Yagi antenna having matching coaxial cable and driven element impedances

• US 6,307,524 B1
• Filed: 01/18/2000
• Issued: 10/23/2001
• Est. Priority Date: 01/18/2000
• Status: Expired due to Fees

• Current Assignee: Core Technology, Inc.
• Original Assignee: Core Technology, Inc.
• Inventors: Britain, Kent
• Primary Examiner(s): Wimer, Michael C.
• Application Number:
  US09/484,055
• Time in Patent Office: 644 Days
• Field of Search: H01/Q.928, H01/Q 1.928, H01/Q 1.930, 343/795, 343/818, 343/819, 343/829, 343/830
• US Class Current: 343/795
• CPC Class Codes: H01Q 19/30 the primary active element being centre-fed and substantially straight, e.g. Yagi antenna

Abstract

A printed Yagi antenna of the present invention has a circuit board, a driven element having an impedance Ωd and being printed on the circuit board, a director element printed on the circuit board, a reflector element printed on the circuit board, a microstrip transmission line, and a coaxial cable having and impedance Ωc. The coaxial cable feeds the driven element via the miscrostrip transmission line and Ωc is approximately equal to Ωd. Further, the spacing between the reflector element, the driven element, and director elements are chosen so that an optimum balance is achieved between directional gain and performance sensitivity. The printed Yagi antenna has a partial folded driven element having a J shape which is grounded at the mid-point of the longest portion of the element. The configuration allows for a coaxial cable to be attached directly to the microstrip transmission line without the use of a matching network or balun.

Claims

1. A Yagi antenna, comprising:

an insulative circuit board having a proximal end and a distal end;

a J-shaped driven element having an impedance Ω

d and being printed on a top surface of the circuit board, wherein the J-shaped driven element comprises a short portion, a long portion that is twice as long as the short portion, and a connecting portion connecting the short portion and the long portion, the short and long portions being parallel to each other, and wherein a mid-point of the long portion of the J-shaped driven element is grounded;

one or more director elements printed on a top surface of the circuit board at a position located between the distal end of the circuit board and the J-shaped driven element;

a reflector element printed on a bottom surface of the circuit board at a position located between the proximal end of the circuit board and the J-shaped driven element;

a microstrip transmission line printed on the circuit board, the microstrip transmission line having a proximal end, a distal end, and an impedance Ω

w, the distal end of the microstrip transmission line being electrically connected to the J-shaped driven element; and

a cable having an impedance Ω

c, the cable being electrically connected to the proximal end of the microstrip transmission line, wherein the impedance Ω

c matches the impedances Ω

d and Ω

w.

2. The Yagi antenna according to claim 1, wherein the microstrip transmission line includes a signal line printed on the top surface of the circuit board and a ground plane printed on the bottom surface of the circuit board, the mid-point of the long portion of the J-shaped driven element is grounded to the ground plane via an interconnection between the top surface and the bottom surface of the circuit board, and the ground plane is attached to a second ground pad printed on the bottom surface of the circuit board.

3. The Yagi antenna according to claim 2, wherein the reflector element is grounded at its mid-point by the ground plane.

4. The Yagi antenna according to claim 3, wherein a first ground pad is printed on the top surface of the circuit board for attaching the cable.

5. The Yagi antenna according to claim 4, wherein the cable is a coaxial cable and includes a signal wire, an inner insulator, a ground mesh, and an outer insulator, the inner insulator surrounding the signal wire, the ground mesh surrounding the inner insulator, and the outer insulator surrounding the ground mesh, wherein the ground mesh is soldered to the first ground pad and the signal wire of the coaxial cable is soldered to the signal line at the proximal end of the transmission line.

6. The Yagi antenna according to claim 5, wherein the second ground pad is electrically connected to the first ground pad of the top surface of the circuit board via interconnections.

7. The Yagi antenna according to claim 6, wherein the interconnections are plated through holes.

8. A radio receiver system, comprising:

a radio receiver having an input and an output;

an insulative circuit board having a proximal end and a distal end;

a J-shaped driven element having an impedance Ω

d and being printed on a top surface of the circuit board, wherein the J-shaped driven element comprises a short portion, a long portion that is twice as long as the short portion, and a connecting portion connecting the short portion and the long portion, the short and long portions being parallel to each other, and wherein a mid-point of the long portion of the J-shaped driven element is grounded;

one or more director elements printed on the top surface of the circuit board at a position located between the distal end of the circuit board and the J-shaped driven element;

a reflector element printed on the circuit board at a position located between the proximal end of the circuit board and the driven element;

a microstrip transmission line printed on the circuit board, the microstrip transmission line having a proximal end, a distal end, and an impedance Ω

w, the distal end of the microstrip transmission line being electrically connected to the J-shaped driven element; and

a cable having a first end, a second end, and an impedance Ω

c, wherein the first end is electrically connected to the proximal end of the microstrip transmission line, and the second end is electrically connected to the input of the receiver, and wherein the impedance Ω

c matches the impedances Ω

d and Ω

w.

9. The radio receiver system according to claim 8, wherein the microstrip transmission line includes a signal line printed on the top surface of the circuit board and a ground plane printed on the bottom surface of the circuit board, the mid-point of the long portion of the J-shaped driven element is grounded to the ground plane via an interconnection between the top surface and the bottom surface of the circuit board, and the ground plane is attached to a second ground pad printed on the bottom surface of the circuit board.

10. The radio receiver system according to claim 9, wherein the reflector element is grounded at its mid-point by the ground plane.

11. The radio receiver system according to claim 10, wherein a first ground pad is printed on the top surface of the circuit board for attaching the cable.

12. The radio receiver system according to claim 11, wherein the cable is a coaxial cable and includes a signal wire, an inner insulator, a ground mesh, and an outer insulator, the inner insulator surrounding the signal wire, the ground mesh surrounding the inner insulator, and the outer insulator surrounding the ground mesh, wherein the ground mesh is soldered to the first ground pad and the signal wire of the coaxial cable is soldered to the signal line at the proximal end of the transmission line.

13. The radio receiver system according to claim 12, wherein the second ground pad is electrically connected to the first ground pad of the top surface of the circuit board via interconnections.

14. The radio receiver system according to claim 13, wherein the interconnections are plated through holes.

15. A transmitter system, comprising:

a transmitter having an input and an output;

an insulative circuit board having a proximal end and a distal end;

a J-shaped driven element having an impedance Ω

d and being printed on a top surface of the circuit board, wherein the J-shaped driven element comprises a short portion, a long portion that is twice as long as the short portion, and a connecting portion connecting the short portion and the long portion, the short and long portions being parallel to each other, and wherein a mid-point of the long portion of the J-shaped driven element is grounded;

one or more director elements printed on the top surface of the circuit board at a position located between the distal end of the circuit board and the driven element;

a reflector element printed on a bottom surface of the circuit board at a position located between the proximal end of the circuit board and the J-shaped driven element;

a microstrip transmission line printed on the circuit board, the microstrip transmission line having a proximal end, a distal end, and an impedance Ω

w, the distal end of the microstrip transmission line being electrically connected to the J-shaped driven element; and

a cable having a first end, a second end, and an impedance Ω

c, wherein the first end is electrically connected to the proximal end of the microstrip transmission line, and the second end is electrically connected to the output of the transmitter, and wherein the impedance Ω

c matches the impedances Ω

d and Ω

w.

16. The transmitter system according to claim 15, wherein the transmission line includes a signal line printed on the top surface of the circuit board and a ground plane printed on the bottom surface of the circuit board, the mid-point of the long portion of the J-shaped driven element is grounded to the ground plane via an interconnection between the top surface and the bottom surface of the circuit board, and the ground plane is attached to a second ground pad printed on the bottom surface of the circuit board.

17. The transmitter system according to claim 16, wherein the reflector element is grounded at its mid-point by the ground plane.

18. The transmitter system according to claim 17, wherein a first ground pad is printed on the top surface of the circuit board for attaching the cable.

19. The transmitter system according to claim 18, wherein the cable is a coaxial cable and includes a signal wire, an inner insulator, a ground mesh, and an outer insulator, the inner insulator surrounding the signal wire, the ground mesh surrounding the inner insulator, and the outer insulator surrounding the ground mesh, wherein the ground mesh is soldered to the first ground pad and the signal wire of the coaxial cable is soldered to the signal line at the proximal end of the transmission line.

20. The transmitter system according to claim 19, wherein the second ground pad is electrically connected to the first ground pad of the top surface of the circuit board via interconnections.

21. The transmitter system according to claim 20, wherein the interconnections are plated through holes.