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Process of making a molded device

  • US 6,331,266 B1
  • Filed: 09/29/1999
  • Issued: 12/18/2001
  • Est. Priority Date: 09/29/1999
  • Status: Expired due to Term
First Claim
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1. A method of making a molded device comprising a plurality of micron or sub-micron size structural features, said method comprising the steps of:

  • providing a mold assembly having a mold section with a recess defining a mold cavity and having a silicon mold member disposed in said mold cavity, said silicon mold member having a mold surface with a contoured surface defining an impression of said device and said structural features facing said mold cavity;

    introducing a plastic material into said mold cavity to fill said mold cavity and said contoured surface in said silicon mold member to form said molded device having a body and molded surface corresponding to said contoured surface and said structural features;

    and removing said molded device from said mold section.

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