Resin sealed electronic device and method of fabricating the same and ignition coil for internal combustion engine using the same

• US 6,321,734 B1
• Filed: 04/06/2000
• Issued: 11/27/2001
• Est. Priority Date: 04/06/1999
• Status: Expired due to Fees

• Current Assignee: Hitachi Car Engineering Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Original Assignee: Hitachi Car Engineering Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Inventors: Kobayashi, Ryoichi, Shida, Masami, Fukatsu, Katsuaki, Sugiura, Noboru, Kaminaga, Toshiaki
• Primary Examiner(s): SOLIS, ERICK R
• Application Number:
  US09/544,555
• Time in Patent Office: 600 Days
• Field of Search: 123/634, 123/647, 257/787, 257/789, 257/795, 257/778, 438/108, 438/126, 438/127
• US Class Current: 123/634
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

In order to provide a resin sealed electronic device which is capable of securing high reliability by packaging with a transfer molding resin without using any under filler material, a resin sealed electronic device mounts a flip chip type monolithic IC on a hybrid circuit board through bumps and is packaged with a thermosetting resin through transfer molding. The transfer molding resin has a linear expansion coefficient of 3×10⁻⁶ to 17×10⁻⁶ and contains a filler having a particle size smaller than a height of the bump by more than 10 μm. The resin sealed electronic device is integrated in a unit including the hybrid circuit board mounting the flip chip type monolithic IC through transfer molding with the transfer molding resin, and the bump is restrained from moving by the transfer molding resin flowing around at transfer-molding.

Claims

1. A resin sealed electronic device which mounts a flip chip type monolithic IC on a hybrid circuit board through bumps, and is packaged with a thermosetting resin through transfer molding, wherein

said thermosetting resin used for the transfer molding (hereinafter, referred to as “

transfer molding resin”

) has a linear expansion coefficient of 3×

10<sup>−

6</sup> to 17×

10<sup>−

6</sup> and contains a filler having a particle size smaller than a height of the bump by more than 10 μ

m, and

said resin sealed electronic device is integrated in a unit including the hybrid circuit board mounting the flip chip type monolithic IC through transfer molding with said transfer molding resin.

2. A resin sealed electronic device according to claim 1, wherein

size of said filler is smaller than 75 μ m.

3. A resin sealed electronic device according to any one of claim 1, wherein

said bump is soldered to a conductor wire on the hybrid circuit board, and surfaces of said bump except for a surface to be soldered are coated, and said transfer molding resin is thermally set on said coated surfaces.

4. A resin sealed electronic device according to any one of claim 1, wherein

said transfer molding resin uses an epoxy resin.

5. A resin sealed electronic device according to any one of claim 1, wherein

said hybrid circuit board is mounted on a lead frame of copper group;

a power system semiconductor element being mounted at a position on said lead frame other than the board mounting portion using a solder or an electric conductive adhesive;

a bonding pad portion provided on said circuit board being connected to a bonding pad portion of the semiconductor element by wire bonding; and

an external output terminal portion formed in said lead frame being connected to said circuit board similarly by wire bonding.

6. A resin sealed electronic device according to any one of claim 1, wherein

a ceramic substrate of alumina group having a conductor of silver/platinum group or a conductor of copper group is used for said hybrid circuit board;

and

a high temperature solder of lead/tin group is used for the solder in the bump portion of the flip chip and the solder used for mounting discrete parts mounted on the board.

7. A resin sealed electronic device according to any one of claim 1, wherein

a ceramic substrate of alumina group having a conductor of silver/platinum group or a conductor of copper group is used for said hybrid circuit board;

and

a high temperature solder of silver/tin group is used for the solder in the bump portion of the flip chip and similarly the solder used for mounting discrete parts mounted on the board.

8. A resin sealed electronic device according to any one of claim 1, wherein

a high heat resistance glass-epoxy substrate having a linear expansion coefficient smaller than 17×

10<sup>−

6</sup> is used for the hybrid circuit board, and

a high temperature solder of silver/tin group is used for the solder in the bump portion of the flip chip and similarly the solder used for mounting discrete parts mounted on the board.

9. A resin sealed electronic device according to any one of claim 7, wherein

said solder of silver/tin group used contains silver of 1 to 5%.

10. A resin sealed electronic device which mounts a flip chip type monolithic IC on a hybrid circuit board through bumps, and is packaged with a transfer molding resin, wherein

said resin sealed electronic device is integrated in a unit including the hybrid circuit board mounting the flip chip type monolithic IC through transfer molding with said transfer molding resin, and

said bump is restrained from moving by the transfer molding resin flowing around at transfer-molding.

11. A resin sealed electronic device which mounts a flip chip type monolithic IC on a hybrid circuit board through bumps, and is packaged with a transfer molding resin, wherein

said resin sealed electronic device is integrated in a unit including the hybrid circuit board mounting the flip chip type monolithic IC through transfer molding with said transfer molding resin, and

a gap between said flip chip type monolithic IC and said hybrid circuit board is filled with said transfer molding resin flown around at transfer molding excluding voids or including voids.

12. A method of fabricating a resin sealed electronic device which mounts a flip chip type monolithic IC on a hybrid circuit board through bumps, and is packaged with a transfer molding resin, the method comprising the steps of:

performing molding using said transfer molding resin having a linear expansion coefficient of 3×

10<sup>−

6</sup> to 1×

10<sup>−

6</sup> and containing a filler having a particle size smaller than a height of the bump by more than 10 μ

m; and

exerting a transfer molding pressure at said molding so that said transfer molding resin is let flow around between said flip chip type monolithic IC and said hybrid circuit board.

13. A method of fabricating a resin sealed electronic device according to claim 12, wherein

said transfer molding resin uses an epoxy resin and said epoxy resin is octo-cresol novolak type epoxy resin, and

a glass transition point temperature of said epoxy resin is higher than 150° C.

14. A method of fabricating a resin sealed electronic device according to claim 13, wherein

said epoxy resin contains silicone of 1 to 8%.

15. A method of fabricating a resin sealed electronic device according to claim 12, wherein

said filler is composed of cubicle molten silica particles, spherical molten silica particles or a mixture of the molten silica particles.

16. An internal combustion engine ignition coil device comprising a resin sealed electronic device which mounts a flip chip type monolithic IC on a hybrid circuit board through bumps, and is packaged with a transfer molding resin, wherein

said resin sealed electronic device comprises a flip chip type monolithic IC having a size smaller than 5 mm×

5 mm;

a molding body integrated in a unit including the hybrid circuit board mounting the flip chip type monolithic IC through transfer molding with the transfer molding resin; and

a structure that said molding body is embedded into the coil main body with a molding resin having a thermal expansion coefficient larger than a thermal expansion coefficient of said transfer molding resin, and a transfer molding resin portion composing said molding body shows a continuous uniform stress diagram including the transfer molding resin portion between the flip chip type monolithic IC and the hybrid circuit board.