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Package for sealing an integrated circuit die

  • US 6,323,550 B1
  • Filed: 06/06/1995
  • Issued: 11/27/2001
  • Est. Priority Date: 06/06/1995
  • Status: Expired due to Term
First Claim
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1. A semiconductor assembly comprising:

  • a die having a substrate and a movable member suspended over the substrate;

    a cap bonded over the face of the die, the cap having an outer perimeter that surrounds and seals the member, the member and the cap defining a space therebetween so that the cap does not contact the member; and

    a plastic package encapsulating the die and the cap, the plastic contacting the cap and not the member, the seal being sufficient to prevent plastic from contacting the member when the die is packaged.

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