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Semiconductor device

  • US 6,316,838 B1
  • Filed: 03/20/2000
  • Issued: 11/13/2001
  • Est. Priority Date: 10/29/1999
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a substrate having a plurality of flip-chip pads formed on a first surface thereof and a plurality of wire bonding pads formed on a second surface thereof;

    a first semiconductor element provided on said first surface of said substrate via the flip-chip pads in a face-down state;

    a second semiconductor element provided on said second surface, opposite to said first surface, of said substrate in a face-up state and electrically connected to said wire bonding pads by wires; and

    an extended wiring mechanism formed on said substrate for connecting the flip-chip pads and the respective wire bonding pads to each other, the connected flip-chip pads and the wire bonding pads corresponding to equi-electrodes whose electrical characteristics are equal.

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