×

Method and system for analyzing wafer processing order

  • US 6,336,086 B1
  • Filed: 12/14/1998
  • Issued: 01/01/2002
  • Est. Priority Date: 08/13/1998
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for analyzing a process for forming a plurality of objects, the process having a plurality of processing steps, the method comprising the steps of:

  • (a) extracting a plurality of data representing characteristics of each object;

    (b) identify a first order pattern in any one of the processing steps using a decision tree, based on the data representing characteristics;

    (c) identifying a second order pattern in any one of the processing steps by comparing the data representing characteristics to a predetermined threshold;

    (d) identifying a third order pattern in any one of the processing steps based on a calculated distance from a centroid computed from the data representing characteristics;

    (e) selecting one of the first, second, and third order patterns, and identifying one of the processing steps as being associated with the selected order pattern.

View all claims
  • 9 Assignments
Timeline View
Assignment View
    ×
    ×