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Method of forming fine-pitch interconnections employing a standoff mask

  • US 6,316,289 B1
  • Filed: 03/25/1999
  • Issued: 11/13/2001
  • Est. Priority Date: 11/12/1998
  • Status: Expired due to Fees
First Claim
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1. A method for forming a pattern of adhesive on a substrate, the pattern of adhesive having a height greater than a given height, comprising:

  • obtaining a substrate having a pattern of sites thereon on which adhesive is to be deposited;

    obtaining a standoff mask including a metal sheet of thickness substantially the given height having a pattern of openings corresponding to the pattern of sites and having standoff features thereon, wherein the standoff features are spaced away laterally from the openings and with said metal sheet define a thickness greater than the given height;

    positioning said substrate and said standoff mask proximate each other with the standoff features proximate the substrate so that the pattern of sites and the pattern of openings correspond;

    applying adhesive to substantially fill and pass through the openings of said standoff mask and to contact the sites on the substrate; and

    removing said standoff mask to leave said adhesive on said pattern of sites, whereby a pattern of adhesive having a height greater than the given height is formed on the substrate.

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