×

Fingerprint sensor chip

  • US 6,310,371 B1
  • Filed: 10/08/1999
  • Issued: 10/30/2001
  • Est. Priority Date: 10/08/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A fingerprint sensor chip formed on a semiconductor wafer, the semiconductor wafer comprising a first dielectric layer, the fingerprint sensor chip comprising:

  • a plurality of rectangular sensor areas arranged in a matrix format on the semiconductor wafer, each of the sensor areas being surrounded by electric conductors;

    a second dielectric layer covered on the sensor areas and the conductors, the surface of the second dielectric layer positioned above each of the sensor areas being formed as a protruding rectangular platform with a shallow trench surrounding the platform, the shallow trench being positioned above the conductors around the sensor area;

    a rectangular metal plate positioned on the top end of each of the rectangular platforms which is used as a sensor plate of the fingerprint sensor chip; and

    a protective layer positioned on the surface of the semiconductor wafer for covering and protecting each of the metal plates and the second dielectric layer.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×