LED luminaire with light control means

• US 6,331,063 B1
• Filed: 11/25/1998
• Issued: 12/18/2001
• Est. Priority Date: 11/25/1997
• Status: Expired due to Fees

• Current Assignee: Panasonic Electric Works Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Asahi Matsushita Electric Works Ltd. (Panasonic Holdings Corporation)
• Inventors: Koyama, Shoichi, Akiniwa, Taishi, Suzuki, Toshiyuki, Tanaka, Takashi, Kamada, Kazuo, Yamamoto, Shohei, Sugimoto, Masaru, Hashizume, Jiro, Shiohama, Eiji, Asahi, Nobuyuki
• Primary Examiner(s): O'Shea, Sandra
• Assistant Examiner(s): Negron, Ismael
• Application Number:
  US09/199,893
• Time in Patent Office: 1,119 Days
• Field of Search: 362/800, 362/227, 362/235-237, 362/34, 362/84
• US Class Current: 362/237
• CPC Class Codes: F21V 5/02 of prismatic shape F21V5/04 takes precedence
• CPC Class Codes: F21Y 2105/00 Planar light sources
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/10 on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
• CPC Class Codes: F21Y 2107/50 on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Abstract

An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

Claims

1. An LED luminaire comprising:

a resin molded substrate provided at least on one surface thereof with light distribution control means for controlling the distribution of light in a desired direction and with a wiring circuit in a desired pattern, and

a plurality of LED chips mounted at least on the one surface of the substrate respectively and connected to the wiring circuit and in correspondence to the light distribution control means and wiring circuit,

wherein the light distribution control means comprises at least one uneven surface of the substrate and wherein the LED chips are mounted on the uneven surface with each LED chip having a p-n junction plane disposed substantially in conformity to the desired direction of the light distribution, the uneven surface of the substrate including a plurality of holes penetrating through the substrate from the one surface to the other, and the LED chips are mounted respectively in each of the through holes with the p-n junction planes disposed in conformity to penetrating direction of the holes.

2. The luminaire according to claim 1 wherein the uneven surface of the substrate comprises a paraboloid formed as a light reflecting surface which concentrates the emission direction of the respective LED chips to the desired direction, and the LED chips are mounted on the paraboloid with the p-n junction plane disposed substantially perpendicularly to the paraboloid.

3. The luminaire according to claim 1 wherein the uneven surface of the substrate comprises projections provided to surround the mounting position of each LED chip and forming slopes facing toward each LED chip, the wiring circuit extending across the projections and along the slopes provides a light reflecting surface, and the LED chips are mounted at the mounting position with their projection planes disposed substantially perpendicular with respect to the surface of the substrate surrounded by the projections to be in conformity to the desired direction of the light distribution.

4. The luminaire according to claim 1 wherein the uneven surface of the substrate comprises a multilayered protrusion in one of stepwise and spiral staircase shapes which sequentially protruding from a peripheral part to a central part of the substrate and the LED chips are mounted on flat parts of the protrusion with their p-n junction planes disposed substantially perpendicular with respect to the flat parts of the protrusion.

5. The luminaire according to claim 1 wherein the uneven surface of the substrate is provided also on the other surface of the substrate together with the light distribution control means and wiring circuit.

6. The luminaire according to claim 1 wherein the uneven surface of the substrate comprises a plurality of dents respectively for mounting therein each of the LED chips with their p-n junction planes disposed substantially perpendicular with respect to inner bottom faces of the dents and the respective dents have on their inner surfaces a fluorescent substance layer of a luminous color for obtaining desired luminous color of the luminaire as mixed with the luminous color of each LED chip.

7. The luminaire according to claim 1 wherein the uneven surface of the substrate is formed as a whole in a concave surface including a plurality of protrusions, and the LED chips are respectively mounted on each of the protrusions with their p-n junction planes disposed substantially perpendicular with respect to the concave substrate.

8. An LED luminaire comprising:

a resin molded substrate provided at least on one surface e thereof with means for controlling the distribution of light in a desired direction and with a wiring circuit in a desired pattern, and

a plurality of LED chips mounted at least on said one surface of the substrate respectively as connected to the wiring circuit and in correspondence to the light distribution control means and wiring circuit;

wherein the light distribution control means comprises an uneven surface provided at least to said one surface of the substrate, the surface having the wiring circuit and the LED chips mounted thereon, and

wherein the uneven surface comprises an undulated surface saw-toothed in section, the saw-toothed surface including slopes on which the LED chips are mounted and which are angled for leading the direction of emission of at a predetermined number of the LED chip to a desired direction.

9. The luminaire according to claim 8 wherein the slopes of the saw-toothed undulated surface are at a fixed angle for leading the emission direction to be mutually parallel to be in a single direction.

10. The luminaire according to claim 8 wherein the slopes of the saw-toothed undulated surface are angled as sequentially varied for concentrating the emission direction of the respective LED chips to a desired direction.

11. An LED luminaire comprising a plurality of LED chips, a substrate on which the plurality of LED chips are mounted, and a light control means provided to the substrate for controlling the distribution of light emitted by the respective LED chips, the light control means including at least one of a plurality of dents and a plurality of protrusions formed at positions where the LED chips are mounted and comprising the substrate per se formed with a light transmitting material, wherein the LED chips are respectively provided with a power-supplying electrode section made of a transparent conductor.

12. An LED luminaire comprising:

a resin molded substrate provided at least on one surface thereof with light distribution control means for controlling the distribution of light in a desired direction and with a wiring circuit in a desired pattern, and

a plurality of LED chips mounted at least on the one surface of the substrate respectively and connected to the wiring circuit and in correspondence to the light distribution control means and wiring circuit,

wherein the light distribution control means comprises at least one uneven surface of the substrate and wherein the LED chips are mounted on the uneven surface with each LED chip having a p-n junction plane disposed substantially in conformity to the desired direction of the light distribution, the light distribution control means comprising a first light distribution plate including the uneven surface of the substrate and a second light distribution plate including a prism lens plate disposed rotatable on a plane parallel to the substrate in front of the first light distribution plate.

13. An LED luminaire comprising:

a resin molded substrate provided at least on one surface thereof with light distribution control means for controlling the distribution of light in a desired direction and with a wiring circuit in a desired pattern, and

a plurality of LED chips mounted at least on said one surface of the substrate respectively as connected to the wiring circuit and in correspondence to the light distribution control means and wiring circuit,

wherein the light distribution control means comprises an uneven surface of a transparent resin layer, the uneven surface being disposed outer than the LED chips with respect to the substrate, the light distribution control means comprising a first light distribution plate that comprises a transparent resin layer having the uneven surface and a second light distribution plate of a prism lens plate disposed in parallel to the substrate in front of the first light distribution plate at least the second light distribution plate being rotatable on a plane parallel to the substrate.