Solid state imaging device having a box-shaped circuit board

• US 6,313,456 B1
• Filed: 01/24/2000
• Issued: 11/06/2001
• Est. Priority Date: 01/25/1999
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Suzuki, Yasuyuki, Miyashita, Taketo, Kajinami, Hitoshi
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US09/489,834
• Time in Patent Office: 652 Days
• Field of Search: 250/208.1, 250/239, 250/201.3, 257/290, 257/291, 257/431-435, 348/294
• US Class Current: 250/208.1
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

The present invention is to obtain a solid state image pick-up device capable of downsizing an image pick-up unit and further decreasing the rigid end portion of an endoscope or the like in diameter and length. An image pick-up unit (13) is formed by a solid state image pick-up chip (18) which is not packaged and a circuit board (20) for mounting electronic parts (19) thereon which is jointed to the rear side of the solid state image pick-up chip (18): the circuit board (20) formed by a film shaped board is formed into a box by bending the same board with its main portion (26) as a reference, so as to accommodate a conductive pattern and a terminal portion; a bonding pad (25) provided in the solid state image pick-up chip (18) and a bonding pad (33) provided in the circuit board (20) are electrically connected by a bonding wire or connecting means (36) comprising a film forming a wiring pattern; the electronic parts (19) are mounted inside the box-shaped circuit board; a signal cable (35) is connected to the terminal portion (34); and the above-mentioned circuit board (20) is designed to be accommodated in a projection area of the solid state image pick-up chip (18).

Claims

1. A solid state imaging device comprising an imaging unit including a solid state imaging chip which is not packaged and a circuit board for mounting electronic parts thereon which is jointed to the rear side of the solid state imaging chip, in which

the circuit board is formed into a box by bending the same board with its main board portion as a reference, so as to accommodate a conductive pattern and a terminal portion,

a bonding pad provided in the solid state imaging chip and a bonding pad provided in the circuit board are electrically connected by a bonding wire or connecting means comprising a patterned film, the electronic parts are mounted on the conductive pattern inside the box-shaped circuit board, and a signal cable is connected to the terminal portion, and

the circuit board is designed to be accommodated in a projection area of the solid state imaging chip.

2. A solid state imaging device according to claim 1, in which

the main board portion of the circuit board is jointed to the rear side of the solid state imaging chip, and the bonding pad formed on the main board portion and the bonding pad on the solid state imaging chip are electrically connected by the bonding wire or connecting means comprising a patterned film.

3. A solid state imaging device according to claim 1, in which

the box-shaped circuit board is disposed on the rear side of the main board portion of the circuit board via an extension board and the electronic parts are mounted also on the extension board.

4. A solid state imaging device according to claim 1, in which

the imaging unit is applied to an electronic endoscope.

5. In a solid state imaging device comprising an imaging unit including a solid state imaging chip which is not packaged and a circuit board for mounting electronic parts thereon which is jointed to the rear side of the solid state imaging chip, a method of assembling the solid state imaging device, comprising the steps of:

forming a box-shaped board housing a conductive pattern and a terminal portion, by bending the circuit board with its main board portion as a reference and with the mounting portion of the electronic parts and the terminal portion of a signal cable as each bent portion;

electrically connecting a bonding pads provided in the solid state imaging chip and a terminal provided on the circuit board by a bonding wire or connecting means comprising a patterned film, and

mounting the electronic parts on the mounting portion thereof and connecting the signal cable to the terminal, thereby to form the box-shaped circuit board.

6. A method of assembling the solid state imaging device according to claim 5, further comprising

a step of jointing the main board portion of the circuit board to the rear side of the solid state imaging chip, and further electrically connecting the bonding pad formed on the main board portion and the bonding pad on the solid state imaging chip by the bonding wire or connecting means comprising a patterned film.

7. A method of assembling the solid state imaging device according to claim 5, further comprising

a step of disposing the box-shaped circuit board through an extension board on the rear side of the main board portion of the circuit board and mounting the electronic parts also on the extension board.

8. A method of assembling the solid state imaging device according to claim 5, further comprising

a step of applying the imaging unit to an electronic endoscope.