High density integrated circuit apparatus, test probe and methods of use thereof

• US 6,334,247 B1
• Filed: 06/11/1997
• Issued: 01/01/2002
• Est. Priority Date: 10/19/1992
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: International Business Machines Corporation
• Inventors: Fogel, Keith Edward, Norcott, Maurice Heathcote, Lauro, Paul Alfred, Shih, Da-Yuan, Walker, George Frederick, Beaman, Brian Samuel
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/872,519
• Time in Patent Office: 1,665 Days
• Field of Search: 298/27, 298/50, 298/46, 298/29, 298/42, 298/43, 298/40, 174/261, 174/254, 361/772, 361/776
• US Class Current: 29/842
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/0675 Needle-like
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45155 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/78301 : Capillary
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/85214 : using a laser
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5384 : Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/20759 : larger or equal to 90 microns less than 100 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y10S 29/029 : Molding with other step
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path
• CPC Class Codes: Y10T 29/49192 : with insulation removal
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Claims

1. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said bondable locations;

drawing said wire away from said bondable location and holding an end of said wire in place, while said wire is held in place forming a notch in said wire with a knife edge;

said notch is formed at a selected location on said wire;

pulling said wire to break said wire at said notch leaving a free-standing wire bonded at one end to said bondable location;

said wire projecting away from said surface and terminating in a free end;

said wire has a predetermined shape permitting said free end to wipe a surface of an electrical contact against which said free end is pressed as said surface is moved toward said surface of said electrical contact;

said wire and said free end have an original position, said wire and said predetermined shape permit said free end and said wire as said free end is pressed against said surface of said electrical contact to move away from said original position and permits said wire and said free end to substantially return to said original position when said free end is retracted from being pressed against said surface of said electrical contact.

2. A method according to claim 1 wherein said free-standing wire is nonlinear.

3. A method according to claim 1 wherein said wire has a linear portion.

4. A method according to claim 1 wherein said wire has a linear portion making a nonorthogonal angle to said surface.

5. A method according to claim 1 wherein said bondable location is a wire bondable location.

6. A method according to claim 5 wherein said wire is bonded with a wire bonding tool.

7. A method according to claim 6 wherein said wire bonding tool is drawn away from said surface to form a desired shape to said wire.

8. A method according to claim 7 wherein said end is cut with a knife edge to form said cut end.

9. A method of claim 1 wherein a plurality of wires are bonded to a plurality of bondable locations to form a plurality of free-standing wires.

10. A method according to claim 9 further including disposing a mold to surround said plurality of free-standing wires.

11. A method according to claim 10, further including:

adding to said mold a curable compound to form a cured compound removing said mold to leave said plurality of free-standing wires embedded in said cured compound.

12. A method according to claim 1, wherein said wire is formed to have a predetermined shape, said predetermined shape permits said probe tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved towards said electronic device.

15. A method according to claim 1 further including:

pressing said free end against said surface of said electrical contact so that said free end moves away from said original position, and retracting said free end from contacting said electrical contact so that said free end substantially returns to said original position.

63. A method according to claim 1 or 15, wherein said surface has a perimeter, said free end is positioned with respect to said surface so that a perpendicular line from said free end intersects said surface within said perimeter.

13. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of bondable locations by the same type of bond to form an apparatus comprising a plurality of wires projecting away from said surface, the end of each wire comprising a tip;

forming each of said wires into a predetermined shape;

said predetermined shape permits said tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved towards said contact.

14. A method according to claim 13 further including:

pressing said tip against said surface of said electrical contact so that said tip wipes said surface of said electrical contact.

71. A method according to claim 13 or 14, wherein said surface has a perimeter, said tip is positioned with respect to said surface so that a perpendicular line from said tip intersects said surface within said perimeter.

16. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of said bondable locations by the same type bonding operation;

drawing said wire away from said bondable location and holding an end of said wire in place, forming a notch at a selected location in said wire, pulling said wire while said wire is held in place to break said wire at said notch to form a dangling end;

said wire projecting away from said surface and terminating in said dangling end;

said wire has a predetermined shape permitting said dangling end to wipe a surface of an electrical contact against which said dangling end is pressed as said surface of said electrical contact is moved toward said electrical contact;

said wire and said dangling end have an original position, said wire and said predetermined shape permit said dangling end and said wire as said dangling end is pressed against said surface of said electrical contact to move away from said original position and permits said wire and said dangling end to substantially return to said original position when said dangling end is retracted from being pressed against said surface of said electrical contact.

17. A method according to claim 16 wherein said dangling end is formed by cutting said wire leaving a free-standing wire bonded at one end to said bondable location.

18. A method according to claim 16 wherein said wire is a free-standing wire which is nonlinear.

19. A method according to claim 16 wherein said wire has a linear portion.

20. A method according to claim 16 wherein said wire has a linear portion making a nonorthogonal angle to said surface.

21. A method according to claim 16 wherein said bondable location is a wire bondable location.

22. A method according to claim 21 wherein said wire is bonded with a wire bonding tool.

23. A method according to claim 22 wherein said wire bonding tool is drawn away from said surface to form a desired shape to said wire.

24. A method according to claim 23 wherein said dangling end is formed by cutting said wire with a knife edge to form said dangling end.

25. A method of claim 16 wherein a plurality of wires are bonded to a plurality of bondable locations to form a plurality of free-standing wires.

26. A method according to claim 25 further including disposing a mold to surround said plurality of free-standing wires.

27. A method according to claim 26, further including:

adding to said mold a curable compound to form a cured compound and removing said mold to leave said plurality of free-standing wires embedded in said cured compound.

28. A method according to claim 16 wherein said bonding operation is selected from the group consisting of wire bonding, solder bonding and laser welding.

29. A method according to claim 16, wherein said wire is formed to have a predetermined shape, said predetermined shape permits said probe tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved towards said electronic device.

30. A method according to claim 16 further including:

pressing said dangling end against said surface of said electrical contact so that said dangling end moves away from said original position, and retracting said dangling end from contacting said surface of said electrical contact so that said dangling end substantially returns to said original position.

33. A method according to claim 25, wherein said wire is formed to have a predetermined shape, said predetermined shape permits said probe tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved towards said electronic device.

64. A method according to claim 16 or 30, wherein said surface has a perimeter, said dangling end is positioned with respect to said surface so that a perpendicular line from said dangling end intersects said surface within said perimeter.

31. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of bondable locations by the same type of bond to form an electronic device probe, said wire has an end which is bonded to said bondable location, thereafter said wire is pulled away from said bondable location and thereafter said wire is severed at a selected location at a second end to form a free-standing wire bonded to said bondable location, said wire is severed by forming a notch in said wire with a knife edge clamping said wire and pulling said wire to bread said wire at said notch;

said wire has a predetermined shape permitting said second end to wipe a surface of an electrical contact against which said second end is pressed as said surface is moved toward said surface of said electrical contact;

said wire and said second end have an original position, said wire and said predetermining shape permit said second end and said wire as said second end is pressed against said surface of said electrical contact to move away from said original position and permits said wire and said second end to substantially return to said original position when said second end is retracted from being pressed against said surface of said electrical contact.

32. A method according to claim 31 further including electrically probing an electronic device with said electronic device probe.

34. A method according to claim 31 further including:

pressing said second end against said surface of said electrical contact so that said second end moves away from said original position, and retracting said second end from being pressed against said surface of said electrical contact so that substantially returns to said original position.

65. A method according to claim 31 or 34, wherein said surface has a perimeter, said second end is positioned with respect to said surface so that a perpendicular line from said second end intersects said surface within said perimeter.

35. A method of making a probe for probing an electronic device comprising:

providing a surface that has a plurality of locations;

bonding a wire to each of said bondable location to form a plurality of bonded wires;

drawing said wire away from said bondable location and shaping said wire to have a predetermined shape;

severing each of said wires at a selected location to result in a plurality of a free-standing wires bonded at one end to said bondable location;

said wire projecting away from said surface and terminating at a terminal end;

said predetermined shape permits said terminal end to wipe a surface of an electrical contact against which said terminal end is pressed as said surface is moved toward said electrical contact;

said wire and said terminal end have an original position, said wire and said predetermined shape permit said terminal end and said wire as said terminal end is pressed against said surface of said electrical contact to move away from said original position and permits said wire and said terminal end to substantially return to said original position when said terminal end is retracted from being pressed against said surface of said electrical contact.

36. A method according to claim 35 further including:

pressing said terminal end against said surface of said electrical contact so that said terminal end moves away from said original position, and retracting said terminal end from being pressed against said surface of said electrical contact so that said wire and said terminal end substantially returns to said original position.

66. A method according to claim 35 or 36, wherein said surface has a perimeter, said terminal end is positioned with respect to said surface so that a perpendicular line from said terminal end intersects said surface within said perimeter.

37. A method for making a probe for probing an electronic device comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of said bondable locations by the same type bonding operation;

drawing said wire away from said bondable location, shaping said wire to have a predetermined shape and severing said wire at a selected location to form a dangling end;

said wire projecting away from said surface and terminating in said dangling end;

said predetermined shape permits said dangling end to wipe a surface of an electrical contact against which said dangling end is pressed as said surface is moved towards said electrical contact;

said wire and said dangling end have an original position, said wire and said predetermined shape permit said dangling end and said wire as said dangling end is pressed against said surface of said electrical contact to move away from said original position permitting said dangling end and said wire to substantially return to said original position when said dangling end is retracted from being pressed against said surface of said electrical contact.

38. A method according to claim 37 further including:

pressing said dangling end against said surface of said electrical contact so that said dangling end moves away from said original position, and retracting said dangling end from pressing against said surface of said electrical contact so that said dangling end substantially returns to said original position.

67. A method according to claim 37 or 38, wherein said surface has a perimeter, said dangling end is positioned with respect to said surface so that a perpendicular line from said dangling end intersects said surface within said perimeter.

39. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire of selected length to each of said plurality of bondable locations by the same type of bond to form an electronic device probe comprising a plurality of wires projecting away from said surface terminating in a terminal end;

forming each of said wires into a predetermined shape;

said predetermined shape permits said terminal end to wipe a surface of an electrical contact against which said terminal end is pressed as said surface is moved towards said surface of said electrical contact;

said wire and said terminal end have an original position, said wire and said predetermined shape permit said terminal end and said wire as terminal end is pressed against said surface of said electrical contact to move away from said original position and permits said terminal end and said wire to substantially return to said original position when said terminal end is retracted from being pressed against said surface.

40. A method according to claim 39 further including:

pressing said terminal end against said surface of said electrical contact so that said terminal end moves away from said original position, and retracting said terminal end from pressing against said surface of said electrical contact so that said terminal end and said wire substantially returns to said original position.

68. A method according to claim 39 or 40, wherein said surface has a perimeter, said terminal end is positioned with respect to said surface so that a perpendicular line from said terminal end intersects said surface within said perimeter.

41. A method of making an apparatus for making electrical contact to a device comprising:

providing a surface that has a plurality of locations;

bonding a wire to each of said bondable location to form a plurality of bonded wires;

drawing said wire away from said bondable location and shaping said wire to have a predetermined shape;

severing each of said wires at a selected location to result in a plurality of a free-standing wire bonded at one end to said bondable location;

said wire projecting away from said surface and terminating at severed end;

said severed ends comprise tips;

moving said apparatus towards said device;

said predetermined shape permits said tips to wipe the surface of an electrical contact against which said tip is pressed as said surface is moved toward said device.

42. A method according to claim 41 further including:

pressing said tip against said surface of said electrical contact so that said tip wipes said surface of said electrical contact.

69. A method according to claim 41 or 42, wherein said surface has a perimeter, said tip is positioned with respect to said surface so that a perpendicular line from said tip intersects said surface within said perimeter.

43. A method for making an apparatus for making electrical contact to a device comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of said bondable locations by the same type bonding operation;

drawing said wire away from said bondable location, severing said wire at a selected location and shaping said wire to have a predetermined shape to form a dangling end;

said dangling ends comprise tips;

said wire projecting away from said surface and terminating in said dangling end;

said predetermined shape permits said tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved toward said contact.

44. A method according to claim 43 further including:

pressing said tip against said surface of said electrical contact so that said tip wipes said surface of said electrical contact.

70. A method according to claim 43 or 44, wherein said surface has a perimeter, said tip is positioned with respect to said surface so that a perpendicular line from said tip intersects said surface within said perimeter.

45. A method for making an apparatus for making electrical contact to a device comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of said bondable locations by the same type bonding operation;

drawing said wire away from said bondable location and shaping said wire to have a predetermined shape to form a dangling end;

said dangling ends comprise tips;

said wire projecting away from said surface and terminating in said dangling end;

moving said wire out of a wire supply and moving said wire supply with respect to said bondable location by moving said wire supply with respect to said surface in a direction both perpendicular to said surface and in a direction parallel to said surface to shape said wire to have a predetermined shape;

severing each of said wires at a selected location to result in a plurality of free-standing wires having said predetermined shape bonded at one end to said bondable location;

said wire projecting away from said surface and terminating at said severed end;

said severed ends comprise probe tips;

said predetermined shape permits said probe tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved toward said electronic device.

46. A method according to claim 45 further including:

pressing said probe tip against said surface of said electrical contact so that said probe tip wipe the surface of said electrical contact.

72. A method according to claim 45 or 46, wherein said surface has a perimeter, said probe tip is positioned with respect to said surface so that a perpendicular line from said probe tip intersects said surface within said perimeter.

47. A method of making a probe for probing an electronic device comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said bondable location to form a plurality of bonded wires;

moving said wire out of a wire supply and moving said wire supply with respect to said bondable location by moving said wire supply with respect to said surface in a direction both perpendicular to said surface and in a direction parallel to said surface to shape said wire to have a predetermined shape;

severing each of said wires at a selected location to result in a plurality of free-standing wires having said predetermined shape bonded at one end to said bondable location;

said wire projecting away from said surface and terminating at said severed end;

said severed ends comprise probe tips;

said predetermined shape permits said probe tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved toward said electronic device.

48. A method according to claim 47 further including:

pressing said probe tip against said surface of said electrical contact so that said probe tip wipes the surface of said electrical contact.

73. A method according to claim 47 or 48, wherein said surface has a perimeter, said probe tip is positioned with respect to said surface so that a perpendicular line from said probe tip intersects said surface within said perimeter.

49. A method for making a probe for probing an electronic device comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of said bondable locations by the same type bonding operation;

moving said wire out of a wire supply and moving said wire supply with respect to said bondable location by moving said wire supply with respect to said surface in a direction both perpendicular to said surface and in a direction parallel to said surface to shape said wire to have a predetermined shape and severing said wire at a selected location to form a dangling end;

said dangling ends comprise probe tips;

said wire projecting away from said surface and terminating in said dangling end;

said predetermined shape permits said probe tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved towards said electronic device.

50. A method according to claim 49 further including:

pressing said probe tip against said surface of said electrical contact so that said probe tip wipes the surface of said electrical contact.

74. A method according to claim 49 or 50, wherein said surface has a perimeter, said probe tip is positioned with respect to said surface so that a perpendicular line from said probe tip intersects said surface within said perimeter.

51. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of bondable locations by the same type of bond to form an electronic device probe comprising a plurality of wires projecting away from said surface, the end of each wire comprising a probe tip;

forming each of said wires into a predetermined shape by moving said wire out of a wire supply and moving said wire supply with respect to said bondable location by moving said wire supply with respect to said surface in a direction both perpendicular to said surface and in a direction parallel to said surface to shape said wire to have said predetermined shape;

severing said wire at a selected location;

said predetermined shape permits said probe tips to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved towards said electronic device.

52. A method according to claim 51 further including:

pressing said probe tip against said surface of said electrical contact so that said probe tip wipes the surface of said electrical contact.

75. A method according to claim 51 or 52, wherein said surface has a perimeter, said probe tip is positioned with respect to said surface so that a perpendicular line from said probe tip intersects said surface within said perimeter.

53. A method of making an apparatus for making electrical contact to a device comprising:

providing a surface that has a plurality of locations;

bonding a wire to each of said bondable location to form a plurality of bonded wires;

moving said wire out of a supply and moving said wire supply with respect to said bondable location by moving said wire supply with respect to said surface in a direction both perpendicular to said surface and in a direction parallel to said surface to shape said wire to have a predetermined shape;

severing each of said wires at a selected location to result in a plurality of a free-standing wire each bonded at one end to said bondable location;

said wire projecting away from said surface and terminating at a severed end;

said severed ends comprise tips;

said predetermined shape permits said tip to wipe the surface of an electrical contact against which said tip is pressed as said surface is moved toward said device.

54. A method according to claim 53 further including:

pressing said probe tip against said surface of said electrical contact so that said probe tip wipes the surface of said electrical contact.

76. A method according to claim 53 or 54, wherein said surface has a perimeter, said probe tip is positioned with respect to said surface so that a perpendicular line from said probe tip intersects said surface within said perimeter.

55. A method for making an apparatus for making electrical contact to a device comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of said bondable locations by the same type bonding operation;

moving said wire out of a wire supply and moving said wire supply with respect to said bondable location by moving said wire supply with respect to said surface in a direction both perpendicular to said surface and in a direction parallel to said surface to shape said wire to have a predetermined shape and severing said wire at a selected location to form a dangling end;

said dangling ends comprise tips;

said wire projecting away from said surface and terminating in said dangling end;

said predetermined shape permits said tip to wipe the surface of an electrical contact against which said tip is pressed as said surface is moved towards said device.

56. A method according to claim 55 further including:

pressing said probe tip against said surface of said electrical contact so that said probe tip wipes the surface of said electrical contact.

77. A method according to claim 55 or 56, wherein said surface has a perimeter, said probe tip is positioned with respect to said surface so that a perpendicular line from said probe tip intersects said surface within said perimeter.

78. A method according to claim 55 or 58, wherein said surface has a perimeter, said probe tip is positioned with respect to said surface so that a perpendicular line from said probe tip intersects said surface within said perimeter.

57. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire of selected length to each of said plurality of bondable locations by the same type of bond to form an apparatus comprising a plurality of wires projecting away from said surface, the end of each wire comprising a tip;

forming each of said wires into a predetermined shape by moving said wire out of a wire supply and moving said wire supply with respect to said bondable location by moving said wire supply with respect to said surface in a direction both perpendicular to said surface and in a direction parallel to said surface to shape said wire into said predetermined shape;

said predetermined shape permits said tip to wipe the surface of an electrical contact against which said probe tip is pressed as said surface is moved towards said contact.

58. A method according to claim 57 further including:

pressing said probe tip against said surface of said electrical contact so that said probe tip wipes the surface of said electrical contact.

59. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of bondable locations to form an electronic device probe comprising a plurality of wires of selected length projecting away from said surface terminating in a terminal end;

forming each of said wires into a predetermined shape;

said predetermined shape permits said terminal end to wipe a surface of an electrical contact against which said terminal end is pressed as said surface is moved towards said surface of said electrical contact;

said wire and said terminal end have an original position, said wire and said predetermined shape permit said terminal end and said wire as terminal end is pressed against said surface of said electrical contact to move away from said original position and permits said terminal end and said wire to substantially return to said original position when said terminal end is retracted from being pressed against said surface.

60. A method according to claim 59 further including:

pressing said terminal end against said surface of said electrical contact so that said terminal end moves away from said original position, and retracting said terminal end from pressing against said surface of said electrical contact so that said terminal end and said wire substantially returns to said original position.

79. A method according to claim 59 or 60, wherein said surface has a perimeter, said terminal end is positioned with respect to said surface so that a perpendicular line from said terminal end intersects said surface within said perimeter.

61. A method comprising:

providing a surface that has a plurality of bondable locations;

bonding a wire to each of said plurality of bondable locations to form an electrical device comprising a plurality of wires of selected length projecting away from said surface terminating in a terminal end;

forming each of said wires into a predetermined shape;

said predetermined shape permits said terminal end to wipe a surface of an electrical contact against which said terminal end is pressed as said surface is moved towards said surface of said electrical contact;

said wire and said terminal end have an original position, said wire and said predetermined shape permit said terminal end and said wire as terminal end is pressed against said surface of said electrical contact to move away from said original position and permits said terminal end and said wire to substantially return to said original position when said terminal end is retracted from being pressed against said surface.

62. A method according to claim 61 further including:

pressing said terminal end against said surface of said electrical contact so that said terminal end moves away from said original position and retracting said terminal end from pressing against said surface of said electrical contact so that said terminal end and said wire substantially returns to said original position.

80. A method according to claim 61 or 62, wherein said surface has a perimeter, said terminal end is positioned with respect to said surface so that a perpendicular line from said terminal end intersects said surface within said perimeter.