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Method of forming a flip chip assembly, and a flip chip assembly formed by the method

  • US 6,306,683 B1
  • Filed: 03/16/2000
  • Issued: 10/23/2001
  • Est. Priority Date: 09/23/1997
  • Status: Expired due to Fees
First Claim
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1. A method for forming a flip-chip on board assembly, comprising the steps of:

  • applying a plasma to chemically modify a surface of an insulation layer of an integrated circuit (IC) chip;

    joining the IC chip to a chip carrier via a plurality of solder bumps electrically connecting a plurality of contact pads on the IC chip to corresponding contacts on the chip carrier, such that a space is formed between the surface of the insulation layer and a surface of the chip carrier; and

    applying an underfill encapsulant material to fill the space, wherein the step of applying the plasma is performed substantially without roughening the surface of the insulation layer.

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