Method for fabricating molded microstructures on substrates

• US 6,322,736 B1
• Filed: 09/09/1999
• Issued: 11/27/2001
• Est. Priority Date: 03/27/1998
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Inventors: Bao, Zhenan, Rogers, John A.
• Primary Examiner(s): ORTIZ, ANGELA Y
• Application Number:
  US09/393,032
• Time in Patent Office: 810 Days
• Field of Search: 264/250, 264/251, 264/254, 264/104, 264/105, 264/219, 264/225, 264/337, 264/338, 264/328.4, 264/328.5, 264/272.11, 425/116, 425/117, 425/120, 425/463, 425/464, 425/543, 425/544
• US Class Current: 264/105
• CPC Class Codes: B29C 33/0061 characterised by the configuration of the material feeding channel sprue channels for injection moulding B29C45/27
• CPC Class Codes: B29C 33/405 Elastomers, e.g. rubber B29C33/50 takes precedence
• CPC Class Codes: B29C 33/42 characterised by the shape of the moulding surface, e.g. ribs or grooves
• CPC Class Codes: B29C 39/24 Feeding the material into the mould
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

An improved elastomeric mold for use in fabricating microstructures, the mold having first and second surfaces, the first surface including at least one recessed microchannel and the second surface including an access opening or filling member that extends through the mold to the first surface and communicates with the recessed microchannel. The mold is used by placing it onto a substrate with the recessed microchannel facing the substrate. The access opening of the mold is filled with a liquid material which is capable of solidifying. The access opening continuously introduces the liquid material into the space defined between the microchannel and the substrate. After the liquid material solidifies, the mold is removed from the substrate thereby leaving a microstructure formed from the solidified liquid material on the substrate.

Claims

1. A method for fabricating a microstructure, the method comprising the steps of:

(a) providing a substrate for supporting the microstructure;

(b) providing an elastomeric mold having first and second surfaces, the first surface including at least one recessed microchannel and the second surface including a mold filling member that extends through the mold to the first surface and communicates with the recessed microchannel;

(c) placing the mold onto the substrate with the recessed microchannel facing the substrate;

(d) filling the mold filling member of the mold with a liquid material which is capable of solidifying, the filling member continuously introducing the liquid material into the microchannel; and

(e) removing the mold from the substrate after the liquid material solidifies thereby leaving a microstructure formed from the solidified liquid material on the substrate, the microstructure having a shape and dimensions defined by the microchannel.

2. The method according to claim 1, wherein the substrate in step (a) includes a plurality of microstructures.

3. The method according to claim 2, wherein the plurality of microstructures are elements of a microelectronic device.

4. The method according to claim 1, wherein the minimum dimension of the microstructure is substantially less than 100 μ

m.

5. The method according to claim 1, wherein the minimum dimension of the microstructure is approximately 0.05 μ

m.

6. The method according to claim 1, wherein the mold is made from polydimethylsiloxane.

7. The method according to claim 1, wherein the mold filling member comprises a syringe that extends through the mold to the first surface and communicates with the recessed microchannel.

8. The method according to claim 1, wherein the mold filling member comprises an access opening that extends through the mold to the first surface and communicates with the recessed microchannel.

9. The method according to claim 1, wherein the first surface of the mold includes a recessed microcavity, the microchannel communicating with the filling member and the recessed microcavity, the microstructure formed from the solidified liquid material on the substrate having a shape and dimensions defined by the microchannel and the microcavity.

10. The method according to claim 1, wherein the first surface of the mold includes at least a second microchannel communicating with the filling member, the mold filling member continuously introducing the liquid material into the second microchannel during the filling step, whereby a second microstructure formed from the material remains on the substrate after the mold removal step, the second microstructure having a shape and dimensions defined by the second microchannel.

11. The method according to claim 1, wherein the first surface of the mold includes at least a second microchannel and the second surface of the mold includes at least a second mold filling member that extends through the mold to the first surface and communicates with the second microchannel, the filling step including filling the second mold filling member with the liquid material, the second mold filling member continuously introducing the liquid material into the second microchannel whereby a second microstructure formed from the solidified liquid material remains on the substrate after the mold removal step, the second microstructure having a shape and dimensions defined by the second microchannel.

12. The method according to claim 1, wherein the first surface of the mold includes at least a second microchannel, and the second surface of the mold includes at least a second mold filling member the extends through the mold to the first surface and communicates with the second microchannel, the filling step including the step of filling the second mold filling member with a second different liquid material which is capable of solidifying, the second mold filling member continuously introducing the second liquid material into the second microchannel whereby a second microstructure formed from the solidified second liquid material remains on the substrate after the mold removal step, the second microstructure having a shape and dimensions defined by the second microchannel.

13. The method according to claim 1, further comprising the step of providing at least a second substrate and using the mold provided in step (b) to perform steps (c)-(e) on the second substrate to produce a microstructure on the second substrate.

14. The method according to claim 1, wherein the filling step includes the step of pressurizing the solution contained within the mold filling member.

15. The method according to claim 1, wherein the filling step includes the step of applying a vacuum to the recessed microchannel to draw the solution from the mold filling member into the microchannel.

16. The method according to claim 1, wherein the filling step is performed with an automatic filling device.

17. The method according to claim 16, wherein the automatic filling device includes one of a screen printer and ink jet printer.

18. The method according to claim 1, wherein the material in the liquid material comprises a colloidal suspension of electrically conductive particles.

19. The method according to claim 1, wherein the material in the liquid material comprises a conductive polymer.