Use of glass laminate as a substrate in semiconductor devices

• US 6,309,901 B1
• Filed: 04/18/2000
• Issued: 10/30/2001
• Est. Priority Date: 10/24/1997
• Status: Expired due to Term

• Current Assignee: InnoLux Corporation
• Original Assignee: Agfa-Gevaert N.V.
• Inventors: Verlinden, Bartholomeus, Tahon, Jean-Pierre, Goedeweeck, Rudi
• Primary Examiner(s): Elms, Richard
• Assistant Examiner(s): PYONIN, ADAM
• Application Number:
  US09/529,658
• Time in Patent Office: 560 Days
• Field of Search: 438/584, 438/22, 438/25, 438/29, 428/332, 428/426, 427/108, 427/65
• US Class Current: 438/29
• CPC Class Codes: B32B 17/10018 comprising only one glass sheet
• CPC Class Codes: B32B 17/10119 having a composition deviating from the basic composition of soda-lime glass, e.g. borosilicate
• CPC Class Codes: B32B 17/10165 Functional features of the laminated safety glass or glazing
• CPC Class Codes: B32B 17/10174 Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• CPC Class Codes: B32B 17/1033 Laminated safety glass or glazing containing temporary protective coatings or layers
• CPC Class Codes: B32B 17/10541 comprising a light source or a light guide
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2367/00 Polyesters, e.g. PET, i.e. polyethylene terephthalate
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 27/32 comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G02B 1/10 Optical coatings produced by application to, or surface treatment of, optical elements G02B1/08 takes precedence
• CPC Class Codes: G02B 1/116 including electrically conducting layers
• CPC Class Codes: G02B 1/16 having an anti-static effect, e.g. electrically conducting coatings
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/133302 Rigid substrates, e.g. inorganic substrates
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133502 : Antiglare, refractive index matching layers
• CPC Class Codes: G03C 1/76 : Photosensitive materials characterised by the base or auxiliary layers
• CPC Class Codes: G03C 1/7614 : Cover layers; Backing layers; Base or auxiliary layers characterised by means for lubricating, for rendering anti-abrasive or for preventing adhesion characterised by the inert particulate additive G03C1/95
• CPC Class Codes: G03C 1/795 : the base being of macromolecular substances G03C1/775 takes precedence
• CPC Class Codes: G03C 1/7954 : Polyesters
• CPC Class Codes: G03C 1/853 : Inorganic compounds, e.g. metals
• CPC Class Codes: G03C 1/91 : characterised by subbing layers or subbing means
• CPC Class Codes: G03C 8/06 : Silver salt diffusion transfer
• CPC Class Codes: G06K 19/02 : characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• CPC Class Codes: G06K 19/041 : Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/06009 : with optically detectable marking G06K19/063, G06K19/08 take precedence
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/562 : Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 23/564 : Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 23/573 : using passive means
• CPC Class Codes: H01L 23/585 : comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H10K 30/00 : Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation integrated devices or assemblies of multiple devices H10K39/00, H10K65/00; electrolytic light-sensitive devices H01G9/20
• CPC Class Codes: H10K 50/841 : Self-supporting sealing arrangements
• CPC Class Codes: H10K 77/10 : Substrates, e.g. flexible substrates
• CPC Class Codes: Y02E 10/549 : Organic PV cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A method for making a semiconductor device is disclosed which comprises the step of applying a functional layer on a substrate, characterized in that said substrate is a laminate which comprises a support and a glass layer, said glass layer having a thickness of less than 700 μm. The support is preferably a plastic foil. The laminate has the combined benefits of low weight and high strength and is therefore a suitable substrate for making flat panel displays such as liquid crystal displays, plasma displays, field emission displays or organic light-emitting polymer displays. Preferred examples of the functional layer are e.g. electroconductive layers, liquid crystal orientation layers, color filters, electroluminescent layers, passivation layers and phosphor layers.

Claims

1. Method for making a semiconductor device comprising the step of applying a functional layer on a substrate, optionally provided with an intermediate layer, wherein said substrate is a laminate which comprises a support and a glass layer, said glass layer having a thickness of less than 700 μ

m.

2. Method according to claim 1 wherein the functional layer is an electroconductive layer.

3. Method according to claim 1 wherein the functional layer is a colour filter.

4. Method according to claim 1 wherein the functional layer is a liquid crystal orientation layer.

5. Method according to claim 1 wherein the functional layer is a passivation layer.

6. Method according to claim 1 wherein the functional layer is a phosphor layer.

7. Method according to claim 1 wherein the functional layer is a dielectric protecting layer.

8. Method according to claim 1 wherein the functional layer is an electroluminescent layer.

9. Method according to claim 1 wherein the semiconductor device is a flat panel display.

10. Method according to claim 1 wherein the glass layer has a thickness of less than 500 μ

m.

11. Method according to claim 1 wherein the glass layer has a thickness of less than 300 μ

m.

12. Method according to claim 1 wherein the support consists essentially of poly(ethylene tereph-thalate), polycarbonate, polyethersulfone or cyclo-olefin copolymers.

13. Method according to claim 1 wherein the functional layer is applied on the glass side of the laminate.

14. Method according to claim 1 wherein the glass is borosilicate.

15. Method according to claim 1 wherein the functional layer is applied on the substrate by means of a web coating apparatus.