High density optoelectronic transceiver module

• US 6,305,848 B1
• Filed: 06/19/2000
• Issued: 10/23/2001
• Est. Priority Date: 06/19/2000
• Status: Expired due to Term

• Current Assignee: Sumitomo Electric Device Innovations, U.S.A., Inc. (Sumitomo Corporation)
• Original Assignee: Corona Optical Systems, Inc. (Emcore Corporation)
• Inventors: Gregory, Bryan R.
• Primary Examiner(s): Lee, John D.
• Application Number:
  US09/595,671
• Time in Patent Office: 491 Days
• Field of Search: 385/53, 385/88-94, 385/134, 385/135
• US Class Current: 385/53
• CPC Class Codes: G02B 6/3882 using rods, pins or balls to align a pair of ferrule ends
• CPC Class Codes: G02B 6/3897 Connectors fixed to housings, casing, frames or circuit boards G02B6/44528 takes precedence
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

A high-density blindmate optoelectronic module is provided. The high-density module is adapted to mount on a removable printed circuit board which is configured to be inserted into a printed circuit board support rack located within a chassis based network element. The high-density module is configured to blindmate with a multi-fiber optical connector mounted within the chassis based network element. The high-density blindmate optoelectronic module is formed of a transceiver mounting block which supports a plurality of connectorized optical sub-assemblies. Each connectorized optical sub-assembly includes a plurality of optical transmitters, optical receivers, or a combination of optical transmitters and optical receivers. The optical transmitters and/or receivers define optical axes that extend through a first side of connectorized optical sub-assemblies. The high-density blindmate optoelectronic module includes circuitry for driving the optical transmitters and processing optical signals received by the optical receivers. An electrical interface is provided for transferring signals between the transceiver module and the removable printed circuit board.

Claims

1. A high-density blindmate optoelectronic module adapted to mount on a printed circuit board and blindmate with a multi-fiber optical connector, the high density blindmate optoelectronic module comprising:

a transceiver mounting block;

a plurality of connectorized optical sub-assemblies mounted within said transceiver mounting block, each connectorized optical sub-assembly having a first side and a plurality of at least one of optical transmitters and optical receivers, said optical transmitters and receivers defining optical axes extending through the first side of said connectorized optical sub-assemblies;

circuitry for driving the optical transmitters and processing optical signals received by said optical receivers; and

an electrical interface for transferring signals between the transceiver module and the printed circuit board.

2. The high-density blindmate optoelectronic module of claim 1 further comprising a front surface of said transceiver mounting block, and a coarse alignment member extending from said front surface of said transceiver mounting block configured to interact with the multi-fiber optical connector to facilitate blindmating of said transceiver module with said connector receptacle.

3. The high-density blindmate optoelectronic module of claim 2 further comprising at least one fine alignment member extending from the first side of one of said connectorized optical sub-assemblies, said fine alignment member configured to interact with said multi-fiber optical connector to precisely align the multiple optical fibers supported within said multi-fiber optical connector with the optical axes defined by the optical transmitters and receivers housed within said connectorized optical sub-assemblies.

4. The high-density blindmate optoelectronic module of claim 3 wherein said at least one fine alignment member comprises a pair of fine alignment pins extending from the first side of each of said connectorized optical sub-assemblies.

5. The high-density blindmate optoelectronic module of claim 1 further comprising a front surface of said transceiver mounting block, and an alignment bore formed within said front surface and adapted to receive an alignment member associated with said multi-fiber optical connector.

6. The high-density blindmate optoelectronic module of claim 5 further comprising at least one fine alignment bore formed within said first side of one of said connectorized optical sub-assemblies adapted to receive a fine alignment member associated with said multi-fiber optical connector.

7. The high-density blindmate optoelectronic module of claim 1 further comprising a plurality of daughter cards, at least one daughter card associated with each of said connectorized optical sub assemblies, wherein said circuitry for driving said transmitters and processing signals received by said receivers is formed on said daughter cards.

8. The high-density blindmate optoelectronic module of claim 7 wherein said electrical interface comprises a plurality of contact pins extending from said daughter cards, said contact pins being arranged to be received by contact structures formed on said mother board.

9. The high-density blindmate optoelectronic module of claim 7 wherein said connectorized optical sub-assemblies have a second side, said module further comprising a plurality of electrical leads extending from the second side of each connectorized optical sub-assembly, the electrical leads being electrically connected with said plurality of at least one of optical transmitters and optical receivers mounted within said connectorized optical sub-assemblies.

10. The high-density blindmate optoelectronic module of claim 9 wherein said electrical leads are soldered to contact pads formed on said daughter cards, said soldered connection securing said connectorized optical sub-assemblies to said daughter cards.

11. The high density blindmate optoelectronic module of claim 1 wherein said optical axes are substantially parallel to said mother board and arranged in a planar array substantially perpendicular to said mother board.

12. A system for providing a blindmate optical interface between an optical backplane mounted within a chassis based network element and a mother board removably connected within said chassis based network element, said system comprising:

a fiber-optic connector mounted on said backplane, said connector including at least first and second multi-fiber support ferrules, each ferrule having a plurality of optical fibers mounted therein, said fibers terminating at a front surface of said first and second multi-fiber support ferrules and extending into said backplane;

a high-density blindmate optoelectronic module adapted to be mounted on and electrically connected to said mother board, said high-density blindmate optoelectronic module having at least first and second connectorized optical sub-assemblies mounted in close proximity with one another within said module, said connectorized optical sub-assemblies having front surfaces;

a plurality of at least one of optical transmitters and optical receivers mounted within said connectorized optical sub-assemblies, said plurality of at least one of optical transmitters and receivers defining a plurality of optical axes extending through the front surfaces of said connectorized optical sub-assemblies and arranged in a plane extending perpendicular to a surface of said mother board;

a coarse alignment member associated with one of said high-density blindmate optoelectronic module and said fiber-optic connector, and a coarse alignment receiving surface associated with the other of said high-density blindmate optoelectronic module and said fiber-optic connector;

a fine alignment member associated with one of said connectorized optical sub assemblies and said multi-fiber support ferrules and a fine alignment receiving surface associated with the other of said connectorized optical sub-assemblies and said multi-fiber support ferrules;

the high-density blindmate optoelectronic module being located on said removable mother board in a position whereby, as said mother board is inserted into said chassis based network element, said coarse alignment member engages said coarse alignment surface, guiding said high-density blindmate optoelectronic module toward said fiber-optic connector, and after said coarse alignment member engages said coarse alignment surface said fine alignment members engage said fine alignment surfaces, said fine alignment members and said fine alignment surfaces acting to align said optical fibers with said optical axes.

13. The system of claim 12 further comprising a plurality of contact pins extending from said high-density blindmate optoelectronic module and a plurality of contact vias formed in said mother board, said contact vias being arranged to receive said contact pins and be electrically connected therewith.

14. The system of claim 13 wherein said contact pins have a diameter slightly larger than said contact vias, and said high-density blindmate optoelectronic module is secured to said mother board by a press fit connection between said contact pins and said vias.

15. The system of claim 13 wherein said contact pins are soldered within said contact vias.

16. The system of claim 12 further comprising a plurality of daughter cards, each daughter card associated with one of said connectorized optical sub-assemblies and supporting circuitry for driving said plurality of at least one of optical transmitters and optical receivers, each individual daughter card having circuitry specifically adapted for driving a particular combination of transmitters and receivers defined by the particular combination of transmitters and receivers mounted within the individual connectorized optical sub-assemblies associated with each individual daughter card.

17. The system of claim 12 wherein said coarse alignment member comprises first and second pins protruding from one of said high-density blindmate optoelectronic module and said fiber-optic connector, and said coarse alignment surface comprises first and second alignment bores formed in the other of said high-density blindmate optoelectronic module and said fiber-optic connector.

18. The system of claim 12 wherein said fine alignment members comprise first and second alignment pins protruding from one of said connectorized optical sub-assemblies and said multi-fiber support ferrules, and said fine alignment receiving surfaces comprise fine alignment bores formed in the other of said connectorized optical sub-assemblies and said multi-fiber support ferrules.

19. The system of claim 12 further comprising means for allowing one of said high-density blindmate optoelectronic module and said fiber-optic connector to move a small amount vertically, horizontally and transversely, to allow said coarse and fine alignment members to engage the respective coarse and fine alignment receiving surfaces and to allow the interaction of said coarse and fine alignment members to interact with said coarse and fine alignment receiving surfaces to properly align the optical fibers within the multi-fiber support ferrules with the optical axes defined by the optical transmitters and optical receivers housed within said connectorized optical sub-assemblies.