Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die
First Claim
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1. A die-leadframe combination comprising:
- a die having first and second principal surfaces;
a first leadframe having a first tie bar connected to a portion of said first leadframe that exerts a pressure in a first direction against the first principal surface of the die;
a second leadframe having a second tie bar connected to a portion of said second leadframe that exerts a pressure in a second direction opposite to the first direction against the second principal surface of the die;
wherein the first and second tie bars are offset with respect to each other such that the pressure of the first and second leadframes against the die in the first and second directions, respectively, creates a torque on the die.
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Abstract
A leadframe for making an electric connection to a semiconductor die contains a plurality of notches which correspond to the edges of the die. Shorts are thereby prevented between the leadframe and electrical elements near the edge of the die, even when the leadframe is bent in the direction of the die to make a surface mount package. Alternatively or additionally, the leads in the leadframe may contain moats which prevent the epoxy or solder used to attach the leadframe to a die from spreading outward and thereby creating electrical shorts with other leads.
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Citations
13 Claims
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1. A die-leadframe combination comprising:
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a die having first and second principal surfaces;
a first leadframe having a first tie bar connected to a portion of said first leadframe that exerts a pressure in a first direction against the first principal surface of the die;
a second leadframe having a second tie bar connected to a portion of said second leadframe that exerts a pressure in a second direction opposite to the first direction against the second principal surface of the die;
wherein the first and second tie bars are offset with respect to each other such that the pressure of the first and second leadframes against the die in the first and second directions, respectively, creates a torque on the die.
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- 2. A method of mounting first and second leadframes to first and second surfaces of a semiconductor die such that substantially no torque is applied to the die during the mounting.
- 9. A semiconductor die package comprising a semiconductor die and a leadframe attached to a surface of the die, a plurality of leads extending from the surface beyond an edge of the die, a notch being formed in at least one lead at a location where the at least one lead passes over the edge of the die, the notch being formed on a side of the at least one lead facing the die.
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13. A leadframe for use in forming an electrical connection with a semiconductor die in a package, the leadframe comprising a lead, the lead having a plurality of notches such that the leadframe is capable of being used with dice of more than one size, one of the notches being positioned over an edge of each of the dice.
Specification