Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers

• US 6,318,909 B1
• Filed: 02/11/1999
• Issued: 11/20/2001
• Est. Priority Date: 02/11/1999
• Status: Expired due to Term

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Rosenberg, Paul K., Giboney, Kirk S., Yuen, Albert T.
• Primary Examiner(s): Bovernick, Rodney
• Assistant Examiner(s): PAK, SUNG H
• Application Number:
  US09/248,877
• Time in Patent Office: 1,013 Days
• Field of Search: 385/88, 385/89, 385/90, 385/92, 385/49, 385/14, 257/668, 257/700, 257/712
• US Class Current: 385/90
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/4283 with electrical insulation means
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.

Claims

1. An integrated packaging system for packaging an optical communications device, the packaging system comprising:

an electrically-conductive mechanical support including a first support element and a second support element, the first support element extending at a non-zero angle from the second support element;

a printed circuit board including;

a first portion and a second portion in contact with the first support element and the second support element, respectively,

an insulating substrate, and

an electrically-conductive track supported by the insulating substrate; and

the optical communications device mechanically coupled to the first support element of the mechanical support and electrically connected to the electrically-conductive track.

2. The integrated packaging system of claim 1, in which the mechanical support is additionally thermally conductive and operates as a heat sink for the optical communications device.

3. The integrated packaging system of claim 2, in which the optical communications device is electrically insulated from the mechanical support.

4. The integrated packaging system of claim 1, in which:

the packaging system additionally comprises a cover assembly including a cover comprising a device alignment feature; and

the cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.

5. The integrated packaging system of claim 4, in which:

the packaging system is additionally for providing an automatically-aligned interface between the optical communications device and an optical element; and

the cover assembly additionally includes the optical element coupled to the cover, the optical element and the device alignment feature having a defined positional relationship with respect to one another corresponding to the defined positional relationship between the optical communications device and the device alignment feature.

6. The integrated packaging system of claim 4, in which:

the packaging system is additionally for providing an automatically-aligned interface between the optical communications device and an optical fiber; and

the packaging system additionally comprises a fiber optic connector, including;

a connector body comprising a connector alignment feature shaped to engage with the device alignment feature, and

the optical fiber coupled to the connector body, the optical fiber and the connector alignment feature having a defined positional relationship with respect to one another corresponding to the defined positional relationship between the optical communications device and the device alignment feature.

7. The integrated packaging system of claim 4, in which:

the device alignment feature includes one of (a) an aligning member extending from the first support element and (b) an alignment recess defined by the first support element; and

the connector alignment feature includes one of (a) an alignment recess defined by the connector body, the alignment recess being shaped and dimensioned to engage with the aligning member extending from the first support element, and (b) an aligning member extending from the connector body, the aligning member being shaped and dimensioned to engage with the alignment recess defined by the first support element.

8. The integrated packaging system of claim 4, in which the mechanical support is additionally thermally conductive and operates as a heat sink for the optical communications device.

9. The integrated packaging system of claim 4, in which the printed circuit board includes a flexible printed circuit board.

10. The integrated packaging system of claim 1, in which the printed circuit board includes a flexible printed circuit board.

11. The integrated packaging system of claim 1, in which the second portion of the printed circuit board includes an electrical connector.

12. The integrated packaging system of claim 1, in which the first support element includes a device alignment feature, the device alignment feature and the optical communications device having a defined positional relationship with respect to one another.

13. The integrated packaging system of claim 12, in which:

the packaging system is additionally for providing an automatically-aligned interface between the optical communications device and an optical element; and

the packaging system additionally comprises a cover assembly, including;

a cover comprising a cover alignment feature shaped to engage with the device alignment feature, and

the optical element coupled to the cover, the optical element and the cover alignment feature having a defined positional relationship with respect to one another corresponding to the defined positional relationship between the optical communications device and the device alignment feature.

14. The integrated packaging system of claim 13, in which:

the device alignment feature includes one of (a) an aligning member extending from the first support element and (b) an alignment recess defined by the first support element; and

the cover alignment feature includes one of (a) an alignment recess defined by the cover, the alignment recess being shaped and dimensioned to engage with the aligning member extending from the first support element, and (b) an aligning member extending from the cover, the aligning member being shaped and dimensioned to engage with the alignment recess defined by the first support element.

15. The integrated packaging system of claim 13, in which:

the packaging system is additionally for providing an automatically-aligned interface between the optical communications device, the optical element and an optical fiber;

the cover alignment feature is a first cover alignment feature;

the cover additionally comprises a second cover alignment feature located in a defined location relative to the optical element; and

the packaging system additionally comprises a fiber optic connector, including;

a connector body comprising a connector alignment feature shaped to engage with the second cover alignment feature, and

the optical fiber coupled to the connector body, the optical fiber and the connector alignment feature having a defined positional relationship with respect to one another corresponding to the defined positional relationship between the second cover alignment and the optical element.

16. The integrated packaging system of claim 15, in which:

the device alignment feature includes a first aligning member extending from the first support element;

the first cover alignment feature is integral with the second cover alignment feature and includes an alignment recess defined by the cover, the alignment recess being shaped and dimensioned to engage with the first aligning member; and

the connector alignment feature includes an alignment recess defined by the connector body, the alignment recess being shaped and dimensioned to engage with the first aligning member.

17. The integrated packaging system of claim 15, in which:

the device alignment feature includes one of (a) a first aligning member extending from the first support element, and (b) an alignment recess defined by the first support element;

the first cover alignment feature includes one of (a) an alignment recess defined by the cover, the alignment recess being shaped and dimensioned to engage with the first aligning member, and (b) a first aligning member extending from the cover, the first aligning member being shaped and dimensioned to engage with the alignment recess defined by the first support element;

the connector alignment feature includes one of (c) a second aligning member extending from the connector body, and (d) an alignment recess defined by the connector body; and

the second cover alignment feature includes one of (c) an alignment recess defined by the cover, the alignment recess being shaped and dimensioned to engage with the second aligning member, and (d) a second aligning member extending from the cover the aligning member being shaped and dimensioned to engage with the alignment recess defined by the connector body.

18. The integrated packaging system of claim 17, in which the first aligning member is integral with the second aligning member and extends opposite directions from the cover.

19. The integrated packaging system of claim 12, in which:

the packaging system is additionally for providing an automatically-aligned interface between the optical communications device and an optical fiber; and

the packaging system additionally comprises a fiber optic connector, including;

a connector body comprising a connector alignment feature shaped to engage with the device alignment feature, and

the optical fiber coupled to the connector body, the optical fiber and the connector alignment feature having a defined positional relationship with respect to one another corresponding to the defined positional relationship between the optical communications device and the device alignment feature.

20. The integrated packaging system of claim 19, in which:

the device alignment feature includes one of (a) an aligning member extending from the first support element and (b) an alignment recess defined by the first support element; and

the connector alignment feature includes one of (a) an alignment recess defined by the connector body, the alignment recess being shaped and dimensioned to engage with the aligning member extending from the first support element, and (b) an aligning member extending from the connector body, the aligning member being shaped and dimensioned to engage with the alignment recess defined by the first support element.

21. The integrated packaging system of claim 19, additionally comprising a cover assembly including a cover shaped to allow the connector alignment feature and the device alignment feature to engage with one another.

22. The integrated packaging of claim 21, in which the cover assembly additionally includes an alignment-insensitive optical element.

23. The integrated packaging system of claim 12, in which the mechanical support is additionally thermally conductive and operates as a heat sink for the optical communications device.

24. The integrated packaging system of claim 12, in which the printed circuit board includes a flexible printed circuit board.