Thermal sensing of multiple integrated circuits

• US 6,321,175 B1
• Filed: 12/21/1998
• Issued: 11/20/2001
• Est. Priority Date: 12/21/1998
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Nagaraj, Ravi
• Primary Examiner(s): ASSOUAD, PATRICK J
• Application Number:
  US09/217,678
• Time in Patent Office: 1,065 Days
• Field of Search: 702/132, 374/141, 374/152, 713/300, 713/322, 257/467
• US Class Current: 702/132
• CPC Class Codes: G01K 7/42 Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature

Abstract

A thermal sensing system allowing the measurement of the temperature of multiple integrated circuit devices using a single thermal sensor. The thermal sensor is positioned proximally to a first integrated circuit device to obtain ambient temperature readings from the device. The thermal sensor also includes remote sensing capability to measure the temperature of a second integrated circuit device positioned away from the thermal sensor. The thermal sensing system may be used to monitor a microprocessor module for an overheat condition and respond accordingly.

Claims

1. A thermal sensing system, comprising:

a first integrated circuit device having a heat sensing element;

a second integrated circuit device; and

a thermal sensor thermally coupled to the second integrated circuit device to measure the temperature of the second integrated circuit device, and electrically coupled to the heat sensing element to measure the temperature of the first integrated circuit device.

2. The system of claim 1, wherein the first integrated circuit device is a microprocessor.

3. The system of claim 1, wherein the first integrated circuit device, second integrated circuit device and thermal sensor are mounted on a printed circuit board.

4. The system of claim 3, wherein the first integrated circuit device and second integrated circuit device are mounted on a first side of the printed circuit board, and the thermal sensor is mounted on a second side of the printed circuit board.

5. The system of claim 1, further comprising a thermal control system coupled to the thermal sensor to receive temperature indications from the thermal sensor.

6. The system of claim 5, wherein the thermal control system produces control signals representing at least one of a system clock slowdown, a low power operation mode, or a system shutdown, based on the temperature indications.

7. The system of claim 6, wherein the control signals are generated when the temperature of at least one of the first integrated circuit device and the second integrated circuit device reaches a threshold temperature.

8. The system of claim 6, wherein the thermal control system is coupled to the first integrated circuit device to provide the control signals.

9. The system of claim 7, wherein the control signals are generated when the temperature of at least one of the first integrated circuit device and the second integrated circuit device reaches a threshold temperature.

10. The system of claim 1, wherein the thermal sensor is thermally coupled to the second integrated circuit device by soldering the thermal sensor to at least one ground connection of the second integrated circuit device.

11. The system of claim 10, wherein the thermal sensor is thermally coupled to the second integrated circuit device by soldering the thermal sensor to at least one ground via, the at least one ground via thermally coupled to the at least one ground connection of the second integrated circuit device.

12. The system of claim 1, wherein the thermal sensor is mounted proximate to the second integrated circuit device to obtain an accurate temperature measurement for the second integrated circuit device.

13. The system of claim 1, wherein the heat sensing element is integrated into the first integrated circuit device.

14. The system of claim 1, wherein the first integrated circuit device is located in close proximity to the second integrated circuit device such that heat generated by the first integrated circuit device increases the temperature of the second integrated circuit device.

15. A microprocessor module, comprising:

a board;

a microprocessor having a heat sensing element and mounted on a first side of the board;

a chipset including a system controller device, the chipset mounted on the first side of the board; and

a thermal sensor mounted on a second side of the board, the thermal sensor thermally coupled to the system controller device through ground interconnections of the system controller and electrically coupled to the heat sensing element.

16. The microprocessor module of claim 15, further comprising a thermal control system coupled to the thermal sensor and the microprocessor, wherein the thermal sensor provides temperature indications to the thermal control system and the thermal control system provides control signals to the microprocessor.

17. The microprocessor module of claim 16, wherein the control signals comprise at least one of a low-power operation signal, a system clock slowdown signal, and a system shutdown signal.

18. The microprocessor module of claim 16, wherein the control signals are generated when the temperature of at least one of the microprocessor and system controller reaches a threshold temperature.

19. A mobile microprocessor module, comprising,

a printed circuit board;

a microprocessor mounted on a first side of the printed circuit board and having a heat-sensing diode;

a heat sink coupled at least to the microprocessor;

a chipset including a system controller device mounted on the first side of the printed circuit board, the system controller having at least one ground interconnection coupled to a respective at least one ground via in the printed circuit board;

at least one cache memory; and

a thermal sensor mounted on a second side of the printed circuit board and opposite the system controller, the thermal sensor thermally coupled to the at least one ground via and electrically coupled to the heat-sensing diode.

20. The module of claim 19, wherein the microprocessor and the system controller are mounted in close proximity to each other such that heat generated by the microprocessor causes a temperature of the system controller to increase.