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Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die

  • US 6,307,755 B1
  • Filed: 05/27/1999
  • Issued: 10/23/2001
  • Est. Priority Date: 05/27/1999
  • Status: Expired due to Term
First Claim
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1. A die-leadframe combination comprising:

  • a die having first and second principal surfaces;

    a first leadframe having a first tie bar connected to a portion of said first leadframe that exerts a pressure in a first direction against the first principal surface of the die;

    a second leadframe having a second tie bar connected to a portion of said second leadframe that exerts a pressure in a second direction opposite to the first direction against the second principal surface of the die;

    wherein the first and second tie bars are offset with respect to each other such that the pressure of the first and second leadframes against the die in the first and second directions, respectively, creates a torque on the die.

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