Method for fabricating a memory card

• US 6,323,064 B1
• Filed: 01/04/2000
• Issued: 11/27/2001
• Est. Priority Date: 10/11/1999
• Status: Expired due to Term

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Joon Ki, Ha, Woon Ky
• Primary Examiner(s): Lebentritt, Michael
• Application Number:
  US09/476,918
• Time in Patent Office: 693 Days
• Field of Search: 438/117, 438/118, 438/127
• US Class Current: 438/117
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 1/117 : Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/0746 : Protection against transients, e.g. layout adapted for plugging of connector
• CPC Class Codes: H05K 2201/094 : Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads using different types of conductors H05K2201/0391
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence

Abstract

A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips. The fabrication process for the memory cards begins with fabrication of a multi-substrate that includes several unit substrates. At least one semiconductor chip is provided on each unit substrate and electrically connected. A continuous resin-molded layer is then formed to extend over the unit substrates. Separating the unit substrates of the multi-substrate divides the continuous resin-molded layer into individual resin-molded units and provides the memory cards.

Claims

1. A method for fabricating a plurality of memory cards, the method comprising:

providing a substrate that includes a plurality of unit substrates, each unit substrate corresponding to one of the memory cards, wherein each unit substrate has circuit wiring on a first face, and contact pads on a second face, the contact pads being electrically connected to the circuit wiring;

attaching a plurality of semiconductor chips on the unit substrates;

electrically connecting the semiconductor chips to the circuit wiring on the unit substrates;

forming a molded layer on the substrate so as to cover the semiconductor chips and the circuit wiring on the substrate; and

separating the substrate with the molded layer into the memory cards, wherein each of the memory cards includes one of the unit substrates.

2. A method of claim 1, wherein providing the substrate comprises forming at least two groups of the unit substrates on the substrate, each group having the unit substrates arranged side by side.

3. A method of claim 2, wherein forming the molded layer comprises:

setting the substrate in a mold which has at least two cavities each covering all unit substrates in a corresponding one of the groups;

injecting a molding resin into the cavities to form the molded layer over one of the groups and a second molded layer over another of the groups; and

taking the substrate out of the mold after the molding resin hardens.

4. A method of claim 1, wherein attaching the plurality of semiconductor chips comprises providing from one to eight of the semiconductor chips to the first face of each unit substrate.

5. A method of claim 1, wherein attaching the plurality of semiconductor chips comprises attaching at least two of the semiconductor chips to the first face of each unit substrate.

6. A method of claim 1, wherein attaching the plurality of semiconductor chips comprises attaching at least one of the semiconductor chips to the first face of each unit substrate and then stacking at least one other of the semiconductor chips onto the attached chips.

7. A method of claim 1, wherein forming the molded layer comprises:

setting the substrate in a mold that has a cavity covering all of the unit substrates;

injecting a molding resin into the cavity to form the molded layer; and

taking the substrate out of the mold after the molding resin hardens.

8. A method of claim 1, further comprising, after separating the substrate with molded layer, finishing the molded layer of each memory card so that the molded layer of each of the memory cards includes an inclined plane at one edge and a groove next to an opposite edge.

9. The method of claim 1, wherein the molded layer on the substrate is formed such that the molded layer of each of the memory cards includes an inclined plane at one edge and a groove next to an opposite edge.

10. A method for fabricating a plurality of memory cards, the method comprising:

providing a substrate that includes a plurality of unit substrates, each unit substrate corresponding to one of the memory cards, wherein each unit substrate has circuit wiring on a first face, and contact pads on a second face, the contact pads being electrically connected to the circuit wiring;

attaching a plurality of semiconductor chips on the unit substrates;

electrically connecting the semiconductor chips to the circuit wiring on the unit substrates;

forming a molded layer on the substrate so as to cover the semiconductor chips and the circuit wiring on the substrate; and

separating the substrate with the molded layer into the memory cards, wherein each of the memory cards includes one of the unit substrates,

wherein the molded layer on the substrate is formed such that the molded layer of each of the memory cards includes an inclined plane at one edge and a groove next to an opposite edge.