Semiconductor device and a method of manufacturing the same
First Claim
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1. A semiconductor device comprising:
- a plurality of pixel TFTs being arranged in a matrix;
a storage capacitance being connected to each of the plurality of pixel TFTs;
a first transparent conductive film having a first opening portion;
a capacitance insulating film covering the first transparent conductive film and having a second opening portion which is formed at an inside deeper than the first opening portion;
an interlayer insulating film covering the second opening portion and being formed over the pixel TFTs; and
a second transparent conductive film being formed in contact with the interlayer insulating film and the capacitance insulating film, wherein the storage capacitance comprises the first transparent conductive film, the capacitance insulating film and the second transparent conductive film.
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Abstract
In a liquid crystal display device, an improved storage capacitance that uses a pair of transparent conductive films for electrodes is provided. On a flattening film made of a resin, a first transparent conductive film and an insulating film for capacitance are formed into a lamination to form in this laminated film an opening portion. An insulating film covering near the opening portion is formed. A transparent conductive film is formed and patterned to form a pixel electrode. Thus is formed a storage capacitance having the structure where the insulating film for capacitance is sandwiched between the first transparent conductive film and the pixel electrode.
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Citations
10 Claims
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1. A semiconductor device comprising:
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a plurality of pixel TFTs being arranged in a matrix;
a storage capacitance being connected to each of the plurality of pixel TFTs;
a first transparent conductive film having a first opening portion;
a capacitance insulating film covering the first transparent conductive film and having a second opening portion which is formed at an inside deeper than the first opening portion;
an interlayer insulating film covering the second opening portion and being formed over the pixel TFTs; and
a second transparent conductive film being formed in contact with the interlayer insulating film and the capacitance insulating film, wherein the storage capacitance comprises the first transparent conductive film, the capacitance insulating film and the second transparent conductive film. - View Dependent Claims (3, 4, 7, 8)
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2. A semiconductor device comprising:
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a plurality of pixel TFTs being arranged in a matrix; and
a storage capacitance being connected to each of the plurality of pixel TFTs;
a first transparent conductive film having a first opening portion;
a capacitance insulating film covering the first transparent conductive film and having a second opening portion which is formed at an inside deeper than the first opening portion;
an interlayer insulating film covering the second opening portion and being formed over the pixel TFTs;
a second transparent conductive film being formed in contact with the interlayer insulating film and the capacitance insulating film; and
a pad electrode including the second transparent conductive film, wherein the storage capacitance comprising the first transparent conductive film, the capacitance insulating film and the second transparent conductive film, wherein the first transparent conductive film is grounded through the pad electrode. - View Dependent Claims (5, 6, 9, 10)
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Specification