  US09/315,710
• Time in Patent Office: 880 Days
• Field of Search: 361/113, 361/234, 333/167, 333/172, 279/128
• US Class Current: 361/234
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

A method and apparatus for retaining a substrate, such as a semiconductor wafer, upon an electrostatic chuck within a semiconductor wafer processing system. Specifically, the apparatus contains high voltage, DC power supply that is capable of both sourcing and sinking current at any polarity of output voltage level. This power supply is coupled to at least one electrode of an electrostatic chuck. Consequently, the power supply can be used to dynamically control the chucking voltage to apply a negative potential difference between said wafer and chuck.

Claims

1. Apparatus for retaining a substrate, such as a semiconductor wafer, in a semiconductor processing system comprising:

an electrostatic chuck having an electrode embedded beneath a substrate support surface;

a power supply, coupled to said electrode of said electrostatic chuck, for applying a chucking voltage to said electrode, where said substrate is retained by a negative potential difference between said substrate and said electrostatic chuck while said substrate is exposed to a plasma for purposes of plasma processing the substrate.

2. The apparatus of claim 1 further comprising a detector for generating a chucking indicator value that represents said negative potential difference between the substrate and the electrostatic chuck.

3. The apparatus of claim 1 further comprising a current monitoring circuit for generating a chucking indicator value that represents a leakage current flowing from the power supply into the electrostatic chuck.

4. The apparatus of claim 2 further comprising an RF power supply, coupled to a cathode electrode, for supplying RF energy to a plasma in said vacuum chamber, where said detector is coupled to said cathode electrode to detect a voltage on said cathode electrode as the chucking indicator value.

5. The apparatus of claim 4 wherein said indicator value is a peak-to-peak or peak voltage of an RF voltage coupled from the RF power supply to the cathode electrode.

6. The apparatus of claim 1 wherein said variable chucking voltage has a voltage range which is positive and negative.

7. The apparatus of claim 1 wherein said power supply can both source and sink current at any output voltage.

8. The apparatus of claim 1 wherein said power supply further comprises a resistive RF filter.

9. The apparatus of claim 8 wherein said resistive RF filter comprises a plurality of resistor and capacitor pairs connected in series.

10. A method for retaining a substrate, such as a semiconductor wafer, comprising the steps of:

supporting the substrate on a substrate support surface of an electrostatic chuck containing a chucking electrode; and

applying a variable DC chucking voltage to said chucking electrode to electrostatically retain the substrate by creating a negative potential difference between the substrate and the electrostatic chuck while said substrate is exposed to a plasma for purposes of plasma processing the substrate.

11. The method of claim 10 comprising the steps of:

further measuring an indicia of optimal chucking; and

controlling said variable DC chucking voltage in response to said indicia.

12. The method of claim 11 wherein said indicia is a potential difference between an electrode and the substrate and said chucking voltage is controlled to achieve a constant potential difference.

13. The method of claim 12 wherein said potential difference is indicia of a chucking force between the substrate and the electrostatic chuck.

14. The method of claim 11 wherein said indicia is a leakage current value flowing into the electrostatic chuck and said chucking voltage is controlled to achieve a constant leakage current.

15. The method of claim 12 wherein said potential difference is estimated by measuring a peak-to-peak or peak RF voltage applied to a cathode electrode within said process chamber by an RF supply.