Printed wiring board and assembly of the same

• US 6,324,067 B1
• Filed: 04/20/2000
• Issued: 11/27/2001
• Est. Priority Date: 11/16/1995
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nishiyama, Tousaku
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US09/553,557
• Time in Patent Office: 586 Days
• Field of Search: 361/748, 361/749, 361/761, 361/763, 361/764, 361/773, 361/774, 361/782, 361/783, 361/792, 361/795, 361/760, 361/762, 361/767, 361/768, 361/793, 257/668, 257/700, 257/701-703, 257/723, 257/724, 257/737, 257/738, 257/686, 257/778, 174/256, 174/258, 174/260, 174/262, 174/263, 174/264, 438/612, 438/613, 438/108, 438/109, 438/125-127, 428/209-211, 428/321.3, 428/304.4, 428/901, 427/97, 216/18, 216/19, 298/29, 298/30, 298/46, 298/52, 298/32, 298/40, 298/41
• US Class Current: 361/761
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/10083 Electromechanical or electro-acoustic component, e.g. microphone
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4697 having cavities, e.g. for mounting components H05K3/4691 takes precedence
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/249953 Composite having voids in a component [e.g., porous, cellular, etc.]
• CPC Class Codes: Y10T 428/249996 Ink in pores

Abstract

A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess is formed in one part of a PWB and components are received in this recess. The components are lower than the surface of the PWB. A conductive pad is provided to the bottom of the recess and a connecting terminal and the conductive pad are electrically connected by using a solder ball or a conductive adhesive material. The recess is formed by partially removing one or more layers of plural conductive layers and insulating layers which make up the multilayer PWB.

Claims

1. A printed wiring board assembly, comprising an electrical component and a multi-layered printed wiring board, said electrical component being placed in a recess formed in the multi-layered printed wiring board, said multi-layered printed wiring board comprising conductive layers and a plurality of insulating resin-based layers laminated alternately with said conductive layers and having a via hole formed therein, wherein

a connecting terminal is provided on a bottom portion of the electrical component which is electrically connected to a conductive pad within said recess by means of a two-stage protruding electrode and a conductive adhesive material, and

said conductive pad is electrically connected to said via hole.

2. The printed wiring board assembly according to claim 1, wherein the electrical component received in the recess of said multi-layered printed wiring board is substantially lower than an exterior surface of said multi-layered printed wiring board.

3. A printed wiring board assembly according to claim 1, wherein the recess of said printed wiring board is filled with a sealing resin.

4. A printed wiring board assembly according to claim 1, wherein said printed multi-layered wiring board comprises a insulating layer made of a compressible porous base material impregnated with resin.