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Cleaning/drying station and production line for semiconductor devices

  • US 6,336,463 B1
  • Filed: 03/30/1999
  • Issued: 01/08/2002
  • Est. Priority Date: 03/31/1998
  • Status: Expired due to Term
First Claim
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1. A cleaning/drying system comprising a first cleaning device for cleaning a wafer by using an HF cleaning solution, a second cleaning device for cleaning a wafer by using a non-HF cleaning solution, a high-performance drying device for drying a wafer, and a high-speed drying device for cleaning a wafer at a higher-speed and with a lower degree of drying by said high-performance drying device, said first cleaning device or said second cleaning device being selected based on desired conditions for cleaning, said high-performance drying device or said high-speed drying device being selected based on desired conditions for drying.

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