Multichip semiconductor device
First Claim
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1. A multichip semiconductor device, comprising:
- a first semiconductor chip having a field-programmable gate array circuit portion;
a second semiconductor chip having a programmable non-volatile memory for storing setting information about how to set a circuit of the field-programmable gate array circuit portion;
an external connection terminal formed on the first semiconductor chip;
a switch circuit formed on the first semiconductor chip and connected to the external connection terminal;
an input/output line for connecting the switch circuit and the field-programmable gate array circuit portion to each other;
a first connecting member for connecting the field-programmable gate array circuit portion and the non-volatile memory to each other;
a second connecting member for connecting the switch circuit and the non-volatile memory to each other; and
a setting information protecting mechanism for switching the switch circuit to the second state so as to disconnect the external connection terminal from the non-volatile memory permanently after the setting information has been stored in the non-volatile memory by being fed thereto from the external connection terminal through the switch circuit and the second connecting member, wherein the switch circuit can be switched between a first state connected to the second connecting member and a second state connected to the field-programmable gate array circuit portion, and the setting information about how to set the circuit of the field-programmable gate array circuit portion is written to the non-volatile memory by way of the second connecting member when the switch circuit is in the first state.
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Abstract
A multichip semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to each other so as to form a chip-on-chip structure. The first semiconductor chip has a field-programmable gate array circuit and a switch circuit formed thereon. The second semiconductor chip has a non-volatile configuration memory circuit formed thereon for storing the setting information about how to set the circuit of the field-programmable gate array circuit.
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Citations
2 Claims
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1. A multichip semiconductor device, comprising:
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a first semiconductor chip having a field-programmable gate array circuit portion;
a second semiconductor chip having a programmable non-volatile memory for storing setting information about how to set a circuit of the field-programmable gate array circuit portion;
an external connection terminal formed on the first semiconductor chip;
a switch circuit formed on the first semiconductor chip and connected to the external connection terminal;
an input/output line for connecting the switch circuit and the field-programmable gate array circuit portion to each other;
a first connecting member for connecting the field-programmable gate array circuit portion and the non-volatile memory to each other;
a second connecting member for connecting the switch circuit and the non-volatile memory to each other; and
a setting information protecting mechanism for switching the switch circuit to the second state so as to disconnect the external connection terminal from the non-volatile memory permanently after the setting information has been stored in the non-volatile memory by being fed thereto from the external connection terminal through the switch circuit and the second connecting member, wherein the switch circuit can be switched between a first state connected to the second connecting member and a second state connected to the field-programmable gate array circuit portion, and the setting information about how to set the circuit of the field-programmable gate array circuit portion is written to the non-volatile memory by way of the second connecting member when the switch circuit is in the first state. - View Dependent Claims (2)
wherein the first and second semiconductor chips are bonded together by superposing the second semiconductor chip on and bonding it to a surface of the first semiconductor chip so as to form a chip-on-chip structure as a whole.
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Specification