Power module

• US 6,304,448 B1
• Filed: 09/07/2000
• Issued: 10/16/2001
• Est. Priority Date: 03/03/2000
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Takanashi, Ken, Nakajima, Dai, Fukada, Masakazu
• Primary Examiner(s): Tolin, Gerald
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/657,236
• Time in Patent Office: 404 Days
• Field of Search: 361/600, 361/679, 361/686, 361/687, 361/689, 361/701-712, 361/714-723, 361/816, 361/735-738, 361/750-752, 361/683, 361/753, 257/696, 257/706, 257/713, 257/723, 257/724, 257/796, 257/728, 257/762, 257/764, 257/770, 174/16.3, 174/52.1, 174/52.2, 174/50.51, 174/50.52, 174/35.MS, 174/50.54, 174/58, 174/35.R, 165/80.3, 165/80.6, 165/185, 165/104.21, 165/104.33, 165/104.34, 251/712-718, 251/706-708, 251/746, 251/747, 251/668, 251/684, 251/796, 428/64, 428/65, 428/195, 428/522, 293/900.3, 295/21, 295/05, 295/57, 318/139, 318/494, 318/504, 318/432-434, 364/424.01, 307/9.1, 307/101, 307/147, 307/58, 307/45, 307/82
• US Class Current: 361/700
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface of a heat sink (3) fixed to a support plate (2). A DC capacitor (16) is fixed to a bottom face of the heat sink (3) by adhesion. A control substrate (11) having a control IC (13) mounted thereon is fixed to the support plate (2). Moreover, a plurality of electrodes (10), a DC side electrode and refrigerant inlet-outlet (9) and a control connector (15) are provided on the support plate (2). A case (1) is fixed to a peripheral portion of the support plate (2), and surrounds the insulating substrate (5), the control substrate (11), the heat sink (3) and the DC capacitor 16 together with the support plate (2). Both the case (1) and the support plate (2) have conducting property.

Claims

1. A power module comprising:

an insulating substrate having a main surface on which a power semiconductor device is mounted;

a control substrate on which a control IC for controlling said power semiconductor device is mounted;

a conductive support plate to which said insulating substrate and said control substrate are directly fixed; and

a conductive case fixed to a peripheral portion of said support plate for surrounding said insulating substrate and said control substrate together with said support plate.

2. The power module according to claim 1, further comprising a heat sink provided in said case and kept in contact with a back face of said insulating substrate which is opposite to said main surface,

said support plate including:

a refrigerant inlet-outlet coupled to said heat sink;

an electrode electrically connected to said power semiconductor device; and

a control connector electrically connected to said control IC,

all of them being provided through said support plate.

3. The power module according to claim 2, wherein said power semiconductor device is a voltage-source inverter,

said power module further comprising a DC capacitor provided in contact with said heat sink opposite to said insulating substrate in said case.

4. The power module according to claim 3, wherein said DC capacitor has P and N electrodes making a pair, and

said refrigerant inlet-outlet is connected as a DC side electrode and refrigerant inlet-outlet to said P and N electrodes.

5. The power module according to claim 2, wherein said refrigerant inlet-outlet, said electrode and said control connector are bonded to said support plate with a room temperature setting adhesive.

6. The power module according to claim 1, further comprising a shield plate provided between said insulating substrate and said control substrate in said case.

7. The power module according to claim 1, wherein said case and said support plate are bonded to each other with sealing property kept therein.

8. The power module according to claim 7, wherein said case and said support plate are bonded to each other by seam welding.

9. The power module according to claim 7, wherein said case and said support plate are bonded to each other by adhesion.

10. The power module according to claim 9, wherein said case and said support plate are bonded with a conductive adhesive.

11. The power module according to claim 7, wherein an internal space constituted by said case and said support plate is filled with an inactive material having insulating property.

12. The power module according to claim 11, wherein said material functions as a refrigerant,

said power module further comprising a fan provided in said case for circulating said material in said case.

13. The power module according to claim 1, wherein said case is constituted by a laminated film in which a plastic thin film is formed on a metal foil.