Encapsulation of microelectronic assemblies
First Claim
1. A method of encapsulating a plurality of microelectronic assemblies having oppositely-facing top and bottom surfaces comprising the steps of:
- (a) providing said assemblies within an opening in a frame having top and bottom surfaces, and providing top and bottom sealing layers sealingly connected to the frame extending across the opening of the frame, said top and bottom sealing layers defining an enclosed space encompassing said assemblies;
(b) engaging the frame, sealing layers and assemblies between top and bottom fixture elements; and
(c) injecting a liquid encapsulant between the sealing layers and around the assemblies while the frame, sealing layer and assemblies are engaged between the top and bottom fixture elements, said sealing layers and frame containing the liquid encapsulant; and
(d) curing the liquid encapsulant.
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Accused Products
Abstract
Microelectronic assemblies are encapsulated using disposable frames. The microelectronic assemblies are disposed within an aperture defined by a frame. The aperture is covered by top and bottom sealing layers so that the frame and sealing layers define an enclosed space encompassing the assemblies. The encapsulant is injected into this closed space. The frame is then separated from the encapsulation fixture and held in a curing oven. After cure, the frame is cut apart and the individual assemblies are severed from one another. Because the frame need not be held in the encapsulation fixture during curing, the process achieves a high throughput.
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Citations
38 Claims
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1. A method of encapsulating a plurality of microelectronic assemblies having oppositely-facing top and bottom surfaces comprising the steps of:
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(a) providing said assemblies within an opening in a frame having top and bottom surfaces, and providing top and bottom sealing layers sealingly connected to the frame extending across the opening of the frame, said top and bottom sealing layers defining an enclosed space encompassing said assemblies;
(b) engaging the frame, sealing layers and assemblies between top and bottom fixture elements; and
(c) injecting a liquid encapsulant between the sealing layers and around the assemblies while the frame, sealing layer and assemblies are engaged between the top and bottom fixture elements, said sealing layers and frame containing the liquid encapsulant; and
(d) curing the liquid encapsulant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A method of fabricating a plurality of semiconductor chip assemblies comprising the steps of:
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(a) attaching a plurality of semiconductor chips to a bottom surface of a unitary tape and electrically connecting said chips to terminals exposed at a top surface of said tape while said tape is held on a frame so as to provide a plurality of semiconductor chip assemblies, each including one or more of said chips and a region of the tape associated therewith, said chips being disposed in an aperture enclosed by said frame;
(b) applying a top sealing layer on said top surface of said tape and on a top surface of the frame;
(c) applying a bottom sealing layer on bottom surfaces of said chips facing away from said tape and on a bottom surface of said frame; and
(d) injecting a liquid encapsulant around said chips so that the encapsulant contacts the chips and the tape; and
(e) curing the encapsulant, said frame and said sealing layers confining said encapsulant during said curing step and preventing said encapsulant from contacting the bottom surfaces of the chips and the top surface of the tape. - View Dependent Claims (38)
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Specification