Energy beam curable epoxy resin composition

• US 6,319,652 B1
• Filed: 09/15/1999
• Issued: 11/20/2001
• Est. Priority Date: 11/26/1996
• Status: Expired due to Term

• Current Assignee: Adeka Corporation
• Original Assignee: Asahi Kogaku Kogyo Kabushiki Kaisha
• Inventors: Akutsu, Mitsuo, Nakayashiki, Tetsuyuki, Tachikawa, Hiroyuki, Ohkawa, Kazuo, Chikaoka, Satoyuki
• Primary Examiner(s): Hamilton, Cynthia
• Application Number:
  US09/396,800
• Time in Patent Office: 797 Days
• Field of Search: 430/280.1, 522/170
• US Class Current: 430/280.1
• CPC Class Codes: B29C 64/106 using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• CPC Class Codes: B29K 2063/00 Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing
• CPC Class Codes: C08G 59/24 carbocyclic
• CPC Class Codes: C08G 59/30 containing atoms other than carbon, hydrogen, oxygen and nitrogen
• CPC Class Codes: C08G 59/68 characterised by the catalysts used
• CPC Class Codes: G03F 7/0037 Production of three-dimensional images
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021

Abstract

The energy beam curable epoxy resin composition comprising as essential components, (1) specific cationically polymerizing organic substance,(2) energybeam sensitive cation polymerization initiator, (3) cationically polymerizing organic substance except for the specific cationically polymerizing organic substance, described above, (4) radically polymerizing organic compound, and (5) energy beam sensitive radical polymerization initiator. The cured articles resulted from said resin composition, have superior properties and particularlly superior dimensional stability on humidity absorption. Therefore, a stereolithographic resin composition and a stereolithographic method are also provided.

Claims

1. An energy beam curing epoxy resin composition for coating and molding materials having improved humidity resistance comprising, as essential components thereof:

(1) cationically polymerizing organic substance having the general formula, as follows,

wherein ‘

Z’

is a radical, having a valence of 2, and is —

C(CH₃)₂—

, and R¹˜

R¹⁸, which may be identical or non-identical to each other, are hydrogen, halogen, hydrocarbon group, which may contain oxygen or halogen, or alkoxy group, which may be substituted; and

(2) an energy beam sensitive cationic polymerization initiator.

2. The energy beam curable epoxy resin composition according to claim 1, which further comprises,

(3) a cationically polymerizing organic substance except for that of the aforementioned general formula (I).

3. The energy beam curable epoxy resin composition according to claim 2, which further comprises,

(4) a radical polymerizable organic compound;

and

(5) an energy beam sensitive radical polymerization initiator.

4. The energy beam curable epoxy resin composition according to claim 1, which further comprises,

(4) a radically polymerizing organic compounds;

and

(5) an energy beam sensitive radical polymerization initiator.

5. The energy beam curable epoxy resin composition according to claim 4, wherein 50 wt % or more of the (4) radically polymerizing organic compound is a compound having (meth)acrylic group per one molecule.