System and method for dicing semiconductor components

• US 6,319,354 B1
• Filed: 10/20/2000
• Issued: 11/20/2001
• Est. Priority Date: 07/06/1998
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Farnworth, Warren M., Wood, Alan G.
• Primary Examiner(s): Osele, Mark A.
• Application Number:
  US09/693,443
• Time in Patent Office: 396 Days
• Field of Search: 156/344, 156/584, 438/464, 438/976, 438/FOR.386
• US Class Current: 156/707
• CPC Class Codes: B28D 5/0094 the supporting or holding device being of the vacuum type
• CPC Class Codes: H01L 21/3043 Making grooves, e.g. cutting
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68313 Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: Y10S 156/941 Means for delaminating semiconductive product
• CPC Class Codes: Y10S 438/976 Temporary protective layer
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/1132 Using vacuum directly against work during delaminating
• CPC Class Codes: Y10T 156/19 Delaminating means
• CPC Class Codes: Y10T 156/1944 Vacuum delaminating means [e.g., vacuum chamber, etc.]

Abstract

A method and system for dicing semiconductor components, such as bare dice and chip scale packages, are provided. Initially, the semiconductor components are contained on a wafer or a panel. Next, an insert that includes a base and an adhesive layer, is used to support the substrate for separation into separate components by sawing or other process. The insert with the separated components retained thereon, is then transferred to a carrier tray constructed according to JEDEC standards. The carrier tray is adapted for stacking and for handling by conveyors, magazines and other standard equipment. The system includes the substrate, the insert, and the standardized carrier tray.

Claims

1. A system for dicing a substrate comprising a plurality of semiconductor components comprising:

an insert comprising a base, and an adhesive or a vacuum membrane on the base configured to retain the substrate on the base for separation into the components, and to retain the components on the base following separation; and

a carrier configured to hold the insert with the components thereon, the carrier comprising at least one retention member configured to retain the insert on the carrier, and a plurality of different features configured to facilitate transport and handling of the carrier.

2. The system of claim 1 wherein the adhesive comprises a double sided tape or an adhesive layer.

3. The system of claim 1 wherein the carrier is configured to retain a plurality of inserts.

4. A system for dicing a substrate comprising a plurality of semiconductor components comprising:

a base configured to support the substrate;

an adhesive member on the base configured to retain the substrate on the base for separation into the components and to retain the components on the base following separation; and

a carrier configured to retain the base with the components thereon, the carrier comprising a plurality of features including an outline, a lug, a chamfer and a stacking ridge, configured to facilitate handling or transporting of the carrier with the base and the components thereon.

5. The system of claim 4 wherein the carrier further comprises a retention member configured to retain the base on the carrier.

6. The system of claim 4 wherein the lug is configured to engage a conveyor.

7. The system of claim 4 wherein the chamfer is configured to indicate an orientation of the carrier.

8. The system of claim 4 wherein the stacking ridge is configured to stack the carrier to a second carrier substantially identical to the carrier.

9. A system for dicing a substrate comprising a plurality of semiconductor components comprising:

a base configured to support the substrate;

a vacuum chamber on the base;

a membrane on the vacuum chamber configured to retain the substrate on the base for separation into the components and to retain the components following separation on the base, the membrane configured to deform upon application of a vacuum to the vacuum chamber for removing the components from the base; and

a carrier configured to retain the base with the components thereon, the carrier comprising a plurality of features including an outline, a lug, a chamfer and a stacking ridge configured to facilitate handling and transporting of the carrier with the base and the components thereon.

10. The system of claim 9 further comprising at least one retention member on the carrier configured to retain the base on the carrier.

11. The system of claim 9 wherein the lug is configured to engage a conveyor.

12. The system of claim 9 wherein the chamfer is configured to indicate an orientation of the carrier.

13. The system of claim 9 wherein the stacking ridge is configured to stack the carrier to a second carrier substantially identical to the carrier.

14. The system of claim 9 wherein the carrier comprises a plurality of retention members configured to retain a plurality of bases.

15. A method for dicing a substrate comprising a plurality of semiconductor components comprising:

providing a base comprising an adhesive configured to retain the substrate on the base;

providing a carrier comprising at least one retention member configured to retain the base on the carrier and a plurality of different features configured to facilitate transport or handling of the carrier, the at least one retention member comprising a lip configured to engage an edge of the base and a clip configured to bias the base against the lip;

separating the substrate into the components with the substrate retained on the base during separation, and the components retained on the base following separation; and

handling or transporting the carrier with the base retained on the carrier and the components retained on the base.

16. The method of claim 15 wherein the features include an outline, a lug, a chamfer and a stacking ridge.

17. The method of claim 15 wherein the adhesive comprises an adhesive layer or a double sided tape.

18. The method of claim 15 wherein the carrier is configured to retain a plurality of bases substantially identical to the base.

19. The method of claim 15 wherein the separating step is performed with a saw, a liquid jet stream, a laser or an etchant.

20. A method for dicing a substrate comprising a plurality of semiconductor components comprising:

providing a base comprising an adhesive or a vacuum membrane configured to retain the substrate on the base;

separating the substrate into the components with the substrate retained on the base during separation and the components retained on the base following separation;

providing a carrier comprising a lip configured to engage an edge of the base to retain the base on the carrier and a clip configured to bias the base against the lip, the carrier further comprising a plurality of features configured to facilitate handling and transport of the carrier, the features comprising an outline, a lug, a chamfer and a stacking ridge; and

handling or transporting the carrier with the base retained on the carrier and the components retained on the base.

21. The method of claim 20 wherein the adhesive comprises an adhesive layer or a double sided tape.

22. The method of claim 20 wherein the carrier is configured to retain a plurality of bases for transport and handling.

23. The method of claim 20 wherein the separating step is performed with a saw, a liquid jet stream, a laser or an etchant.

24. The method of claim 23 wherein the lug is configured to engage a conveyor.

25. The method of claim 23 wherein the chamfer is configured to indicate an orientation of the carrier.

26. The method of claim 23 wherein the stacking ridge is configured for stacking the carrier to a second carrier substantially identical to the carrier.