Emi shield with connector cover extension

• US 6,333,860 B1
• Filed: 03/20/2000
• Issued: 12/25/2001
• Est. Priority Date: 03/20/2000
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: 3Com Corporation (HP Inc.)
• Inventors: Cochrane, Michael, Oliphant, David, Madsen, Brent
• Primary Examiner(s): Abrams, Neil
• Assistant Examiner(s): DUVERNE, JEAN F
• Application Number:
  US09/528,502
• Time in Patent Office: 645 Days
• Field of Search: 439/640, 439/131, 439/946, 439/76.1, 439/945, 439/76, 439/638, 439/607-610, 361/683, 361/727, 361/816, 361/818, 361/736
• US Class Current: 361/818
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal
• CPC Class Codes: H01R 2201/06 for computer periphery
• CPC Class Codes: H01R 31/065 with built-in electric apparatus

Abstract

A communications card includes a housing formed by a top cover and a lower cover panel. The top cover is constructed from a generally non-conductive material and the lower cover panel is constructed from a conductive material. A substrate is disposed within the housing and a conductive panel is positioned between the substrate and the top cover. The conductive panel overlies at least a portion of the substrate, and the conductive panel and lower cover panel are electrically connected to ground when the communications card is inserted into a host device in order to decrease the electromagnetic radiation emitted by the communications card. Preferably, the communications card conforms to the standards established for a PCMCIA Type III card. Additionally, the communications card may include a modular jack with a main body portion having a top surface, a bottom outer surface and a front surface. A receptacle is disposed entirely within the front surface of the modular jack such that no portion of a corresponding plug extends through either the top surface or the bottom surface of the main body portion of the modular jack.

Claims

1. A communications card for insertion into a receiving slot in an electronic device, the communications card comprising:

a top cover including an upper surface, a right sidewall and a left sidewall that form a portion of a housing, the housing including an inner surface and an outer surface, the top cover being constructed from a generally non-conductive material;

a substrate disposed within the housing formed by the top cover, the substrate including a top surface, a bottom surface, a front end and a rear end;

a connector attached to the front end of the substrate, the connector being sized and configured to connect the communications card to the electronic device;

a conductive panel disposed between the substrate and the inner surface of the top cover, the conductive panel covering at least a portion of an upper surface of the connector, the conductive panel being sized and configured to decrease the emission of electromagnetic radiation from the communication card; and

a lower cover panel attached to the top cover, the lower cover panel being constructed of a conductive material and being electrically connected to the conductive panel.

2. The communications card as in claim 1, wherein the conductive panel overlies a substantial portion of the substrate in order to decrease the electromagnetic radiation emitted by the communications card.

3. The communications card as in claim 1, wherein the conductive panel and lower cover panel are electrically connected to ground when the communications card is inserted into the electronic device in order to decrease the electromagnetic radiation emitted by the communications card.

4. The communications card as in claim 1, wherein the conductive panel is attached to the inner surface of the top cover.

5. The communications card as in claim 1, wherein the conductive panel has generally the same size and configuration as at least a portion of the inner surface of the top cover.

6. The communications card as in claim 1, wherein the communications card conforms to the standards established for a PCMCIA Type III card.

7. The communications card as in claim 1, further comprising a insulator disposed between an inner surface of the conductive panel and the upper surface of the substrate, the insulator being sized and configured to prevent electrical communication between the conductive panel and the substrate.

8. The communications card as in claim 1, further comprising a modular jack for receiving a RJ-type connector plug attached to the top cover panel, the modular jack including a main body portion with a top surface, a bottom surface and a front surface;

and further comprising a receptacle disposed entirely within the front surface of the modular jack such that no portion of a corresponding RJ-type connector plug extends through either the top surface or the bottom surface of the main body portion of the modular jack.

9. The communications card as in claim 8, wherein the main body portion of the modular jack has a height measured from the top surface to the bottom surface that is generally equal to or less than about 10.5 mm.

10. The communications card as in claim 8, further comprising an upper inner surface of the receptacle and a lower inner surface of the receptacle that are separated by a distance that is generally equal to or less than about 10.1 mm.

21. The communications card as in claim 1, wherein the conductive panel closes at least a portion of a gap between the connector and the top cover.

22. The communications card as in claim 1, wherein the conductive panel provides protection for the upper surface of the connector from foreign object damage.

23. The communications card as in claim 1, wherein the conductive panel closes substantially the entire gap between the connector and the top cover.

24. The communications card as in claim 1, wherein the conductive panel covers substantially the entire upper surface of the connector.

11. A Type III PCMCIA card that is sized and configured to be electronically connected to a host device, the card comprising:

a dielectric top cover, the top cover including an inner surface and an outer surface;

a substrate including an upper surface, a lower surface, a front end and a rear end;

a connector attached to the front end of the substrate, the connector being sized and configured to connect the card to the host device; and

a conductive panel having generally the same size and configuration as at least a portion of the inner surface of the top cover, the conductive panel being disposed between the upper surface of the substrate and the inner surface of the top cover.

12. The Type III PCMCIA card as in claim 11, further comprising a lower cover panel that is attached to the top cover, the lower cover panel being constructed of a conductive material and being electrically connected to the conductive panel.

13. The Type III PCMCIA card as in claim 11, wherein the conductive panel overlies a substantial portion of the substrate in order to decrease the electromagnetic radiation emitted by the communications card.

14. The Type III PCMCIA card as in claim 11, wherein the conductive panel and lower cover panel are electrically connected to ground when the communications card is inserted into the electronic device in order to decrease the electromagnetic radiation emitted by the communications card.

15. The Type III PCMCIA card as in claim 11, further comprising a insulator disposed between an inner surface of the conductive panel and the upper surface of the substrate, the insulator being sized and configured to prevent electrical communication with the conductive panel.

16. The Type III PCMCIA card as in claim 11, further comprising a modular jack attached to the substrate, the modular jack having a height generally less than or equal to about 10.5 mm, the modular jack including a front face with an opening.

17. The Type III PCMCIA card as in claim 11, further comprising a modular jack attached to the top cover panel, the modular jack including a main body portion with a top surface, a bottom surface and a front surface;

and further comprising a receptacle disposed entirely within the front surface of the modular jack such that no portion of a corresponding plug extends through either the top surface or the bottom surface of the main body portion of the modular jack.

18. The Type III PCMCIA card as in claim 17, wherein the main body portion of the modular jack has a height measured from the top surface to the bottom surface that is generally equal to or less than about 10.5 mm.

19. The Type III PCMCIA card as in claim 17, further comprising an upper inner surface of the receptable and a lower inner surface of the receptacle that are separated by a distance that is generally equal to or less than about 10.1 mm.

20. A communications card comprising:

a dielectric top cover, the top cover including an inner surface and an outer surface;

a conductive panel disposed proximate the inner surface of the top cover, the conductive panel including an upper surface and a lower surface;

a substrate disposed proximate the lower surface of the conductive panel, the substrate including an upper surface, a lower surface, a front end and a rear end;

a connector attached to the front end of the substrate, the connector being sized and configured to connect the card to the host device; and

a conductive lower cover panel disposed proximate the lower surface of the substrate, the conductive lower cover panel being electrically connected to the conductive panel.

25. A Type III PCMCIA card that is sized and configured to be electronically connected to a host device, the card comprising:

a dielectric top cover, the top cover including an inner surface and an outer surface;

a substrate including an upper surface, a lower surface, a front end and a rear end;

a connector attached to the front end of the substrate, the connector being sized and configured to connect the card to the host device; and

a conductive panel having generally the same size and configuration as at least a portion of the inner surface of the top cover, the conductive panel being disposed between the upper surface of the substrate and the inner surface of the top cover, the conductive panel including an extension that covers at least a portion of an upper surface of the connector; and

a lower cover panel attached to the top cover, the lower cover panel being constructed of a conductive material and being electrically connected to the conductive panel;

wherein the conductive panel and lower cover panel are electrically connected to ground when the communications card is inserted into the host device in order to decrease the electromagnetic radiation emitted by the communications card.

26. The communications card as in claim 25, wherein the conductive panel and the extension close at least a portion of a gap between the connector and the top cover.

27. The communications card as in claim 25, wherein the extension provides protection for the upper surface of the connector from foreign object damage.

28. The communications card as in claim 25, wherein the conductive panel and the extension close substantially the entire gap between the connector and the top cover.

29. The communications card as in claim 25, wherein the extension covers substanially the entire upper surface of the connector.

30. The communication card as in claim 25, further comprising a insulator disposed between an inner surface of the conductive panel and the upper surface of the substrate, the insulator being sized and configured to prevent electrical communication between the conductive panel and the substrate.

31. The communications card as in claim 25, further comprising a modular jack for receiving a RJ-type connector plug attached to the top cover panel, the modular jack including a main body portion with a top surface, a bottom surface and a front surface;

and further comprising a receptable disposed entirely within the front surface of the modular jack such that no portion of a corresponding RJ-type connector plug extends through either the top surface of the bottom surface of the main body portion of the modular jack.

32. The communications card as in claim 31, wherein the main body portion of the modular jack has a height measured from the top surface to the bottom surface that is generally equal to or less than about 10.5 mm.

33. The communications card as in claim 31, further comprising an upper inner surface of the receptacle and a lower inner surface of the receptacle that are separated by a distance that is generally equal to or less than about 10.1 mm.