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Modified polyimide resin and thermosetting resin composition containing the same

  • US 6,335,417 B1
  • Filed: 08/17/2000
  • Issued: 01/01/2002
  • Est. Priority Date: 01/14/1998
  • Status: Expired due to Term
First Claim
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1. A polyimide resin represented by Formula (2):

  • embedded imagewhereinR1 represents a residue obtainable by removing all the carboxyl groups from an organic compound having 4 carboxyl groups, R2 represents a residue obtainable by removing all the isocyanate groups from an organic compound having 2 isocyanate groups, and R3 represents a residue obtainable by removing the hydroxyl group from a hydroxyl-terminal polybutadiene;

    L1 represent the ratio of the number of the component polybutadiene units and M1 the ratio of the number of the component polyimide units, respectively, to the total number of both L1 and M1; and

    n1 1 to 10,000, provided that L1+M1=1, 0<

    L1<

    1,0<

    M1<

    1.

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