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Apparatus capable of high power dissipation during burn-in of a device under test

  • US 6,323,665 B1
  • Filed: 10/06/1998
  • Issued: 11/27/2001
  • Est. Priority Date: 10/07/1997
  • Status: Expired due to Fees
First Claim
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1. An apparatus for dissipating power from an integrated circuit, comprising:

  • a socket capable of receiving and supporting a DUT carrying the integrated circuit, said socket including electrical leads for connecting to corresponding leads on said DUT;

    a heat sink in thermal contact with a cooling medium;

    a heat spreader in thermal contact with said heat sink and with said DUT, said heat spreader including a thermal interface in releasable mechanical and thermal contact with the DUT in the socket, wherein said thermal interface is mechanically adjustable and includes an outer layer comprising a metal foil; and

    a heater and a thermocouple, said heater and said thermocouple being adjacent to said thermal interface, said heater being controlled in response to output from said thermocouple.

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