Sub-modular configurable avionics

• US 6,320,750 B2
• Filed: 11/24/1998
• Issued: 11/20/2001
• Est. Priority Date: 11/24/1998
• Status: Expired due to Term

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: TRW Inc. (Northrop Grumman Corporation)
• Inventors: Damerow, Milton F., Porter, Donald A., Shaler, Barton G.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US09/198,755
• Publication Number:
  US 20010015888A1
• Time in Patent Office: 1,092 Days
• Field of Search: 361/736, 361/749, 361/760, 361/785, 361/788, 361/796, 361/807, 361/748, 439/67, 439/77, 439/493, 174/250, 174/254, 174/255
• US Class Current: 361/736
• CPC Class Codes: H01R 12/721 cooperating directly with the edge of the rigid printed circuits
• CPC Class Codes: H01R 13/658 High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] coaxial coupling devices specially adapted for high frequency H01R24/40; for flat or ribbon cable connectors H01R12/774; for coaxial cable H01R9/05
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• CPC Class Codes: H05K 7/1409 by lever-type mechanisms

Abstract

A line replaceable module (LRM) configured with a plurality of mini-modules, each of which have relatively higher contact densities than currently available LRMs with the same form factor, for example, a Standard Electrical Module-Size E (SEM-E) form factor. The mini-modules are significantly less expensive than an entire module allowing such mini-modules to be disposable, eliminating relatively costly fault diagnostics and repair. Each mini-module includes a printed circuit board which includes a rigid primary portion, a rigid secondary portion and flexible portion interconnecting the primary and secondary portions. The rigid secondary portion may be configured to provide dual-sided interconnection to a backplane data bus. Use of the dual-sided rigid secondary portion provides for generous spacing for contact densities much higher than known contact densities for LRMs with the same form factor. The rigid primary portion carries the components forming the LRM. The use of the flexible portion provides compensation for tolerance variations as well as vibrational and thermal stress relative to connector systems used on known SEM-E LRMs.

Claims

1. A line replacement module (LRM) for carrying a plurality of electronic components aboard an aircraft, the LRM adapted to be interconnected to a plurality of backplane contacts forming a serial data bus, the LRM comprising:

a plurality of mini-modules, each mini-module including;

a rigid primary printed circuit board (PCB) for carrying an electronic circuit;

a rigid secondary PCB formed with dual sided contacts;

a flexible interconnection portion, said flexible interconnecting portion configured to provide continuous electrical contact between secondary PCB and said electronic circuit; and

a carrier for carrying said plurality of mini-modules forming an LRM, said LRM configured to have a predetermined form factor.

2. The connector system as recited in claim 1, wherein each of said secondary portions is provided with a plurality of contact pads for enabling said backplane contacts to be soldered thereto.

3. The connector system as recited in claim 1, wherein said secondary portions are disposed adjacent one end of said primary portions and generally parallel thereto.

4. The connector system as recited in claim 3, wherein said secondary portions are offset from said primary portions.

5. The connector system as recited in claim 4, wherein said flexible interconnecting portions are flexible and formed with an offset to enable interconnection between said rigid primary portions and said rigid secondary portions.

11. The LRM as recited in claim 1, wherein said plurality is two.

12. The LRM as recited in claim 1, wherein said plurality is four.

6. A mini-module for a line replacement module (LRM) for an aircraft, the mini-module comprising:

a rigid primary printed circuit board (PCB) for carrying predetermined circuitry adapted to be connected to a predetermined data bus;

a rigid secondary PCB provided with a plurality of electrical contacts, configured for dual-sided connection to a plurality of contacts forming a data bus; and

a flexible interconnecting portion electrically interconnected between said rigid secondary PCB and said rigid primary PCB, said interconnecting portion configured to provide a continuous electrical circuit between said predetermined circuitry on said rigid primary PCB and said rigid secondary PCB, said rigid primary PCB, rigid secondary PCB and said interconnecting portion configured to be received in a carrier having a predetermined form factor.

7. The LRM as recited in claim 6, wherein said primary PCB portion is rigid.

8. The LRM as recited in claim 7, wherein said secondary PCB portion is formed to be generally parallel to said primary PCB portion but offset therefrom.

9. The LRM as recited in claim 8, wherein said secondary PCB portion is rigid.

10. The LRM as recited in claim 9, wherein said interconnecting portion is flexible.