Chemical mechanical polishing in-situ end point system
First Claim
Patent Images
1. A method of monitoring the polishing of thin films comprising:
- periodically monitoring a reflected optical spectrum from random locations of a polished face of a workpiece to produce monitored data, recording said monitored data;
analyzing said monitored data to determine differences between separate monitored data points of said monitored data; and
stopping said polishing when a depth of one of said monitored data points is below a predetermined criterion.
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Abstract
A structure and method for polishing a device include oscillating a carrier over an abrasive surface (the carrier bringing a polished surface of the device into contact with the abrasive surface, the oscillating allowing a portion of the polished surface to periodically oscillate off the abrasive surface), optically determining a reflective measure of a plurality of locations of the polished surface as the portion of the device oscillates off the abrasive surface and calculating depths of the locations of the polished surface based of the reflective measure.
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Citations
27 Claims
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1. A method of monitoring the polishing of thin films comprising:
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periodically monitoring a reflected optical spectrum from random locations of a polished face of a workpiece to produce monitored data, recording said monitored data;
analyzing said monitored data to determine differences between separate monitored data points of said monitored data; and
stopping said polishing when a depth of one of said monitored data points is below a predetermined criterion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of polishing a device comprising:
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oscillating a carrier over an abrasive surface, said carrier bringing a polished surface of said device into contact with said abrasive surface, said oscillating allowing a portion of said polished surface to periodically oscillate off said abrasive surface;
optically determining a reflective measure of a plurality of random locations of said polished surface as said portion of said device oscillates off said abrasive surface;
calculating depths of said locations of said polished surface based on said reflective measure, wherein said optically determining includes supplying a light source and said calculating includes removing a pattern of said light source from said reflective measure; and
stopping said polishing when a depth of one of said locations is below a predetermined criterion. - View Dependent Claims (11, 12, 13, 14, 15)
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16. An apparatus for polishing a device having a polished surface, said apparatus comprising:
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an abrasive surface;
a carrier bringing said polished surface into contact with said abrasive surface, said carrier oscillating such that portions of said polished surface periodically oscillate off said abrasive surface;
an optical probe for determining a reflective measure of a plurality of random locations of said polished surface as said portions of said polished surface oscillate off said abrasive surface; and
a computer for calculating a depth of said polished surface based on said reflective measure, wherein said computer stops said polishing when a depth of one of said locations is below a predetermined criterion. - View Dependent Claims (17, 18, 19, 20, 21)
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22. An apparatus for polishing a device comprising:
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means for polishing a polished surface of said device against an abrasive surface, said polishing means allowing a portion of said polished surface to periodically oscillate off said abrasive surface;
means for optically determining a reflective measure of a plurality of random locations of said polished surface as said portion of said polished surface oscillates off said abrasive surface;
means for calculating a depth of said locations of said polished surface based of said reflective measure; and
means for stopping said polishing when a depth of one of said locations is below a predetermined criterion. - View Dependent Claims (23, 24, 25, 26, 27)
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Specification