Polymer based circuit

• US 6,326,544 B1
• Filed: 01/20/1999
• Issued: 12/04/2001
• Est. Priority Date: 02/05/1996
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Lake, Rickie Charles
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): Ngo, Hung V
• Application Number:
  US09/234,342
• Time in Patent Office: 1,049 Days
• Field of Search: 174/52.2, 174/52.4, 257/787, 257/788, 257/789, 257/790, 257/791, 257/792, 257/793, 257/794, 264/272.11
• US Class Current: 174/546
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0145 Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A polymer based circuit production method provides a polymer based circuit by exposing a surface of a polymer substrate to ultraviolet radiation resulting in an adhesion promoted polymer substrate surface. A circuit is fabricated on the polymer substrate surface and a coating material is applied to at least a portion of the adhesion promoted polymer substrate surface. A portion of the circuit fabricated on the polymer substrate surface may be encapsulated. The polymer based circuit resulting from the method includes a polymer substrate having an ultraviolet radiation treated surface, a circuit formed on the polymer substrate surface, and a coating material encapsulating at least a portion of the at least one circuit between the polymer substrate and the coating material.

Claims

1. A polymer based circuit comprising:

a polymer substrate having an ultraviolet radiation treated surface;

at least one circuit formed on the polymer substrate surface; and

a coating material cured on at least a portion of the ultraviolet radiation treated surface encapsulating at least a portion of the at least one circuit.

2. The circuit according to claim 1, wherein the polymer substrate is a polyester film.

3. The circuit according to claim 1, wherein the coating material is an epoxy.

4. The circuit according to claim 3, wherein the epoxy has a hardness greater than about 30, Shore D.

5. The circuit according to claim 4, wherein the epoxy has a hardness greater than about 60, Shore D.

6. The circuit according to claim 5, wherein the epoxy has a hardness more preferably in the range of about of about 80 to about 90, Shore D.

7. The circuit according to claim 1, wherein the entire at least one circuit is encapsulated.

8. The circuit according to claim 1, wherein the at least one circuit includes circuit components mounted on the polymer substrate and wherein the coating material individually encapsulates one or more of the circuit components.

9. The circuit according to claim 1, wherein the at least one circuit includes a plurality of separate circuits, the coating material encapsulating one or more of the separate circuits.

10. A polymer based circuit comprising:

a polymer substrate having an ultraviolet radiation treated surface;

at least one circuit formed on the polymer substrate; and

a coating material cured in a predefined pattern on at least a portion of the ultraviolet radiation treated surface.

11. The circuit according to claim 10, wherein the polymer substrate is a polyester film.

12. The circuit according to claim 10, wherein the coating material is an epoxy.

13. The circuit according to claim 12, wherein the epoxy has a hardness greater than about 30, Shore D.

14. The circuit according to claim 13, wherein the epoxy has a hardness greater than about 60, Shore D.

15. The circuit according to claim 14, wherein the epoxy has a hardness more preferably in the range of about of about 80 to about 90, Shore D.