Nanoporous silica treated with siloxane polymers for ULSI applications

• US 6,318,124 B1
• Filed: 08/23/1999
• Issued: 11/20/2001
• Est. Priority Date: 08/23/1999
• Status: Expired due to Fees

• Current Assignee: Alliedsignal Inc.
• Original Assignee: Alliedsignal Inc.
• Inventors: Katsanes, Ron, Ramos, Teresa, Wu, Hui-Jung, Rutherford, Nicole, Drage, James S.
• Primary Examiner(s): Colaianni, Michael
• Application Number:
  US09/379,484
• Time in Patent Office: 820 Days
• Field of Search: 65/601, 65/60.3, 65/608, 65D/IG.11, 427/96, 427/99, 427/165, 427/245, 427/246, 427/269, 427/279, 427/287, 427/407.2
• US Class Current: 65/60.8
• CPC Class Codes: H01L 21/02126 the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
• CPC Class Codes: H01L 21/02203 the layer being porous
• CPC Class Codes: H01L 21/02216 the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
• CPC Class Codes: H01L 21/02282 liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
• CPC Class Codes: H01L 21/02337 treatment by exposure to a gas or vapour
• CPC Class Codes: H01L 21/02343 treatment by exposure to a liquid
• CPC Class Codes: H01L 21/02362 formation of intermediate layers, e.g. capping layers or diffusion barriers
• CPC Class Codes: H01L 21/31051 Planarisation of the insulating layers H01L21/31058 takes precedence
• CPC Class Codes: H01L 21/31695 Deposition of porous oxides or porous glassy oxides or oxide based porous glass
• CPC Class Codes: Y10S 65/11 Encapsulating

Abstract

A surface-coated nanoporous silica dielectric film that is prepared by a process comprising the steps of forming a nanoporous silica dielectric coating on a substrate, and coating the formed nanoporous silica dielectric film with a coating composition comprising a polymer precursor, under conditions effective to form a strength-enhancing and/or hydrophobicity enhancing layer on the treated nanoporous silica dielectric film.

Claims

1. A surface-coated nanoporous silica dielectric film that is prepared by a process comprising the steps of forming a nanoporous silica dielectric coating on a substrate, and coating the formed nanoporous silica dielectric coating with a coating composition comprising a polymer, under conditions effective to form a layer on said nanoporous silica dielectric coating.

2. The surface-coated nanoporous silica dielectric film of claim 1, wherein the nanoporous silica dielectric coating is prepared from a spin-on-glass material comprising at least one compound selected from the group consisting of an alkoxysilane, alkylalkoxysilane, a silsesquioxane, a hydrogensiloxane, a hydroorganosiloxane, a hydrogensilsesquioxane, an acetoxysilane, a halogenated silane and combinations thereof.

3. The surface-coated nanoporous silica dielectric film of claim 1 that is prepared by a process wherein the coating composition comprises a compound that is selected from the group consisting of a low organic siloxane, a high organic siloxane, a hydridoorganosiloxane, a poly(arylene ether), a fluorinatated poly(arylene) ether, a polyimide, a polycarbosilane, and combinations thereof.

4. The surface-coated nanoporous silica dielectric film of claim 1 that is prepared by a process wherein the coating composition is applied to the formed nanoporous silica dielectric coating before the nanoporous silica dielectric coating is cured, and then curing the nanoporous dielectric coating and the coating composition is simultaneously.

5. The surface-coated nanoporous silica dielectric film of claim 2 wherein the nanoporous silica dielectric coating is prepared from a spin-on-glass material comprising alkoxysilane.

6. The surface-coated nanoporous silica dielectric film of claim 5 wherein the nanoporous silica dielectric coating is prepared from a spin-on-glass material comprising tetraethoxysilane.

7. The surface-coated nanoporous silica dielectric film of claim 3 that is prepared by a process wherein the coating composition comprises at least one low organic compound that is selected from the group consisting of

8. The surface-coated nanoporous silica dielectric film of claim 7 that is prepared by a process wherein R is organic and is independently selected from the group consisting of straight chain alkyl, branched alkyl, cycloalkyl, aryl groups, and mixtures thereof.

9. The surface-coated nanoporous silica dielectric film of claim 3 that is prepared by a process wherein the coating composition comprises at least one compound that is selected from the group consisting of

10. The surface-coated nanoporous silica dielectric film of claim 9 that is prepared by a process wherein R is organic and is independently selected from the group consisting of straight chain alkyl, branched allyl, cycloalkyl, aryl groups, and mixtures thereof.

11. The surface-coated nanoporous silica dielectric film of claim 3 that is prepared by a process wherein the coating composition comprises at least one compound with the formula:

12. The surface-coated nanoporous silica dielectric film of claim 3 that is prepared by a process wherein the coating composition comprises at least one polycarbosilane that is selected from the group consisting of —

[Si(R₁)(R₂)(H)]_x—

, —

[Si(R₃)(R₄)]_y—

, —

[Si(R₅)(R₇)(O—

R₆)]_z—

, —

[Si(R₈)(R₉)(R₁₀)]_w—

;

wherein R₁, R₇ and R₁₀ is each independently selected from the group consisting of an alkylene, cycloalkylene and arylane group, and is substituted or unsubstituted,

R₂, R₃, R_4, R₅ and R₆ is each independently selected from a group consisting of an H and organic group,

R₆ is selected from a group consisting of an organosilicon, a silanyl, a siloxyl, and an organo group; and

10<

x+y+z+w<

100,000, and y and z and w can collectively or independently be zero.

13. The surface-coated nanoporous silica dielectric film of claim 1 that exhibits the following measured properties, Si—

H bond absorbance at 2150 cm<sup>−

1</sup> measured by Fourier transform infrared spectroscopy, stud pull strength ranging from about 1.5 kpsi to about 6 kpsi, and wherein the pore structures remain open.

14. An integrated circuit device comprising the surface-coated nanoporous silica dielectric film prepared according to claim 1.

15. A method of preparing a surface-coated nanoporous silica dielectric film comprising the steps of forming a nanoporous silica dielectric coating on a substrate, and coating the formed nanoporous silica dielectric coating with a coating composition comprising a polymer, under conditions effective to form a polymer layer on said nanoporous silica dielectric coating.

16. The method of claim 15, wherein the nanoporous silica dielectric film is prepared by applying a spin-on-glass film on a substrate, and then gelling said film to form a nanoporous silica dielectric coating.

17. The method of claim 15 wherein the coating composition comprises a polymer that is selected from the group consisting of a low organic siloxane, a high organic siloxane, a hydridoorganosiloxane, a poly(arylene ether), a fluorinated poly(arylene)ether, a polyimide, a polycarbosilane, and combinations thereof.

18. The method of claim 15 comprising applying the coating composition to the formed nanoporous silica dielectric coating and then curing the nanoporous dielectric coating and the coating composition simultaneously.

19. A surface-coated nanoporous silica dielectric film prepared by the method of claim 15.