Micropump with a built-in intermediate part

• US 6,309,189 B1
• Filed: 06/28/1999
• Issued: 10/30/2001
• Est. Priority Date: 12/31/1996
• Status: Expired due to Term

• Current Assignee: Debiotech S.A.
• Original Assignee: Westonbridge International Limited
• Inventors: Maillefer, Didier, Rey-Mermet, Gilles, Van Lintel, Harald
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): ROBINSON, DANIEL LEON
• Application Number:
  US09/331,952
• Time in Patent Office: 855 Days
• Field of Search: 417/413.3, 417/413.1, 417/412, 417/321, 417/322, 417/410.2, 417/410.1
• US Class Current: 417/413.3
• CPC Class Codes: F04B 43/046 with piezoelectric drive

Abstract

A micropump including at least one main plate (1), at least one upper plate (2), and a middle plate (3) arranged between the other two plates (1, 2) and forming a pumping chamber (4) that is connected with at least one inlet of the micropump and at least one outlet of the micropump. The pumping chamber comprises a movable wall (5) machined into the middle plate (3); the upper plate is equipped with at least one opening (12) linking a cavity (8) with at least one portion of the movable wall (5). Actuation devices (6, 7, 13) attached to the free surface of the upper plate (2) are used to shift said movable wall (5) in order to bring about a periodic variation in the volume of the pumping chamber (4). According to the invention, the actuating devices (6, 7, 13) are formed by an actuating plate (7) of a material which can be machined so as to define a movable area (11) and said cavity (8). A (sic) intermediate part (13), formed from the upper plate (2), is fastened to the actuating plate (7) (sic) so as to establish contact with the movable wall (5).

Claims

1. A micropump for pumping and delivering a fluid, said micropump comprising at least one inlet, at least one outlet, one base plate, one upper plate having an initial thickness and provided with a first free face, an intermediate plate interposed between said base plate and said upper plate, and a pumping chamber between said base plate and said intermediate plate, said intermediate plate being made of a machinable material, said micropump further comprising at least one fluid inlet control member for connecting said pumping chamber with said inlet of the micropump, and at least one fluid outlet control member for connecting the pumping chamber with said outlet of the micropump, said intermediate plate comprising a movable wall machined in said intermediate plate in face of said pumping chamber and between said one fluid outlet control member and said one fluid outlet control member, said movable wall being adapted to move in two opposite directions during suction or delivery of said fluid in the pumping chamber, the upper plate being provided with one annular through hole facing at least one portion of said movable wall and an intermediate, said intermediate part and said upper plate being formed as one piece and being surrounded by said annular through hole, said micropump further comprising actuation means fixed on said first free face of said upper plate in face of said pumping chamber and being able to displace said movable wall in order to bring about a periodic variation of the volume of said pumping chamber, wherein the actuation means consists essentially of a single actuating plate, a single piezoelectric actuation device surmounting said actuating plate and said intermediate part, said actuating plate having an initial thickness, being made of a machinable material and being fixed to said first free face of said upper plate, said actuating place having a movable area defining with said upper plate an annular cavity and a central portion having said initial thickness of said actuating plate, said central portion of said actuating plate being surrounded by said annular cavity, said intermediate part facing and being fixed to said central portion of said actuating plate, said intermediate part having said initial thickness of said upper plate and being able to be in contact with said movable wall.

2. The micropump according to claim 1, wherein said intermediate part is fixed to said mobile wall.

3. The micropump according to claim 1, wherein said intermediate plate and said actuating plate define a tight space.

4. The micropump according to claim 3, wherein a partial vacuum is established within said tight space.

5. The micropump according to claim 2, wherein a conduit links said tight space with the outside of said micropump.

6. The micropump according to claim 1, wherein said micropump further comprises means for limiting displacement of said movable wall.

7. The micropump according to claim 1, wherein said actuation means are composed in particular of a piezoelectric device.

8. The micropump according to claim 1, wherein said base and upper plates are constituted of glass such as pyrex.

9. The micropump according to claim 1, wherein said intermediate and actuating plates are constituted of a metal or a semiconductor.

10. The micropump according to claim 1, wherein said actuation means, said intermediate part and said movable wall are centered about a same axis.

11. A process for manufacturing a micropump comprising the following steps:

providing an actuating plate with an initial thickness and a first free face;

machining said actuating plate from the opposite side of said free face to create an annular cavity facing a movable area of said actuating plate with a reduced thickness, said annular cavity surrounding a central portion of said actuating plate with said initial thickness, said actuating plate having a peripheral portion with said initial thickness and surrounding said cavity of said actuating plate;

providing an upper plate with a second free face and an initial thickness;

fastening the opposite side of said first free face of said actuating plate, by said central portion and said peripheral portion of said actuating plate, to said second free face of said upper plate so as to form an upper plate and actuating plate assembly;

machining the upper plate to create an annular through hole facing at least an inner portion of said cavity to create an intermediate part from the upper plate having said initial thickness, the intermediate part being surrounded by said annular through hole and facing said central portion of said actuating plate;

providing an intermediate plate/base plate assembly comprising a base plate and an intermediate plate superposed on said base plate;

fastening said upper plate and actuating plate assembly to said intermediate plate/base plate assembly by linking a face of said upper plate which is opposite to said actuating plate to a face of the intermediate plate which is opposite to said base plate; and

fastening a piezoelectric actuation device to said first free face of the actuating plate.

12. The process according to claim 11, wherein the step of machining the linking opening in the upper plate comprises the step of electro-erosive machining.

22. The process according to claim 11, wherein the plates are fixed by anodic welding.

23. The process according to claim 11, wherein, during fixation of the upper plate/actuating plate assembly to the intermediate plate/base plate assembly, the intermediate part is fixed on a movable wall.

25. The process according to claim 11, wherein a partial vacuum is established within the tight space.

13. A process for manufacturing a micropump comprising the following steps:

providing an actuating plate with an initial thickness and a first free face;

machining said actuating plate from the opposite side of said first free face so as to create an annular cavity facing a movable area of said actuating plate with a reduced thickness, said cavity surrounding a central portion of said actuating plate with said initial thickness, said actuating plate having a peripheral portion with said initial thickness and surrounding said annular cavity of said actuating plate;

providing an upper plate with a second free face and an initial thickness;

machining the upper plate only within a first part of the thickness of said upper plate to create a partial annular through hole within only a first part of the thickness of said upper plate, said partial annular through hole facing at least an inner portion of said annular cavity, to create an intermediate part from the upper plate having said initial thickness, the intermediate part being surrounded by said partial annular through hole and facing said central portion of said actuating plate;

fastening the opposite side of said first free face of said actuating plate, by said central portion and said peripheral portion of said actuating plate, to said second free face of said upper plate so as to form an upper plate and actuating plate assembly;

machining said upper plate within a second part of the thickness of said upper plate to terminate creation of said annular through hole and of said intermediate part;

providing an intermediate plate/base plate assembly comprising a base plate and an intermediate plate superposed on said base plate;

fastening said upper plate and actuating plate assembly to said intermediate plate/base plate assembly by linking a face of said upper plate which is opposite to said actuating plate to a face of the intermediate plate which is opposite to said base plate; and

fastening a piezoelectric actuation device to said first free face of the actuating plate.

14. The process according to claim 13, wherein the step of machining the linking opening in the upper plate comprises the step of electro-erosive machining.

15. The process according to claim 13, wherein the step of machining the upper plate for termination of the creation of the linking opening and of the intermediate part comprises the step of chemical attack of the upper plate.

16. The process according to claim 13, wherein one or more metal layers are deposited on a face of the upper plate before starting the creation of the linking opening and of the intermediate part, the metal layer or layers being removed after having created the linking opening and the intermediate part.

17. The process according to claim 16, wherein the metal layer or layers are deposited on the face of the upper plate undergoing the partial creation of the linking opening and of the intermediate part.

18. The process according to claim 16, wherein the metal layer or layers are deposited on a face of the upper plate machined during termination of the creation of the linking opening and of the intermediate part.

19. The process according to claim 16, wherein a layer of chromium followed by a layer of copper are deposited.

21. The process according to claim 18, wherein the holding layer is selected from a group consisting of a polymer and a metal.

24. The process according to claim 21, wherein a conduit is machined, linking a tight space defined by the intermediate plate and the actuating plate with an outside of the micropump.

20. The process for manufacturing a micropump comprising the following steps:

providing an upper plate with a first free face and an initial thickness;

depositing a holding layer on a face of said upper plate opposite to said first free face;

machining the upper plate from said first free face to create an annular through hole facing at least an inner portion of an annular cavity to create an intermediate part of the upper plate having said initial thickness, the intermediate part being surrounded by said annular through hole and facing said central portion of said actuating plate, the holding layer also being able to be partially machined from said first free face of said upper plate;

providing an actuating plate with an initial thickness and a second free face;

machining said actuating plate from the opposite side of said second free face so as to create the annular cavity facing a movable area of said actuating plate with a reduced thickness, said annular cavity surrounding a central portion of said actuating plate with said initial thickness, said actuating plate having a peripheral portion with said initial thickness, said actuating plate having a peripheral portion with said initial thickness and surrounding said annular cavity of said actuating plate;

fastening the opposite side of said second free face of said actuating plate, by said central portion and said peripheral portion of said actuating plate, to said first free face of said upper plate so as to form an upper plate and actuating plate assembly;

removing the holding layer;

providing an intermediate plate/base plate assembly comprising a base plate and an intermediate plate superposed on said base plate;

fastening said upper plate and actuating plate assembly to said intermediate plate/base plate assembly by linking a face of said upper plate which is opposite to said actuating plate to a face of the intermediate plate which is opposite to said base plate; and

fastening a piezoelectric actuation device to said second free face of the actuating plate.