Apparatus for removing an insulating layer from a portion of a conductor

• US 6,326,587 B1
• Filed: 07/30/1999
• Issued: 12/04/2001
• Est. Priority Date: 11/05/1996
• Status: Expired due to Term

• Current Assignee: Intermedics Incorporated (Boston Scientific Corporation)
• Original Assignee: Intermedics Incorporated (Boston Scientific Corporation)
• Inventors: Cardineau, Yan, Frankovich, Mark M.
• Primary Examiner(s): Evans, Geoffrey S.
• Application Number:
  US09/365,353
• Time in Patent Office: 858 Days
• Field of Search: 219/121.68, 219/121.69, 219/121.85, 427/554, 427/555, 427/556, 264/400
• US Class Current: 219/121.68
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: H02G 1/128 using radiant energy, e.g. a laser beam

Abstract

An apparatus for using a laser beam to remove or ablate an insulating coating from a desired segment of an insulating coating from a desired segment of an insulated conductor (wire) without damaging or causing mechanical stress to the wire. A lens can be used to focus the laser beam at a focal point and a support to locate the insulated conductor in a position between the lens and the focal point in a path of the laser bean. A reflector can be aligned with the opening so as to reflect the laser beam portion back toward the conductor. The support can include a generally planar coil guide such as a Y-shaped groove.

Claims

1. Am apparatus for removing an insulating layer from a portion of a conductor that is sheathed in the insulating layer without damaging the conductor, comprising:

a laser beam source for emitting a laser beam;

a lens for focusing the laser beam at a focal point; and

a support to locate the conductor in a position between the lens and the focal point in a path of said laser beam, wherein said support includes a generally planar coil guide.

2. The apparatus according to claim 1 wherein said support is configured to allow passage of at least a portion of said laser beam beyond said support.

3. The apparatus according to claim 2 wherein said support includes an opening therethrough to allow the passage of at least a portion of said laser beam.

4. The apparatus according to claim 2, further including a reflector positioned in the path of said laser beam beyond said processing position and aligned so as to reflect said laser beam portion.

5. The apparatus according to claim 4, wherein said reflector reflects said laser beam portion back toward said conductor.

6. The apparatus according to claim 4 wherein said reflector is concave.

7. The apparatus according to claim 1, wherein the lens is located between said laser beam source and said support.

8. The apparatus according to claim 7 wherein said lens focuses said laser beam at a point between about 2 inches to about 25 inches beyond the lens.

9. The apparatus according to claim 1 wherein the insulating layer is completely removed from the conductor portion by the laser beam.

10. The apparatus according to claim 1 wherein said generally planar coil guide includes a groove.

11. The apparatus according to claim 1, wherein said coil guide comprises a generally Y-shaped groove.

12. The apparatus according to claim 11 wherein said Y-shaped groove comprises a substantially straight main guide and two minor guides and one of said minor guides is an extension of said major guide.

13. The apparatus according to claim 1 further including means for moving said support through said beam.

14. The apparatus according to claim 1 further including means for moving said beam across said support.

15. The apparatus of claim 1, further comprising a reflector positioned in the path of the laser beam, the focal point located between the conductor and the reflector.

16. The apparatus of claim 1, wherein the focal point is located between about 2 inches to about 25 inches beyond the lens.

17. An apparatus for removing an insulating layer from a portion of a conductor that is sheathed in the insulating layer without damaging the conductor, comprising:

a laser beam source for emitting a laser beam;

a support for supporting the conductor in a desired position, said support including an opening to allow the passage therethrough of at least a portion of said laser beam, and wherein said support includes a generally planar coil guide;

a beam orienting apparatus directing said laser beam onto the conductor portion, said beam orienting apparatus including a lens positioned between said laser beam source and said conductor, said lens focusing said laser beam at a point somewhat beyond said conductor;

a reflector aligned with said opening so as to reflect said laser beam portion back toward said opening.

18. The apparatus according to claim 17 wherein said reflector is concave.

19. The apparatus according to claim 17 wherein a focal point of the lens is located between the conductor and the reflector.

20. The apparatus according to claim 17 wherein a focal point of the lens is between about 2 inches to about 25 inches beyond the lens.

21. The apparatus according to claim 17 wherein said generally planar coil guide includes a groove.

22. An apparatus for removing an insulating layer from a portion of a conductor, the apparatus comprising:

a laser beam source for emitting a laser beam;

a support to locate the conductor in a desired processing position in a path of said laser beam, wherein said support includes a generally planar coil guide; and

a lens between said laser beam source and said support, wherein said lens focuses said laser beam at a point beyong said conductor.

23. The apparatus of claim 22, wherein said support is configured to allow passage of at least a portion of said laser beam beyond said support.

24. The apparatus according to claim 22, wherein said support includes an opening therethrough to allow the passage of at least a portion of said laser beam.

25. The apparatus according to claim 22, further including a reflector positioned in the path of said laser beam beyond said processing position and aligned so as to reflect said laser beam portion.

26. The apparatus according to claim 25, wherein said reflector reflects said laser beam portion back toward said conductor.

27. The apparatus according to claim 25 wherein said reflector is concave.

28. The apparatus according to claim 22 further including means for moving said support through said beam.

29. The apparatus according to claim 22 further including means for moving said beam across said support.

30. The apparatus of claim 22, further comprising a reflector positioned in the path of the laser beam, the focal point located between the conductor and the reflector.

31. The apparatus of claim 22, wherein the focal point is located between about 2 inches to about 25 inches beyond the lens.

32. An apparatus for removing an insulating layer from a portion of a conductor that is sheathed in the insulating layer without damaging the conductor, comprising:

a laser beam source for emitting a laser beam; and

a support to locate the conductor in a desired processing position in the path of said laser beam, said support including a generally planar coil guide.

33. The apparatus according to claim 32 wherein said coil guide comprises a generally Y-shaped groove.

34. The apparatus according to claim 33 wherein said Y-shaped groove comprises a substantially straight main guide and two minor guides and one of said minor guides is an extension of said major guide.

35. The apparatus according to claim 32 further including means for moving said support through said beam.

36. The apparatus according to claim 32 further including means for moving said beam across said support.

37. The apparatus of claim 32, wherein said support is configured to allow passage of at least a portion of said laser beam beyond said support.

38. The apparatus according to claim 32, wherein said support includes an opening therethrough to allow the passage of at least a portion of said laser beam.