Resistor array devices including switch contacts operated by microelectromechanical actuators and methods for fabricating the same

• US 6,310,419 B1
• Filed: 04/05/2000
• Issued: 10/30/2001
• Est. Priority Date: 04/05/2000
• Status: Expired due to Fees

• Current Assignee: Memscap Incorporated
• Original Assignee: Viavi Solutions, Inc. (Lumentum Holdings Inc.)
• Inventors: Wood, Robert L.
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US09/542,142
• Time in Patent Office: 573 Days
• Field of Search: 310/306, 310/307
• US Class Current: 310/306
• CPC Class Codes: H01G 5/18 due to change in inclination, e.g. by flexing, by spiral wrapping
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0063 having electrostatic latches, i.e. the activated position is kept by electrostatic forces other than the activation force
• CPC Class Codes: H01H 2061/006 Micromechanical thermal relay
• CPC Class Codes: H01H 61/00 Electrothermal relays thermal switches not operated by electrical input, thermal switches with anticipating electrical input H01H37/00; thermally-sensitive members H01H37/32

Abstract

Resistor networks, digital potentiometers and microelectromechanical structures that include a plurality of resistors selectable by a plurality of microelectromechanical actuators are provided. More particularly, a thermal relay type of actuator is provided as a switch which may selectively control which of the plurality of resistors is connected. In one particularly advantageous embodiment, the heater for the thermal relay and the plurality of resistors are formed from a common layer of the integrated circuit structure, such as a doped polysilicon layer, which may simplify the manufacturing process. Preferably, a thermal arched beam actuator is utilized in combination with film resistors to provide an integrated circuit device suitable for applications such as digital potentiometers.

Claims

1. An integrated circuit resistor network comprising:

a plurality of resistors;

a plurality of switches, each of the switches being electrically coupled in series with an associated one of the plurality of resistors;

a plurality of microelectromechanical actuators, each of the microelectromechanical actuators being coupled to one of the plurality of switches; and

a controller electrically coupled to the plurality of microelectromechanical actuators that selectively activates at least one of the plurality of microelectromechanical actuators to toggle the associated one of the switches coupled to the at least one of the plurality of microelectromechanical actuators; and

wherein the microelectromechanical actuators are thermal relays including a heater element comprising a region of a resistive material on an integrated circuit substrate and wherein the plurality of resistors are film resistors each comprising a region of the resistive material on the integrated circuit substrate.

2. A resistor network according to claim 1 further comprising a layer of resistive material on the integrated circuit substrate wherein the plurality of resistors comprise a first portion of the layer of resistive material and wherein the heater elements comprise a second portion of the layer of resistive material.

3. A resistor network according to claim 2 wherein the resistive material comprises polysilicon.

4. A resistor network according to claim 3 wherein the film resistors are thin film resistors and the resistive material is doped polysilicon.

5. A resistor network according to claim 4 wherein respective ones of the plurality of resistors have a resistance value stepped by a factor of two from another of the plurality of resistors.

6. A resistor network according to claim 5 wherein each of the plurality of resistors provides a set of associated resistance values stepped by factors of two from a base resistance value.

7. A resistor network according to claim 6 wherein the base resistance value is between about 20 ohms and about 300 ohms.

8. A resistor network according to claim 4 wherein each of the doped polysilicon film resistors comprises a number of resistor squares of a polysilicon sheet having a sheet resistance value (rho) so as to provide a desired resistance value.

9. A resistor network according to claim 8 wherein at least one of the plurality of resistors includes a plurality of matched polysilicon resistor elements.

27. A resistor network according to claim 1 wherein the plurality of resistors and the plurality of switches are coupled between first and second reference terminals.

10. An integrated circuit resistor network comprising:

an integrated circuit substrate;

a plurality of resistors on the integrated circuit substrate;

a plurality of switches on the integrated circuit substrate, each of the switches being electrically coupled in series with an associated one of the plurality of resistors;

a plurality of microelectromechanical actuators, each of the microelectromechanical actuators comprising spaced apart supports on the integrated circuit substrate and a beam that extends between the spaced apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced apart supports and each of the microelectromechanical actuators being coupled to one of the plurality of switches; and

a controller electrically coupled to the plurality of microelectromechanical actuators that selectively activates at least one of the plurality of microelectromechanical actuators to toggle the associated one of the switches coupled to the at least one of the plurality of microelectromechanical actuators.

11. A resistor network according to claim 10 wherein the integrated circuit substrate defines a reference plane and wherein the beam comprises an arched beam which extends between the spaced apart supports and which expands upon application of heat thereto for movement parallel to a reference plane defined by said integrated circuit substrate and wherein the thermal relays further comprise:

a heater disposed on the integrated circuit substrate so as to underlie said arched beam and to be spaced apart from said arched beam, said heater adapted to heat the ambient surrounding the arched beam which, in turn, heats the arched beam to cause further arching of the beam as a result of thermal expansion thereof, to thereby cause displacement of the arched beam parallel to the reference plane defined by said integrated circuit substrate.

12. A resistor network according to claim 11 wherein the controller is coupled to the heater of each of the thermal relays to initiate heating of the arched beams so as to activate the corresponding one of the plurality of microelectromechanical actuators.

13. A resistor network according to claim 12 wherein the controller outputs a select pulse that generates a current flow to activate the at least one of the plurality of microelectromechanical actuators and wherein the resistor network further comprises a latch circuit that maintains the activated at least one of the plurality of microelectromechanical actuators in an activated position.

14. A resistor network according to claim 13 wherein the latch circuit outputs an electrostatic holding voltage that maintains the activated at least one of the plurality of microelectromechanical actuators in the activated position.

15. A resistor network according to claim 14 wherein the latch circuit includes a capacitor associated with each of the plurality of microelectromechanical actuators and wherein the controller has a plurality of latch outputs each of which is electrically coupled to one of the capacitors that initiates charging of the associated one of the capacitors to thereby output the electrostatic holding voltage.

16. A resistor network according to claim 15 wherein the heater of each of the thermal relays comprises a region of a resistive material on an integrated circuit substrate and wherein the plurality of resistors are film resistors comprising a region of the resistive material on the integrated circuit substrate.

18. A digital potentiometer according to claim 16 further comprising a layer of resistive material on the integrated circuit substrate wherein the plurality of resistors comprise a first portion of the layer of resistive material and wherein the heater elements comprise a second portion of the layer of resistive material.

19. A digital potentiometer according to claim 18 wherein the control circuit is coupled to a selection input of the digital potentiometer that designates one of the plurality of microrelay switches to activate.

20. A digital potentiometer according to claim 19 wherein at least one of the microrelay switches further comprises:

a first contact electrically coupled to a second end of an associated one of the plurality of thin film resistors, the second end being opposite a first end of the associated one of the plurality of thin film resistors that is coupled to the first reference terminal;

a second contact electrically coupled to the second reference terminal;

a third contact having a first position contacting the first and second contact and a second position displaced from the first and second contact;

a thermal arched beam microelectromechanical actuator coupled to the third contact and having a first position in which the third contact is in its first position and a second position in which the third contact is in its second position; and

wherein the heater element heats the thermal arched beam to move it between its first and second positions.

21. A digital potentiometer according to claim 20 wherein the first position of the thermal arched beam microelectromechanical actuator is an activated position and further comprising an electrostatic latch circuit that latches activated ones of the plurality of thermal arched beam microelectromechanical actuators in the activated position and wherein the control circuit further comprises a latch control output coupled to the electrostatic latch circuit that designates one of the plurality of thermal arched beam microelectromechanical actuators to be latched.

17. A digital potentiometer integrated on an integrated circuit substrate comprising:

a plurality of film resistors on the integrated circuit substrate;

a plurality of microrelay switches on the integrated circuit substrated;

a respective resistor and switch being coupled between first and second reference terminals of the digital potentiometer; and

a control circuit that selectively activates one of the plurality of microrelay switches to provide a desired resistance between the first and second reference voltage pins of the digital potentiometer; and

wherein the microrelay switches are thermal relays including a heater element comprising a region of a resistive material on the integrated circuit substrate and wherein the plurality of film resistors each comprise a region of the resistive material on the integrated circuit substrate.

22. A microelectromechanical structure including a resistor array comprising:

an integrated circuit substrate;

a plurality of thermal actuators on the integrated circuit substrate; and

a resistive layer on the integrated circuit substrate defining a plurality of heaters, each of the heaters being associated with one of the plurality of thermal actuators and further defining a plurality of resistors of the resistor array, the plurality of resistors being electrically coupled to the thermal actuators.

23. A microelectromechanical structure according to claim 22 further comprising:

a conductive layer on the integrated circuit substrate defining anchors associated with the thermal actuators and further defining moving switch elements of the thermal actuators; and

a contact layer on the resistive layer and electrically connected to the resistive layer.

24. A microelectromechanical structure according to claim 23 further comprising a trench between the heater and the integrated circuit substrate that provides thermal isolation therebetween.

25. A microelectromechanical structure according to claim 23 wherein at least one of the moving switch elements comprises an arched beam that extends between a first and a second of the anchors and wherein the heater underlies and is spaced apart from the arched beam.

26. A microelectromechanical structure according to claim 22 wherein the resistive layer comprises polysilicon.