Multilayer printed circuit board and the manufacturing method

• US 6,339,197 B1
• Filed: 05/26/2000
• Issued: 01/15/2002
• Est. Priority Date: 05/27/1999
• Status: Expired due to Term

• Current Assignee: Hoya Corporation
• Original Assignee: Hoya Corporation
• Inventors: Kagatsume, Takeshi, Fushie, Takashi, Matsui, Shigekazu
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): PATEL, ISHWARBHAI B
• Application Number:
  US09/579,270
• Time in Patent Office: 599 Days
• Field of Search: 174/262, 174/255, 174/256, 174/264, 174/257, 174/258, 174/261, 174/265, 174/259, 174/260, 361/803, 361/792, 361/793, 361/795, 361/760, 428/209, 428/210
• US Class Current: 174/262
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2201/0959 Plated through-holes or plated blind vias filled with insulating material
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: H05K 3/426 initial plating of through-holes in substrates without metal
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4605 made from inorganic insulating material
• CPC Class Codes: H05K 3/467 Adding a circuit layer by thin film methods H05K3/4647 takes precedence
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by photolithography, a sputtering silicon oxide layer and a sputtering silicon nitride layer are formed to prevent leak of alkali metal ions from the photosensitive glass, a sputtering chromium layer, a sputtering chromium-copper layer and a sputtering copper layer are formed to enhance the adhesion strength between the copper film and the sputtering silicon oxide layer, and a copper film of 1 to 20 μm thick is formed. With resin filled into the interior of the through hole, a wiring layer is patterned by etching, an insulating layer is formed, and the surface is covered with a surface treatment layer and a cover coat.

Claims

1. A multilayer printed wiring board comprising:

glass substrate having a through hole connecting opposite surfaces thereof,

a plurality of insulating layers and wiring layers formed respectively on each of on the surfaces of said glass substrate; and

a conducting portion having a conductive film formed on an inner wall surface of the through hole and providing conductor connection between the opposite surfaces of said glass substrate,

wherein the conductive film has a thickness of 1 to 20 μ

m.

2. The multilayer printed wiring board according to claim 1 wherein, on each side of the board, an outermost one of the insulating layers and an outermost one of the wiring layers comprise surface conducting areas;

whereby contacts of a chip are connectable to the surface conducting areas.

3. The multilayer printed wiring board according to claim 1, wherein the substrate comprises glass modified to have a coefficient of thermal expansion close to that of metal, whereby disconnection of the wiring layers is prevented.

4. The multilayer printed wiring board according to claim 3, wherein the substrate comprises crystalized glass, whereby the wiring board has the coefficient of thermal expansion close to that of metal, whereby disconnection of the wiring layers is prevented.

9. The multilayer printed wiring board according to claim 1 or 5, wherein the conductive film comprises a film continuous with the wiring layer.

10. The multilayer printed wiring board according to claim 1 or 5, wherein the wiring layer has a land width of 10 μ

m or less.

11. The multilayer printed wiring board according to claim 1 or 5, wherein the through hole is filled with a protective film.

12. The multilayer printed wiring board according to claim 1 or 5, wherein the through hole has a diameter of 30 to 150 μ

m.

13. The multilayer printed wiring board according to claim 1 or 5, wherein the surfaces of the glass substrate and at least part of the wall surface of the through hole are covered with an ion blocking layer mainly comprising an insulating film.

14. The multilayer printed wiring board according to claim 1 or 5, wherein an adhesion-reinforcing layer is interposed between the wiring layer and the glass substrate to enhance force of adhesion between the wiring layer and the glass substrate.

15. The multilayer printed wiring board according to claim 1 or 5, wherein the glass substrate comprises photosensitive glass.

16. The multilayer printed wiring board according to claim 1 or 5, wherein a wiring pattern formed of the wiring layer has a line width of 3 to 50 μ

m.

5. A multilayer printed wiring board comprising:

a glass substrate having a through hole connecting opposite surfaces thereof;

a plurality of insulating layers and wiring layers formed respectively on each of the surfaces of said glass substrate; and

a conducting portion having a conductive film formed on an inner wall surface of the through hole and providing conductor connection between the opposite surfaces of said glass substrate,

wherein a protective layer is formed so as to cover at least the conductive film.

6. The multilayer printed wiring board according to claim 5 wherein, on each side of the board, an outermost one of the insulating layers and an outermost one of the wiring layers comprise surface conducting areas;

whereby contacts of a chip are connectable to the surface conducting areas.

7. The multilayer printed wiring board according to claim 5, wherein the substrate comprises glass modified to have a coefficient of thermal expansion close to that of metal, whereby disconnection of the wiring layers is prevented.

8. The multilayer printed wiring board according to claim 7, wherein the substrate comprises crystalized glass, whereby the wiring board has the coefficient of thermal expansion close to that of metal, whereby disconnection of the wiring layers is prevented.