High flux led assembly
First Claim
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1. A unitary reflector assembly for use with a plurality of light emitting diodes, said diodes each including an integral lens, said assembly comprising:
- a plurality of generally concave reflectors, said reflectors each having an frustoconical surface which defines an axis, said reflectors being arranged in at least a first linear array, the wider diameter ends of said frustoconical surfaces defining a front face of the assembly; and
at least a first groove extending between adjacent reflectors of said linear array whereby said groove interrupts the frustoconical surfaces of adjacent of said reflectors, said groove having a base and being defined by walls which diverge from said base to said assembly front face.
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Abstract
A high intensity light source employs a plurality of light emitting diodes associated with a unitary reflector subassembly. The reflector subassembly defines an array of frustoconical reflectors arranged in rows and columns with the adjacent reflectors of each row being connected by a diverging slot with reflective wall surfaces. The light emitting diodes are mounted on a printed circuit board which forms a component of heat sink subassembly.
273 Citations
14 Claims
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1. A unitary reflector assembly for use with a plurality of light emitting diodes, said diodes each including an integral lens, said assembly comprising:
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a plurality of generally concave reflectors, said reflectors each having an frustoconical surface which defines an axis, said reflectors being arranged in at least a first linear array, the wider diameter ends of said frustoconical surfaces defining a front face of the assembly; and
at least a first groove extending between adjacent reflectors of said linear array whereby said groove interrupts the frustoconical surfaces of adjacent of said reflectors, said groove having a base and being defined by walls which diverge from said base to said assembly front face. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A heat sink assembly for an array of light emitting diodes, said heat sink assembly comprising:
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a printed circuit board, said circuit board being at least in part clad with copper on each of two opposite sides thereof, said copper cladding on at least a first side of said circuit board being etched to define passive electrical circuit components and heat absorption pads sized and shaped for affixation to individual light emitting diodes;
a plurality of copper plated holes extending through said board, said plating in said holes defining a heat transfer path between said heat absorption pads and the copper cladding on said second side of said circuit board;
a support member, said support member being comprised of a moldable thermally conductive material;
a heat conductive adhesive affixing a light emitting diode to at least some of said heat absorption pads on said printed circuit board; and
a heat conductive encapsulation material surrounding said circuit board and contacting each light emitting diode adhesively affixed thereto, said encapsulation material being in contact with said support member. - View Dependent Claims (10)
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11. An integrated, multiple emitter light assembly comprising:
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a reflector subassembly comprising a plurality of generally concave reflectors, said reflectors each having an frustoconical surface which defines an axis, said reflectors being arranged in at least a first linear array, the wider diameter ends of said frustoconical surfaces defining a front face of the light assembly, the smaller diameter ends of said reflectors in part defining apertures which extend through the back of said reflector subassembly, at least a first groove extending between adjacent reflectors of said linear array whereby said grove interrupts the frustoconical surfaces of adjacent of said reflectors, said groove having a base and being defined by walls which diverge from said base to said reflector subassembly front face;
a printed circuit board, said circuit board being at least in part clad with copper on each of two opposite sides thereof, said copper cladding on at least a first side of said circuit board being etched to define passive electrical circuit components and heat absorption pads sized and shaped for affixation to individual light emitting diodes, said pads being in registration with said apertures;
a plurality of copper plated holes extending through said board, said plating in said holes defining a heat transfer path between said heat absorption pads and the copper cladding on said second side of said circuit board;
a support member, said support member being comprised of a moldable thermally conductive material;
a plurality of light emitting diodes, each of said diodes having an integral lens;
a heat conductive adhesive affixing a said individual light emitting diode to at least some of said heat absorption pads on said printed circuit board;
a heat conductive encapsulation material surrounding said circuit board and contacting each light emitting diode adhesively affixed thereto, said encapsulation material being in contact with said support member; and
means supporting said reflector subassembly with said light emitting diode lenses projecting through said apertures. - View Dependent Claims (12, 13, 14)
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Specification