Modular architecture for semiconductor wafer fabrication equipment

• US 6,312,525 B1
• Filed: 07/08/1998
• Issued: 11/06/2001
• Est. Priority Date: 07/11/1997
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Bright, Nick, Mooring, Ben
• Primary Examiner(s): LUND, JEFFRIE ROBERT
• Application Number:
  US09/111,472
• Time in Patent Office: 1,217 Days
• Field of Search: 118/719, 204/298.25, 204/298.35, 414/937
• US Class Current: 118/719
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette

Abstract

A modular vacuum system may have vacuum chamber modules, power supply modules and control system modules. The vacuum chamber modules may be defined with a clear interface between them. There may be several interfaces on a transfer chamber module that provide connections to any process chamber module. The interfaces may provide common facilities and electrical connections to matching connections on the process chambers and may also provide some configurability with a removable optional facilities interface. The power supply modules may provide all of the power necessary for one corresponding chamber module and be built into cabinets for connecting together as a modular and scalable system. The modular control system may have objects that represent each chamber module in the vacuum system; and may have a system level that configures, initiates, distributes and controls the objects. Each of the objects may be made of a hierarchical set of software modules that represent the different functions and devices of the chamber modules.

Claims

1. A modular vacuum system for processing substrates, comprising:

a central transfer chamber module comprising;

a platform;

a central transfer chamber supported on the platform and adapted to be coupled with at least one chamber module; and

a robot disposed in the central transfer chamber for moving substrates through the system;

a facilities panel box disposed on the platform and adapted to be coupled to facility lines;

a plurality of interface panels supported on the platform, each interface panel adapted to be coupled to each chamber module; and

at least one delivery line, each delivery line supported on the platform and adapted to be coupled to the facilities panel box and to each interface panel.

2. The modular vacuum system of claim 1, further comprising one or more chamber modules coupled to the central transfer chamber module, each chamber module having a chamber controller and an interface connecting each of the chamber controllers to a central control module, whereby the modular vacuum system is reconfigurable with the same or different type of chamber module.

3. The modular vacuum system of claim 2, wherein the central transfer chamber module is connected to three or more of the chamber modules, and the platform supports three or more of the interface panels.

4. The modular vacuum system of claim 2, further comprising:

a modular control system comprising;

a first object representative of the central transfer chamber module; and

one or more chamber module objects representative of each chamber module.

5. The modular vacuum system of claim 4, wherein:

the first object provides signals adapted to actuate the operation of the central transfer chamber module and coordinates overall performance of the system; and

the one or more chamber module objects provide signals adapted to operate each chamber module and to coordinate with the central transfer chamber module in overall performance of the system.

6. The modular vacuum system of claim 5, wherein:

each chamber module comprises chamber-specific devices adapted to perform chamber specific tasks; and

each chamber module object comprises;

one or more input/output (I/O) devices adapted to provide electrical signals to the chamber-specific devices to perform the specific tasks;

one or more driver modules adapted to send I/O-device-specific commands causing the I/O devices to send the electrical signals;

one or more controller modules adapted to send driver-module-specific commands causing the driver modules to send the I/O device specific commands; and

one or more manager modules adapted to send controller-module-specific commands causing the various controller modules to send the driver module specific commands.

7. The modular vacuum system of claim 6, wherein:

the manager modules control high-level functions for the respective chamber module;

the controller modules provide mid-level commands adapted to carry out the high-level functions; and

the driver modules provide low-level commands adapted to carry out the mid-level commands.

8. The modular vacuum system of claim 6, wherein:

the central control module sends control and data parameters to the first object and the one or more chamber module objects.

9. The modular vacuum system of claim 8, wherein the chamber control module configures the first object and the one or more chamber module objects and initiates them as processes running within the modular control system.

10. The modular vacuum system of claim 9, wherein:

the one or more chamber controllers are electrically connected to the one or more chamber modules, wherein each chamber controller sends command signals adapted to actuate operation of each chamber module and receives sensory signals adapted to indicate performance and status of each chamber module.

11. The modular vacuum system of claim 10, wherein:

the chamber control module determines a chamber module object for each chamber module controller and initiates the chamber module object as a process running on the chamber module controller;

whereby;

each chamber module object performs routines adapted to cause the chamber module controller to send command signals to actuate operation of the chamber module.

12. The modular vacuum system of claim 1, further comprising:

a load lock structure including two load lock chambers connected to the central transfer chamber module; and

a mini-environment connected to both load lock chambers.

13. The modular vacuum system of claim 1, wherein each delivery line has a plurality of interface panel connections adapted to couple the delivery line to each interface panel.

14. The modular vacuum system of claim 13, wherein each delivery line has a connector adapted to couple all the delivery lines to the facilities panel box.

15. The modular vacuum system of claim 1, further comprising at least one return line have a plurality of interface panel connections adapted to couple the return line to each interface panel.

16. The modular vacuum system of claim 1, wherein the interface panel further comprising an electrical connection box.

17. The modular vacuum system of claim 1, wherein the interface panel further comprises a subpanel adapted to provide additional configuration capability.

18. A modular vacuum system for processing substrates, comprising:

a platform supporting one or more interface panels;

a facilities panel box disposed on the platform and adapted to be coupled to facility lines;

at least one delivery line, each delivery line supported on the platform and adapted to be coupled to the facilities panel box and to each interface panel;

a central transfer chamber supported on the platform and having a robot disposed therein;

one or more chamber modules connected to the central transfer chamber, each chamber module is connected to one interface panel; and

each chamber module supported on a chamber module platform and having a chamber controller and an interface connecting each of the chamber controllers to a central control module.