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Fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications

  • US 6,331,257 B1
  • Filed: 11/30/1999
  • Issued: 12/18/2001
  • Est. Priority Date: 05/15/1998
  • Status: Expired due to Term
First Claim
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1. A process for making a micro-electro-mechanical switch on a substrate, comprising the steps ofa) depositing a first metal layer on a substrate to form an input line, an output line, a substrate bias electrode, a substrate bias pad, and an armature bias pad;

  • b) depositing a sacrificial layer on top of a first metal layer and the substrate;

    c) defining and delineating dimple molds in regions of the conducting line above the input line and output line. d) depositing a beam structural layer on top of a sacrificial layer to form a structure of an armature, wherein an end of the beam structural layer is affixed to the substrate near the output line;

    e) depositing a second metal layer on top of the structural layer to form a conducting transmission line and a suspended armature bias electrode; and

    f) removing the sacrificial layer to release the armature.

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