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Method and apparatus for sputtering thin films

  • US 6,338,777 B1
  • Filed: 10/23/1998
  • Issued: 01/15/2002
  • Est. Priority Date: 10/23/1998
  • Status: Expired due to Fees
First Claim
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1. A method for depositing a thin film comprising the steps of:

  • applying a pulsed negative bias voltage to a substrate in a sputtering chamber;

    powering at least first and second sputtering electrodes positioned on a first side of the sputtering chamber with an alternating current power source having a frequency of 10 kHz to 400 kHz connected between the first and second sputtering electrodes to sequentially drive each sputtering electrode as an anode then as a cathode, each of the first and second sputtering electrodes having a sputtering target material attached thereto;

    powering at least third and fourth sputtering electrodes positioned on a second opposite side of the sputtering chamber with an alternating current power source having a frequency of 10 kHz to 400 kHz connected between the third and fourth sputtering electrodes to sequentially drive each of the third and fourth sputtering electrodes as an anode then as a cathode, each of the third and fourth sputtering electrodes having the sputtering target material attached thereto;

    contemporaneously executing the step of applying a pulsed negative bias voltage to the substrate and the steps of powering the first, second, third and fourth sputtering electrodes, and;

    supplying a gas of a first substance to serve as a sputtering gas in the sputtering chamber while powering the sputtering electrodes;

    wherein each of the third and fourth sputtering electrodes having a sputtering target material attached thereto and being arranged so that the third sputtering electrode confronts the first sputtering electrode, the powering of the third sputtering electrode occurring to drive the third sputtering electrode as an anode when the first sputtering electrode is being driven as a cathode.

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