Sheet-framed IC carrier and method for producing the same

• US 6,320,751 B2
• Filed: 06/18/1998
• Issued: 11/20/2001
• Est. Priority Date: 06/23/1997
• Status: Expired due to Fees

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Yoshida, Hideyo, Takeda, Mitsunori, Igarashi, Eiichi
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US09/099,395
• Publication Number:
  US 20010018984A1
• Time in Patent Office: 1,251 Days
• Field of Search: 361/736, 361/737, 361/748-752, 361/705, 174/50.58, 174/50.64, 174/259, 235/492, 235/487-488, 257/679, 257/689
• US Class Current: 361/737
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture

Abstract

A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.

Claims

1. A sheet-framed IC carrier comprising:

a sheet frame including a core sheet and oversheets provided on a front surface and a rear surface of the core sheet, and including a recess formed therein with one of the oversheets left;

an IC carrier mounted in the recess of the sheet frame, held by the oversheet left in the recess and including an IC module, so that the IC carrier including the IC module and the portion of the core sheet can be detached from the recess of the sheet frame; and

a fusion preventing layer comprising a print application layer of a solvent-free photo-setting or thermo-setting ink provided on an adhesion surface of the IC carrier to which an oversheet is adhered.

2. A sheet-framed IC carrier according to claim 1, wherein the fusion preventing layer is formed on a surface of the IC carrier on the side of the IC module.

3. A sheet-framed IC carrier according to claim 1, wherein the fusion preventing layer is formed on a surface of the IC carrier on the opposite side of the IC module.

4. A sheet-framed IC carrier according to claim 1, wherein the fusion preventing layer includes a number of halftone dots, the fusion preventing layer is divided in a plurality of regions, and halftone dot area percentages of the respective regions are different from each other.

5. A sheet-framed IC carrier according to claim 1, wherein the IC carrier includes another core sheet and another oversheet provided on at least one surface of the core sheet;

and the core sheets of the sheet frame and the IC carrier and the oversheets of the sheet frame and the IC carrier are formed of the same composition respectively.

6. A sheet-framed IC carrier according to claim 5, wherein the core sheets of the sheet frame and the IC carrier, and the oversheets of the sheet frame and the IC carrier are formed of vinyl chloride resin.

7. A sheet-framed IC carrier according to claim 1, wherein the core sheet or the oversheet is formed of polycarbonate resin;

a mixture of polycarbonate resin and ABS resin;

a mixture of polycarbonate resin and PET resin;

or a mixture of polycarbonate resin and PBT resin.