×

Coaxial integrated circuitry interconnect lines, and integrated circuitry

  • US 6,313,531 B1
  • Filed: 07/17/1998
  • Issued: 11/06/2001
  • Est. Priority Date: 08/22/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. Integrated circuitry comprising a bulk semiconductive substrate having front and back surfaces and a plurality of conductive coaxial interconnect lines extending through the substrate from the front surface to the back surface;

  • the conductive coaxial interconnect lines having aspect ratios of at least 100;

    the conductive coaxial lines respectively comprising an encircling outer conductive region, a region of dielectric material disposed radially inwardly of the encircling outer conductive region and coaxial with the outer conductive region, and conductive material cores disposed radially inwardly of the dielectric material and coaxial with the outer conductive region and the region of dielectric material.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×