Data card, process for manufacturing a data card and apparatus for manufacturing a data card

• US 6,305,609 B1
• Filed: 07/27/1998
• Issued: 10/23/2001
• Est. Priority Date: 01/26/1996
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Melzer, Roland, Houdeau, Detlef
• Primary Examiner(s): Frech, Karl D.
• Assistant Examiner(s): St. Cyr, Daniel
• Application Number:
  US09/123,082
• Time in Patent Office: 1,184 Days
• Field of Search: 235/487, 235/488, 235/492, 235/380, 174/52.2, 295/92, 298/83, 298/46, 156/298, 156/300, 156/311
• US Class Current: 235/487
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2310/08 by wave energy or particle radiation
• CPC Class Codes: B32B 2310/0806 using electromagnetic radiation
• CPC Class Codes: B32B 2310/0831 using UV radiation
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/226 Laminating sheets, panels or inserts between two continuous plastic layers
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: Y10T 156/1093 with covering of discrete laminae with additional lamina
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture

Abstract

A data card includes a card body having at least one card top layer and at least one card bottom layer. The outer dimensions of the top and bottom card layers correspond to one another, and a module element is fitted in between the card top layer and card bottom layer. The module element has an integrated electronic circuit for processing and/or storing personal data. A levelling compensating layer has a levelling material and is disposed or formed between the module element and the card top layer and/or the card bottom layer for filling existing cavities in the module element or between the module element and the card top layer and/or card bottom layer. The levelling compensating layer also fills or levels existing protruding elevations on a surface of the module element.

Claims

1. A data card, comprising:

a card body having an upper card layer and a lower card layer with outer dimensions corresponding to one another;

a module element having a surface and an integrated electronic circuit for processing and storing personal data, said module element disposed between said lower card layer and said upper card layer; and

a level compensating layer including a levelling material disposed between said module element and at least one of said card layers, said levelling material applied as a substance having one of a liquid and a virtually liquid consistency and subsequently cured, said compensating layer filling in cavities existing between said module element and at least one of said card layers, and said compensating layer filling in cavities between at least one of said card layers and protruding elevations on said surface of said module element;

wherein said levelling material and a material of at least one of said upper card layer and said lower card layer are adapted dilathermally to each other.

2. The data card according to claim 1, wherein said levelling material includes a coating material cured by light radiation with a wavelength, said at least one top card layer and said at least one bottom card layer have regions covering said module element and at least one of said regions is produced from a material selected from the group consisting of a transparent material and a material at least translucent to the light radiation.

3. The data card according to claim 2, wherein said coating material is cured by ultraviolet light radiation.

4. The data card according to claim 1, wherein said levelling material includes a ultraviolet-curing epoxy with cationic post-curability.

5. The data card according to claim 1, wherein at least one of said card layers includes a thermoplastic material.

6. The data card according to claim 5, wherein said thermoplastic material is selected from the group consisting of polyvinylchloride, polycarbonate, polypropylene, acrylonitrile-butadiene-styrene and polyamide.

7. The data card according to claim 1, wherein said levelling material includes at least one of a flexibilizing additive and a thickening additive.

8. The data card according to claim 1, including a carrier layer disposed between said card layers for supporting said module element.

9. The data card according to claim 8, wherein said carrier layer includes a thermoplastic material.

10. The data card according to claim 9, wherein said thermoplastic material is selected from the group consisting of polyvinylchloride, polycarbonate, polypropylene, acrylonitrile-butadiene-styrene and polyamide.

11. The data card according to claim 1, wherein said module element has an integrated coupling element.

12. The data card according to claim 11, wherein said integrated coupling element is an induction coil.

13. The data card according to claim 1, wherein at least one of said card layers is formed with a recess for receiving at least part of said module element, and said integrated electronic circuit is completely covered in an upper direction by said upper card layer and is completely covered in a lower direction by said lower card layer.

14. A process for manufacturing a data card, which comprises:

manufacturing a module element having an integrated electronic circuit for processing and storing personal data and a surface as a separate, independent component;

producing at least one top card layer and at least one bottom card layer;

joining together the at least one top card layer, the module element and the at least one bottom card layer to form a card body;

forming a level compensating layer between the module element and at least one of the card layers for filling existing cavities in at least one of the module element and between the module element and at least one of the card layers, and filling in any existing protruding elevations on the surface of the module element with the compensating element; and

carrying out the forming step as the top card layer and the bottom card layer are being joined together by;

using a levelling material in the compensating layer;

applying the levelling material in one of a liquid and a virtually liquid consistency; and

subsequently, curing, the levelling material.

15. The process according to claim 14, which comprises:

including a coating material in the levelling material;

curing the coating material with light radiation having a wavelength; and

producing at least one of the card layers from a material selected from the group consisting of a transparent material and a material at least translucent to the light radiation.

16. The process according to claim 15, which comprises performing the curing step with ultraviolet light radiation.

17. The process according to claim 14, which comprises adding a ultraviolet-curing epoxy with cationic post-curability to the levelling material.

18. The process according to claim 14, which comprises dilathermally adapting the levelling material and a material of at least one of the card layers to each other.

19. The process according to claim 14, which comprises producing at least one of the card layers with a thermoplastic material.

20. The process according to claim 19, which comprises selecting the thermoplastic material from the group consisting of polyvinylchloride, polycarbonate, polypropylene, acrylonitrile-butadiene-styrene and polyamide.

21. The process according to claim 14, which comprises adding at least one of a flexibilizing additive and a thickening additive to the levelling material.

22. The process according to claim 14, which comprises disposing a carrier layer between the card layers for supporting the module element.

23. The process according to claim 22, which comprises producing the carrier layer with a thermoplastic material.

24. The process according to claim 23, which comprises selecting the thermoplastic material from the group consisting of polyvinylchloride, polycarbonate, polypropylene, acrylonitrile-butadiene-styrene and polyamide.

25. The process according to claim 14, which comprises forming a recess in at least one of the card layers for receiving at least part of the module element.

26. The process according to claim 14, which comprises manufacturing the module element with an integrated coupling element.

27. The data card according to claim 26, which comprises manufacturing the integrated coupling element as an induction coil.