Power semiconductor module and motor drive system
First Claim
1. A power semiconductor module having a power circuit portion and a control circuit portion for controlling said power circuit portion, comprising:
- a metal base;
a power semiconductor element included in said power circuit portion and mounted on said metal base through an insulator;
a first resin molded to said power semiconductor element such that the surface of said metal base is exposed;
a control circuit element included at least in a portion of said control circuit portion and disposed on said first resin;
a main terminal connected with said power circuit portion and led to the outside of said first resin; and
a control terminal connected with said power circuit portion and having its portion exposed in the surface of said first resin, wherein said portion of said control circuit portion is connected with said power circuit portion at said exposed potion of said control terminal.
3 Assignments
0 Petitions
Accused Products
Abstract
A power semiconductor module comprising a power semiconductor element included in a power circuit portion and mounted on a metal base, a first resin molded to the power semiconductor element, a control circuit element disposed on the first resin and included at least in a portion of the control circuit, and a control terminal connected to the power circuit portion and having an exposed portion thereof in the surface of the first resin, in which a portion of the control circuit is connected with the power circuit portion at the exposed portion of the control terminal. Accordingly, a resin mold type power semiconductor module capable of realizing a high performance of the control circuit portion at low cost can be realized.
-
Citations
23 Claims
-
1. A power semiconductor module having a power circuit portion and a control circuit portion for controlling said power circuit portion, comprising:
-
a metal base;
a power semiconductor element included in said power circuit portion and mounted on said metal base through an insulator;
a first resin molded to said power semiconductor element such that the surface of said metal base is exposed;
a control circuit element included at least in a portion of said control circuit portion and disposed on said first resin;
a main terminal connected with said power circuit portion and led to the outside of said first resin; and
a control terminal connected with said power circuit portion and having its portion exposed in the surface of said first resin, wherein said portion of said control circuit portion is connected with said power circuit portion at said exposed potion of said control terminal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
-
-
23. A power semiconductor module comprising:
-
a metal base;
a power circuit portion including a power semiconductor element and disposed on said metal base through an insulator;
a first resin molded to said power semiconductor element such that the surface of said metal base is exposed;
a main terminal connected to said power circuit portion and taken to the outside of said first resin; and
a control terminal connected to said power circuit portion and having an exposed portion in the surface of said first resin for connecting a control circuit portion to said power circuit portion.
-
Specification