Apparatus capable of high power dissipation during burn-in of a device under test
First Claim
1. An apparatus for dissipating power from an integrated circuit, comprising:
- a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
a heat sink in thermal contact with a cooling medium;
a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket, wherein said thermal interface is mechanically adjustable and includes an outer layer comprising a metal foil; and
a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.
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Accused Products
Abstract
A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.
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Citations
5 Claims
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1. An apparatus for dissipating power from an integrated circuit, comprising:
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a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
a heat sink in thermal contact with a cooling medium;
a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket, wherein said thermal interface is mechanically adjustable and includes an outer layer comprising a metal foil; and
a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.
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2. An apparatus for dissipating power from an integrated circuit, comprising:
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a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
a heat sink in thermal contact with a cooling medium;
a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket, wherein said thermal interface comprises an amount of a low melting point metal contained in a foil skin; and
a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.
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3. An apparatus for dissipating power from an integrated circuit, comprising:
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a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
a heat sink in thermal contact with a cooling medium;
a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket, wherein said thermal interface comprises an amount of a low melting point metal contained in a foil skin, wherein said foil skin has a perimeter that is sealed to said heat spreader; and
a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.
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4. An apparatus for dissipating power from an integrated circuit, comprising:
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a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
a heat sink in thermal contact with a cooling medium;
a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket; and
a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.
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5. An apparatus for dissipating power from an integrated circuit, comprising:
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a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;
a heat sink in thermal contact with a liquid-vapor cooling system;
a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket; and
a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.
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Specification