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Interconnection device for low and high current stress electromigration and correlation study

  • US 6,320,391 B1
  • Filed: 05/08/1998
  • Issued: 11/20/2001
  • Est. Priority Date: 05/08/1998
  • Status: Expired due to Fees
First Claim
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1. An interconnection test structure using high stress current for evaluating more accurately and reliably electromigration characteristics, said test structure comprising:

  • an elongated metal test conductor having a first end and a second end;

    small extension metal conductors connected to said first end and said second end of said test conductor, said first end and said second end of said test conductor extending outwardly towards said respective extension metal conductors; and

    a plurality of vias being disposed in said small extension metal conductors adjacent said first end and said second end of said test conductor so as to cause the current density of said plurality of vias to be less than the current density of said test conductor, whereby failure of the test conductor due to electromigration will occur before failure of the vias due to the electromigration.

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