Area isolation type solid-state image pickup device for increasing the usage of the element formation surface of a semiconductor chip
First Claim
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1. An area isolation type solid-state image pickup device comprising:
- a semiconductor chip serving as an image pickup element with an image pickup area formed on an element formation of surface the semiconductor chip to correspond to an optical image configuration of a subject, said image pickup area including a first image pickup area corresponding to the optical image of the subject, and a second image pickup area different from the first image pickup area;
an element drive circuit and processing section formed on a section other than the image pickup area, the processing section being formed to process a signal obtained from the image pickup area; and
means for switching an image picked-up state from the first image pickup area to the second image pickup area, when an obtained subject image is displaced from the first image pickup area, and for switching the image picked-up state from the second image pickup area to the first image pickup area, when the obtained subject image from the second image pickup area coincides with an initially set image configuration.
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Abstract
An area-isolation type solid-state image pickup device is such that an image pickup area is formed on an element formation surface of a semiconductor chip in a way to correspond to an optical image configuration of a subject, the semiconductor chip serving as an image pickup element, and an element drive circuit area and signal processing circuit area formed on a section other than the image pickup area. By doing so it is possible to fully utilize elements on an element formation surface of a semiconductor chip without ruining the element and hence to improve an efficiency with which a semiconductor device is manufactured.
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Citations
6 Claims
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1. An area isolation type solid-state image pickup device comprising:
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a semiconductor chip serving as an image pickup element with an image pickup area formed on an element formation of surface the semiconductor chip to correspond to an optical image configuration of a subject, said image pickup area including a first image pickup area corresponding to the optical image of the subject, and a second image pickup area different from the first image pickup area;
an element drive circuit and processing section formed on a section other than the image pickup area, the processing section being formed to process a signal obtained from the image pickup area; and
means for switching an image picked-up state from the first image pickup area to the second image pickup area, when an obtained subject image is displaced from the first image pickup area, and for switching the image picked-up state from the second image pickup area to the first image pickup area, when the obtained subject image from the second image pickup area coincides with an initially set image configuration. - View Dependent Claims (2, 3)
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4. An area isolation type solid-state image pickup device comprising:
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a semiconductor chip serving as an image pickup element with an image pickup area formed on an element formation surface of the semiconductor chip to correspond to an optical image configuration of a subject, said image pickup area including a first image pickup area corresponding to the optical image of the subject, and a second image pickup area different from the first image pickup area;
an element drive circuit and processing section formed on a section of the image pickup device other than the image pickup area, the processing section being formed to process a signal obtained from the image pickup area; and
means for switching an image picked-up state from the first image pickup area to the second image pickup area, when an obtained subject image is displaced from the first image pickup area, and for switching the image picked-up state from the second image pickup area to the first image pickup area, when the subject image from the second image pickup area coincides with an initially set image configuration. - View Dependent Claims (5, 6)
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Specification