Integrated wafer temperature sensors
First Claim
1. A parameter measuring structure, comprising:
- a substrate having opposing external surfaces, a plurality of elongated cavities within the substrate between the opposing surfaces, the cavities individually having lengths defined by first and second ends, the second cavity ends being spaced apart from each other in directions across the surfaces, a plurality of optical sensors of the parameter positioned within the individual cavities adjacent their respective second ends, and at least one optical fiber entering the first ends of individual ones of the plurality of cavities from outside of the substrate and extending along the lengths of the cavities with ends of the optical fibers being coupled to the optical sensors of their respective cavities.
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Accused Products
Abstract
Systems and methods are described for integrated (embedded) semiconductor wafer temperature measurement equipment and processes. An integrated wafer temperature measurement apparatus, comprising: a substrate; a placement resource formed in said substrate; a sensor lead located in said placement resource, said sensor lead having a first end and a second end; a sensor coupled to said first end of said sensor lead and located in said placement resource; and a sensor lead cover coupled to said substrate. The systems and methods provide advantages in that reliability is enhanced, installation and removal are facilitated, and accuracy is improved by obviating any shadowing of the substrate and reducing temperature gradients near the sensor.
115 Citations
41 Claims
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1. A parameter measuring structure, comprising:
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a substrate having opposing external surfaces, a plurality of elongated cavities within the substrate between the opposing surfaces, the cavities individually having lengths defined by first and second ends, the second cavity ends being spaced apart from each other in directions across the surfaces, a plurality of optical sensors of the parameter positioned within the individual cavities adjacent their respective second ends, and at least one optical fiber entering the first ends of individual ones of the plurality of cavities from outside of the substrate and extending along the lengths of the cavities with ends of the optical fibers being coupled to the optical sensors of their respective cavities. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A test structure for measuring a distribution of temperature thereacross, comprising:
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a substrate having opposing external surfaces that are flat and parallel to each other, a plurality of elongated cavities within the substrate between the opposing surfaces that extend in a direction parallel to said surfaces, the cavities individually having lengths defined by first and second ends, the second cavity ends being spaced apart from each other in directions across the surfaces, a plurality of optical temperature sensors positioned within the individual cavities at their respective second ends, a plurality of optical fibers including at least one optical fiber entering the first end of each of the plurality of cavities from outside of the substrate and extending along the length of its respective cavity to a position adjacent the second end of the cavity and coupled to the optical temperature sensor thereat, and light opaque material positioned with respect to the individual optical temperature sensors to block light from reaching said sensors from outside of the test structure. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification